TREA

Ball bonding

Follow

Industry

  • CPC
  • B23K20/007
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat

Current Industry

B23K20/007Ball bonding
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Method and Apparatus for Flexible Circuit Cable Attachment
    • Publication number 20240008189
    • Publication date Jan 4, 2024
    • Jabil Inc.
    • Wenlu Wang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING TOOLS, AND RELATED METHODS OF PROVIDING THE SAME
    • Publication number 20230347442
    • Publication date Nov 2, 2023
    • KULICKE AND SOFFA INDUSTRIES, INC.
    • Cristian D. Cionea
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING CAPILLARY
    • Publication number 20230311239
    • Publication date Oct 5, 2023
    • CRAFTSTECH, INC.
    • Jeffrey C. Roberts
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ARRANGEMENT AND METHOD FOR MECHANICALLY AND ELECTRICALLY CONTACTING...
    • Publication number 20230278132
    • Publication date Sep 7, 2023
    • INFRASOLID GMBH
    • Marco SCHOSSIG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF M...
    • Publication number 20230166348
    • Publication date Jun 1, 2023
    • KULICKE AND SOFFA INDUSTRIES, INC.
    • Hui Xu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING TOOL
    • Publication number 20230081711
    • Publication date Mar 16, 2023
    • STMicroelectronics (Grenoble 2) SAS
    • Didier CAMPOS
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF M...
    • Publication number 20220134469
    • Publication date May 5, 2022
    • KULICKE AND SOFFA INDUSTRIES, INC.
    • Hui Xu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and Apparatus for Flexible Circuit Cable Attachment
    • Publication number 20220095463
    • Publication date Mar 24, 2022
    • Jabil Inc.
    • Wenlu Wang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESS FOR ELECTRICALLY CONNECTING CONTACT SURFACES OF ELECTRONIC...
    • Publication number 20220037284
    • Publication date Feb 3, 2022
    • Heraeus Materials Singapore Pte. Ltd.
    • Yean M. Pun
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING APPARATUS THREADING SYSTEM
    • Publication number 20210159205
    • Publication date May 27, 2021
    • ASM Technology Singapore Pte Ltd
    • Keng Yew SONG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and Apparatus for Flexible Circuit Cable Attachment
    • Publication number 20210014977
    • Publication date Jan 14, 2021
    • Jabil Inc.
    • Wenlu Wang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING APPARATUS
    • Publication number 20200388590
    • Publication date Dec 10, 2020
    • KAIJO CORPORATION
    • Riki JINDO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROTECTED CHIP-SCALE PACKAGE (CSP) PAD STRUCTURE
    • Publication number 20200075416
    • Publication date Mar 5, 2020
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Yueh-Chuan Lee
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and Apparatus for Flexible Circuit Cable Attachment
    • Publication number 20190394885
    • Publication date Dec 26, 2019
    • Jabil Inc.
    • Wenlu Wang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTIPLE ACTUATOR WIRE BONDING APPARATUS
    • Publication number 20190304947
    • Publication date Oct 3, 2019
    • ASM Technology Singapore Pte Ltd
    • Keng Yew SONG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING METHOD AND WIRE BONDING APPARATUS
    • Publication number 20190287941
    • Publication date Sep 19, 2019
    • SHINKAWA LTD.
    • Yusuke MARUYA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROTECTED CHIP-SCALE PACKAGE (CSP) PAD STRUCTURE
    • Publication number 20190252257
    • Publication date Aug 15, 2019
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Yueh-Chuan Lee
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROTECTED CHIP-SCALE PACKAGE (CSP) PAD STRUCTURE
    • Publication number 20190006237
    • Publication date Jan 3, 2019
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Yueh-Chuan Lee
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATED WIRE
    • Publication number 20180345421
    • Publication date Dec 6, 2018
    • HERAEUS MATERIALS SINGAPORE PTE., LTD.
    • Il Tae Kang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
    • Publication number 20180240935
    • Publication date Aug 23, 2018
    • Nichia Corporation
    • Kensaku HAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD AND APPARATUS FOR FLEXIBLE CIRCUIT CABLE ATTACHMENT
    • Publication number 20180132360
    • Publication date May 10, 2018
    • Jabil Circuit, Inc.
    • Wenlu Wang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR FORMING BALL IN BONDING WIRE
    • Publication number 20180096965
    • Publication date Apr 5, 2018
    • NIPPON MICROMETAL CORPORATION
    • Noritoshi ARAKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATED WIRE FOR BONDING APPLICATIONS
    • Publication number 20150360316
    • Publication date Dec 17, 2015
    • Heraeus Deutschland GmbH & Co. KG
    • Eugen MILKE
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    WIRE-BONDING APPARATUS AND METHOD OF WIRE BONDING
    • Publication number 20150246411
    • Publication date Sep 3, 2015
    • SHINKAWA LTD.
    • NAOKI SEKINE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ANTIOXIDANT GAS BLOW-OFF UNIT
    • Publication number 20150209886
    • Publication date Jul 30, 2015
    • SHINKAWA LTD.
    • Toru Maeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Methods for Forming Apparatus for Stud Bump Formation
    • Publication number 20150102091
    • Publication date Apr 16, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yeong-Jyh Lin
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ANTIOXIDANT GAS SUPPLY UNIT
    • Publication number 20140311590
    • Publication date Oct 23, 2014
    • SHINKAWA LTD.
    • Toru MAEDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING APPARATUS
    • Publication number 20140151341
    • Publication date Jun 5, 2014
    • SHINKAWA LTD.
    • Katsutoshi KUNIYOSHI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Methods for Forming Apparatus for Stud Bump Formation
    • Publication number 20140061153
    • Publication date Mar 6, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yeong-Jyh Lin
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Application

    WIRE BONDING APPARATUS AND WIRE BONDING METHOD
    • Publication number 20140054277
    • Publication date Feb 27, 2014
    • KAIJO CORPORATION
    • Akio Sugito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR