Manufacture or treatment of devices or systems in or on a substrate

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS

B81C1/00Manufacture or treatment of devices or systems in or on a substrate

B81C1/00007Assembling automatically hinged components B81C1/00015for manufacturing micro-systems B81C1/00023without movable or flexible elements B81C1/00031Regular or irregular arrays of nanoscale structures B81C1/00039Anchors B81C1/00047Cavities B81C1/00055Grooves B81C1/00063Trenches B81C1/00071Channels B81C1/00079Grooves not provided for in groups B81C1/00063 - B81C1/00071 B81C1/00087Holes B81C1/00095Interconnects B81C1/00103Structures having a predefined profile B81C1/00111Tips, pillars B81C1/00119Arrangement of basic structures like cavities or channels B81C1/00126Static structures not provided for in groups B81C1/00031 - B81C1/00119 B81C1/00134comprising flexible or deformable structures B81C1/00142Bridges B81C1/0015Cantilevers B81C1/00158Diaphragms, membranes B81C1/00166Electrodes B81C1/00174See-saws B81C1/00182Arrangements of deformable or non-deformable structures B81C1/0019Flexible or deformable structures not provided for in groups B81C1/00142 - B81C1/00182 B81C1/00198comprising elements which are movable in relation to each other B81C1/00206Processes for functionalising a surface B81C1/00214Processes for the simultaneaous manufacturing of a network or an array of similar micro-structural devices B81C1/00222Integrating an electronic processing unit with a micromechanical structure B81C1/0023Packaging together an electronic processing unit die and a micromechanical structure die B81C1/00238Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure B81C1/00246Monolithic integration B81C1/00253Processes for integrating an electronic processing unit with a micromechanical structure not provided for in B81C1/0023 - B81C1/00246 B81C1/00261Processes for packaging MEMS devices B81C1/00269Bonding of solid lids or wafers to the substrate B81C1/00277for maintaining a controlled atmosphere inside of the cavity containing the MEMS B81C1/00285using materials for controlling the level of pressure, contaminants or moisture inside of the package B81C1/00293maintaining a controlled atmosphere with processes not provided for in B81C1/00285 B81C1/00301Connecting electric signal lines from the MEMS device with external electrical signal lines B81C1/00309suitable for fluid transfer from the MEMS out of the package or vice-versa B81C1/00317Packaging optical devices B81C1/00325for reducing stress inside of the package structure B81C1/00333Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325 B81C1/00341Processes for manufacturing micro-systems not provided for in groups B81C1/00023 - B81C1/00261 B81C1/00349Creating layers of material on a substrate B81C1/00357involving bonding one or several substrates on a non-temporary support B81C1/00365having low tensile stress between layers B81C1/00373Selective deposition B81C1/0038Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373 B81C1/00388Etch mask forming B81C1/00396Mask characterised by its composition B81C1/00404Mask characterised by its size, orientation or shape B81C1/00412Mask characterised by its behaviour during the etching process B81C1/0042Compensation masks in orientation dependent etching B81C1/00428Etch mask forming processes not provided for in groups B81C1/00396 - B81C1/0042 B81C1/00436Shaping materials B81C1/00444Surface micromachining B81C1/0046using stamping B81C1/00468Releasing structures B81C1/00476removing a sacrificial layer B81C1/00484Processes for releasing structures not provided for in group B81C1/00476 B81C1/00492Processes for surface micromachining not provided for in groups B81C1/0046 - B81C1/00484 B81C1/005Bulk micromachining B81C1/00507Formation of buried layers by techniques other than deposition B81C1/00515Bulk micromachining techniques not provided for in B81C1/00507 B81C1/00523Etching material B81C1/00531Dry etching B81C1/00539Wet etching B81C1/00547Etching processes not provided for in groups B81C1/00531 - B81C1/00539 B81C1/00555Achieving a desired geometry B81C1/00563Avoid or control over-etching B81C1/00571Avoid or control under-cutting B81C1/00579Avoid charge built-up B81C1/00587Processes for avoiding or controlling over-etching not provided for in B81C1/00571 - B81C1/00579 B81C1/00595Control etch selectivity B81C1/00603Aligning features and geometries on both sides of a substrate B81C1/00611Processes for the planarisation of structures B81C1/00619Forming high aspect ratio structures having deep steep walls B81C1/00626Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619 B81C1/00634Processes for shaping materials not provided for in groups B81C1/00444 - B81C1/00626 B81C1/00642for improving the physical properties of a device B81C1/0065Mechanical properties B81C1/00658Treatments for improving the stiffness of a vibrating element B81C1/00666Treatments for controlling internal stress or strain in MEMS structures B81C1/00674Treatments for improving wear resistance B81C1/00682Treatments for improving mechanical properties, not provided for in B81C1/00658 - B81C1/0065 B81C1/0069Thermal properties B81C1/00698Electrical characteristics B81C1/00706Magnetic properties B81C1/00714Treatment for improving the physical properties not provided for in groups B81C1/0065 - B81C1/00706 B81C1/00777Preserve existing structures from alteration B81C1/00785Avoid chemical alteration B81C1/00793Avoid contamination B81C1/00801Avoid alteration of functional structures by etching B81C1/00809Methods to avoid chemical alteration not provided for in groups B81C1/00793 - B81C1/00801 B81C1/00817Avoid thermal destruction B81C1/00825Protect against mechanical threats B81C1/00833Methods for preserving structures not provided for in groups B81C1/00785 - B81C1/00825 B81C1/00841Cleaning during or after manufacture B81C1/00849during manufacture B81C1/00857after manufacture B81C1/00865Multistep processes for the separation of wafers into individual elements B81C1/00873characterised by special arrangements of the devices, allowing an easier separation B81C1/0088Separation allowing recovery of the substrate or a part of the substrate B81C1/00888Multistep processes involving only mechanical separation B81C1/00896Temporary protection during separation into individual elements B81C1/00904Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896 B81C1/00912Treatments or methods for avoiding stiction of flexible or moving parts of MEMS B81C1/0092For avoiding stiction during the manufacturing process of the device B81C1/00928Eliminating or avoiding remaining moisture after the wet etch release of the movable structure B81C1/00936Releasing the movable structure without liquid etchant B81C1/00944Maintaining a critical distance between the structures to be released B81C1/00952Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944 B81C1/0096For avoiding stiction when the device is in use B81C1/00968Methods for breaking the stiction bond B81C1/00976Control methods for avoiding stiction B81C1/00984Methods for avoiding stiction when the device is in use not provided for in groups B81C1/00968 - B81C1/00976 B81C1/00992Treatments or methods for avoiding stiction of flexible or moving parts of MEMS not provided for in groups B81C1/0092 - B81C1/00984