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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00793Avoid contamination

Industries

Patents Grantslast 30 patents

Information Patent Grant
Freezing a sacrificial material in forming a semiconductor
- Patent number 11,482,409
- Issue date Oct 25, 2022
- Micron Technology, Inc.
- Matthew S. Thorum
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system cavity packaging
- Patent number 11,203,524
- Issue date Dec 21, 2021
- Texas Instruments Incorporated
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and fabrication method thereof
- Patent number 11,130,671
- Issue date Sep 28, 2021
- WUHAN YANXI MICRO COMPONENTS CO., LTD.
- Wei Dong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Freezing a sacrificial material in forming a semiconductor
- Patent number 10,957,530
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Matthew S. Thorum
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system cavity packaging
- Patent number 10,611,631
- Issue date Apr 7, 2020
- Texas Instruments Incorporated
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,564,507
- Issue date Feb 18, 2020
- Samsung Display Co., Ltd.
- Jaewook Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for depositing a measured amount of a species in a sealed c...
- Patent number 10,544,039
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming a micro-electro mechanical system (MEMS) includi...
- Patent number 10,486,964
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Humidity resistant sensors and methods of making same
- Patent number 10,352,806
- Issue date Jul 16, 2019
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 10,338,449
- Issue date Jul 2, 2019
- Samsung Display Co., Ltd.
- Jaewook Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing structured optical components
- Patent number 9,910,273
- Issue date Mar 6, 2018
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro mechanical system (MEMS) device having a blocking lay...
- Patent number 9,617,150
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Humidity resistant sensors and methods of making same
- Patent number 9,574,961
- Issue date Feb 21, 2017
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structures and methods for forming the same
- Patent number 9,533,876
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structures and methods for forming the same
- Patent number 9,054,121
- Issue date Jun 9, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system devices having through substrate vias...
- Patent number 8,883,535
- Issue date Nov 11, 2014
- Freescale Semiconductor Inc.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal airlflow sensor
- Patent number 8,723,287
- Issue date May 13, 2014
- Hitachi Automotive Systems, Ltd.
- Norio Ishitsuka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Diffusion barrier layer for MEMS devices
- Patent number 8,085,458
- Issue date Dec 27, 2011
- QUALCOMM MEMS Technologies, Inc.
- Hsin-Fu Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level sensing package and manufacturing process thereof
- Patent number 7,915,065
- Issue date Mar 29, 2011
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Diffusion barrier layer for MEMS devices
- Patent number 7,630,114
- Issue date Dec 8, 2009
- IDC, LLC
- Hsin-Fu Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical modulator
- Patent number 7,388,701
- Issue date Jun 17, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jeong-Suong Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure and a method for making the same
- Patent number 7,153,443
- Issue date Dec 26, 2006
- Texas Instruments Incorporated
- Jonathan Doan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Barrier layers for microelectromechanical systems
- Patent number 7,138,693
- Issue date Nov 21, 2006
- Reflectivity, Inc.
- Satyadev Patel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Barrier layers for microelectromechanical systems
- Patent number 6,849,471
- Issue date Feb 1, 2005
- Reflectivity, Inc.
- Satyadev R. Patel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flip-chip assembly of protected micromechanical devices
- Patent number 6,507,082
- Issue date Jan 14, 2003
- Texas Instruments Incorporated
- Sunil Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of a surface micromachined capacitive microphone using...
- Patent number 5,573,679
- Issue date Nov 12, 1996
- Alberta Microelectronic Centre
- Alan W. Mitchell
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR COMPONENT AND CORRES...
- Publication number 20250109016
- Publication date Apr 3, 2025
- ROBERT BOSCH GmbH
- Richard Fix
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SWITCH UTILIZING CONDUCTIVE BARRIER LAYER
- Publication number 20240409397
- Publication date Dec 12, 2024
- Menlo Microsystems, Inc.
- Christopher F. Keimel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A PARTICLE PROTECTION ELEMENT, IN PARTICULAR A...
- Publication number 20240359975
- Publication date Oct 31, 2024
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FREEZING A SACRIFICIAL MATERIAL IN FORMING A SEMICONDUCTOR
- Publication number 20210225637
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Matthew S. Thorum
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20200331749
- Publication date Oct 22, 2020
- WUHAN YANXI MICRO COMPONENTS CO., LTD.
- Wei DONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM CAVITY PACKAGING
- Publication number 20200189910
- Publication date Jun 18, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190271894
- Publication date Sep 5, 2019
- SAMSUNG DISPLAY CO., LTD.
- Jaewook Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM CAVITY PACKAGING
- Publication number 20190185320
- Publication date Jun 20, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR DEPOSITING A MEASURED AMOUNT OF A SPECIES IN A SEALED C...
- Publication number 20190077656
- Publication date Mar 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen COOK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20150076626
- Publication date Mar 19, 2015
- Kabushiki Kaisha Toshiba
- Naofumi NAKAMURA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING STRUCTURED OPTICAL COMPONENTS
- Publication number 20150040368
- Publication date Feb 12, 2015
- Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
- Hans Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM DEVICES HAVING THROUGH SUBSTRATE VIAS...
- Publication number 20140239423
- Publication date Aug 28, 2014
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thermal Airlflow Sensor
- Publication number 20130119504
- Publication date May 16, 2013
- Hitachi Automotive Systems, Ltd.
- Norio Ishitsuka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Structures and Methods for Forming the Same
- Publication number 20130099355
- Publication date Apr 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIFFUSION BARRIER LAYER FOR MEMS DEVICES
- Publication number 20120086998
- Publication date Apr 12, 2012
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Hsin-Fu Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIFFUSION BARRIER LAYER FOR MEMS DEVICES
- Publication number 20100046058
- Publication date Feb 25, 2010
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Hsin-Fu Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20090124074
- Publication date May 14, 2009
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level sensing package and manufacturing process thereof
- Publication number 20090121299
- Publication date May 14, 2009
- Industrial Technology Research Institute
- Lung-Tai Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Optical modulator
- Publication number 20070146859
- Publication date Jun 28, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Jeong-Suong Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Diffusion barrier layer for MEMS devices
- Publication number 20070096300
- Publication date May 3, 2007
- Hsin-Fu Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL STRUCTURE AND A METHOD FOR MAKING THE SAME
- Publication number 20060266730
- Publication date Nov 30, 2006
- Jonathan Doan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of selective etching using etch stop layer
- Publication number 20060066932
- Publication date Mar 30, 2006
- Clarence Chui
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Barrier layers for microelectromechanical systems
- Publication number 20050054135
- Publication date Mar 10, 2005
- Satyadev Patel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BARRIER LAYERS FOR MICROELECTROMECHANICAL SYSTEMS
- Publication number 20040191937
- Publication date Sep 30, 2004
- Satyadev R. Patel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLIP-CHIP ASSEMBLY OF PROTECTED MICROMECHANICAL DEVICES
- Publication number 20020163055
- Publication date Nov 7, 2002
- Sunil Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Avoid contamination

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Freezing a sacrificial material in forming a semiconductor

Microelectromechanical system cavity packaging

MEMS device and fabrication method thereof

Freezing a sacrificial material in forming a semiconductor

Microelectromechanical system cavity packaging

Display apparatus and method of manufacturing the same

Methods for depositing a measured amount of a species in a sealed c...

Method for forming a micro-electro mechanical system (MEMS) includi...

Humidity resistant sensors and methods of making same

Display apparatus and method of manufacturing the same

Method for producing structured optical components

Micro-electro mechanical system (MEMS) device having a blocking lay...

Humidity resistant sensors and methods of making same

MEMS structures and methods for forming the same

MEMS structures and methods for forming the same

Microelectromechanical system devices having through substrate vias...

Thermal airlflow sensor

Diffusion barrier layer for MEMS devices

Wafer level sensing package and manufacturing process thereof

Diffusion barrier layer for MEMS devices

Optical modulator

Microelectromechanical structure and a method for making the same

Barrier layers for microelectromechanical systems

Barrier layers for microelectromechanical systems

Flip-chip assembly of protected micromechanical devices

Fabrication of a surface micromachined capacitive microphone using...

Patents Applicationslast 30 patents

PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR COMPONENT AND CORRES...

MEMS SWITCH UTILIZING CONDUCTIVE BARRIER LAYER

METHOD FOR PRODUCING A PARTICLE PROTECTION ELEMENT, IN PARTICULAR A...

FREEZING A SACRIFICIAL MATERIAL IN FORMING A SEMICONDUCTOR

MEMS DEVICE AND FABRICATION METHOD THEREOF

MICROELECTROMECHANICAL SYSTEM CAVITY PACKAGING

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

MICROELECTROMECHANICAL SYSTEM CAVITY PACKAGING

METHODS FOR DEPOSITING A MEASURED AMOUNT OF A SPECIES IN A SEALED C...

ELECTRONIC DEVICE

METHOD FOR PRODUCING STRUCTURED OPTICAL COMPONENTS

MICROELECTROMECHANICAL SYSTEM DEVICES HAVING THROUGH SUBSTRATE VIAS...

Thermal Airlflow Sensor

MEMS Structures and Methods for Forming the Same

DIFFUSION BARRIER LAYER FOR MEMS DEVICES

DIFFUSION BARRIER LAYER FOR MEMS DEVICES

WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF

Wafer level sensing package and manufacturing process thereof

Optical modulator

Diffusion barrier layer for MEMS devices

MICROELECTROMECHANICAL STRUCTURE AND A METHOD FOR MAKING THE SAME

Method of selective etching using etch stop layer

Barrier layers for microelectromechanical systems

BARRIER LAYERS FOR MICROELECTROMECHANICAL SYSTEMS

FLIP-CHIP ASSEMBLY OF PROTECTED MICROMECHANICAL DEVICES