Ball bonds

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H01L2224/4942

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4942Ball bonds

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit structure
- Patent number 12,035,471
- Issue date Jul 9, 2024
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Andu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
- Patent number 11,562,978
- Issue date Jan 24, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,342,276
- Issue date May 24, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,566,255
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,559,537
- Issue date Feb 11, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,134,648
- Issue date Nov 20, 2018
- Renesas Electronics Corporation
- Toshihiko Akiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,115,678
- Issue date Oct 30, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 9,978,713
- Issue date May 22, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 9,812,402
- Issue date Nov 7, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bond pad wiring lead-out arrangement avoi...
- Patent number 9,646,901
- Issue date May 9, 2017
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting module
- Patent number 9,634,211
- Issue date Apr 25, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masumi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 9,502,456
- Issue date Nov 22, 2016
- Hamamatsu Photonics K.K.
- Shin-ichiro Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 9,490,222
- Issue date Nov 8, 2016
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,397,072
- Issue date Jul 19, 2016
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 9,281,457
- Issue date Mar 8, 2016
- Nichia Corporation
- Satoshi Shirahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including alternating stepped semiconductor di...
- Patent number 9,230,942
- Issue date Jan 5, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,177,936
- Issue date Nov 3, 2015
- Renesas Electronics Corporation
- Nobuyasu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,165,845
- Issue date Oct 20, 2015
- Renesas Electronics Corporation
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 9,147,623
- Issue date Sep 29, 2015
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device reducing risks of a wire short-circuit and a w...
- Patent number 8,975,760
- Issue date Mar 10, 2015
- PS4 Luxco S.A.R.L.
- Shori Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,941,237
- Issue date Jan 27, 2015
- PS4 Luxco S.A.R.L.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,912,540
- Issue date Dec 16, 2014
- Renesas Electronics Corporations
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts a...
- Patent number 8,885,356
- Issue date Nov 11, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly and chip assembling method
- Patent number 8,860,219
- Issue date Oct 14, 2014
- Hon Hai Precision Industry Co., Ltd.
- Kai-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,816,514
- Issue date Aug 26, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 8,803,307
- Issue date Aug 12, 2014
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES
- Publication number 20240363503
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
- Publication number 20240258212
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE
- Publication number 20230395566
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Vijayakrishna J. Vankayala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE
- Publication number 20230395565
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Vijayakrishna J. Vankayala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE
- Publication number 20230187348
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178518
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Raehyung DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220246542
- Publication date Aug 4, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20220132662
- Publication date Apr 28, 2022
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Andu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20200118939
- Publication date Apr 16, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
- Publication date Nov 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190057913
- Publication date Feb 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20190027444
- Publication date Jan 24, 2019
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bond Wires for Interference Shielding
- Publication number 20180061774
- Publication date Mar 1, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS DOUBLE WIRE WEDGE BONDING METHOD, SYSTEM, KIT AND TOOL
- Publication number 20180005979
- Publication date Jan 4, 2018
- CIENA CORPORATION
- Simon Savard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20170117231
- Publication date Apr 27, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20160049390
- Publication date Feb 18, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361299
- Publication date Dec 11, 2014
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20140346683
- Publication date Nov 27, 2014
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140127860
- Publication date May 8, 2014
- RENESAS ELECTRONICS CORPORATION
- Nobuyasu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140021608
- Publication date Jan 23, 2014
- Samsunung Electronics., Ltd.
- KEUN-HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20130292834
- Publication date Nov 7, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20130292854
- Publication date Nov 7, 2013
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD
- Publication number 20130285239
- Publication date Oct 31, 2013
- HON HAI Precision Industry CO., LTD.
- KAI-WEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130277835
- Publication date Oct 24, 2013
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20130267050
- Publication date Oct 10, 2013
- Satoshi SHIRAHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Packages and Methods of Manufacturing the Same
- Publication number 20130241055
- Publication date Sep 19, 2013
- Samsung Electronics Co., Ltd.
- Jin-Young Jung
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit structure

Wire bond wires for interference shielding

Decoupling capacitor mounted on an integrated circuit die, and meth...

Wire bond wires for interference shielding

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Wire bond wires for interference shielding

Manufacturing method of semiconductor device

Wire bond wires for interference shielding

Method of manufacturing semiconductor device and wire bonding appar...

Wire bond wires for interference shielding

Multiple bond via arrays of different wire heights on a same substrate

Semiconductor device with bond pad wiring lead-out arrangement avoi...

Light-emitting module

Electronic component device

Wire bond wires for interference shielding

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the semiconductor...

Semiconductor device including alternating stepped semiconductor di...

Method of manufacturing semiconductor device

Semiconductor device

Stacked microelectronic devices and methods for manufacturing stack...

Through wire interconnect (TWI) for semiconductor components having...

Semiconductor device reducing risks of a wire short-circuit and a w...

Semiconductor device

Semiconductor device

Enhanced stacked microelectronic assemblies with central contacts a...

Chip assembly and chip assembling method

Microelectronic assembly with joined bond elements having lowered i...

Stacked microelectronic devices and methods for manufacturing stack...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES

SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE

INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE

SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE

SEMICONDUCTOR PACKAGE

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CIRCUIT STRUCTURE

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Wire Bond Wires for Interference Shielding

SIMULTANEOUS DOUBLE WIRE WEDGE BONDING METHOD, SYSTEM, KIT AND TOOL

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Multiple bond via arrays of different wire heights on a same substrate

SEMICONDUCTOR DEVICE

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Through Wire Interconnect (TWI) For Semiconductor Components Having...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Multi-Chip Packages and Methods of Manufacturing the Same