Avoid thermal destruction

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B81C1/00817

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

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B81C1/00817Avoid thermal destruction

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Patents Grantslast 30 patents

Information Patent Grant
Integrating diverse sensors in a single semiconductor device
- Patent number 11,021,363
- Issue date Jun 1, 2021
- NXP USA, INC.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical circuit switch mirror array crack protection
- Patent number 10,948,688
- Issue date Mar 16, 2021
- Google LLC
- Kevin Y. Yasumura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrating diverse sensors in a single semiconductor device
- Patent number 10,364,140
- Issue date Jul 30, 2019
- NXP USA, INC.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of MEMS sensor
- Patent number 10,160,644
- Issue date Dec 25, 2018
- Hitachi, Ltd.
- Masaharu Kinoshita
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated MEMS device
- Patent number 9,676,609
- Issue date Jun 13, 2017
- Asia Pacific Microsystems, Inc.
- Jerwei Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing an inkjet print head
- Patent number 9,550,360
- Issue date Jan 24, 2017
- NLT Technologies, Ltd.
- Shigeru Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for manufacturing the same
- Patent number 9,162,224
- Issue date Oct 20, 2015
- Canon Kabushiki Kaisha
- Tomohiro Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SENSING ELEMENT AND RELATED METHODS
- Publication number 20230304879
- Publication date Sep 28, 2023
- GENERAL ELECTRIC COMPANY
- Robert James MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATING DIVERSE SENSORS IN A SINGLE SEMICONDUCTOR DEVICE
- Publication number 20190292042
- Publication date Sep 26, 2019
- NXP USA,INC.
- LIANJUN LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing Method of Mems Sensor
- Publication number 20180370793
- Publication date Dec 27, 2018
- Hitachi, Ltd
- Masaharu KINOSHITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130156657
- Publication date Jun 20, 2013
- Canon Kabushiki Kaisha
- Tomohiro Saito
- B81 - MICRO-STRUCTURAL TECHNOLOGY