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H01L2224/29299

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29299Base material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device comprising semiconductor die and interposer an...
- Patent number 11,527,496
- Issue date Dec 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recess portion in the surface of an interconnection layer mounted t...
- Patent number 11,476,225
- Issue date Oct 18, 2022
- Kabushiki Kaisha Toshiba
- Shun Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package assembly
- Patent number 11,171,120
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having an encapsulated front side and interpos...
- Patent number 10,679,952
- Issue date Jun 9, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming PIP with inner known goo...
- Patent number RE47923
- Issue date Mar 31, 2020
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
Information Patent Grant
Integrated circuit package assembly
- Patent number 10,546,838
- Issue date Jan 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,446,455
- Issue date Oct 15, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated electronic device with transceiving antenna and magnetic...
- Patent number 10,366,969
- Issue date Jul 30, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,297,515
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package assembly
- Patent number 10,163,865
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method
- Patent number 9,997,485
- Issue date Jun 12, 2018
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames with wettable flanks
- Patent number 9,966,326
- Issue date May 8, 2018
- Unisem (M) Berhad
- Maria Cristina T. Santillan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of self-confinement of conductive b...
- Patent number 9,899,286
- Issue date Feb 20, 2018
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Occam process for components having variations in part dimensions
- Patent number 9,894,771
- Issue date Feb 13, 2018
- Joseph Charles Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and other circuit modules with porous and no...
- Patent number 9,799,626
- Issue date Oct 24, 2017
- Invensas Corporation
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounting method
- Patent number 9,793,221
- Issue date Oct 17, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package assembly
- Patent number 9,786,635
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method
- Patent number 9,780,059
- Issue date Oct 3, 2017
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,728,514
- Issue date Aug 8, 2017
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,391,043
- Issue date Jul 12, 2016
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,385,103
- Issue date Jul 5, 2016
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of self-confinement of conductive b...
- Patent number 9,379,084
- Issue date Jun 28, 2016
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint structure, power module, power module substrate with h...
- Patent number 9,355,986
- Issue date May 31, 2016
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable package by using internal stacking modules
- Patent number 9,245,772
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming an integrated circuit package
- Patent number 9,123,824
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER MODULE, POWER SUPPLY CIRCUIT, AND CHIP
- Publication number 20240170439
- Publication date May 23, 2024
- Huawei Technologies Co., Ltd
- Fengqun Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM FOR BONDING A FLIP CHIP DIE TO A SUBSTRATE
- Publication number 20240063201
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230119406
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd
- Pilsung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230111854
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230066395
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20230009679
- Publication date Jan 12, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ARRAY SUBSTRATE, METHOD OF MANUFACTURING SAME, DISPLAY PANEL AND SP...
- Publication number 20220320030
- Publication date Oct 6, 2022
- TCL China Star Optoelectronics Technology Co., Ltd.
- Changming Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220093554
- Publication date Mar 24, 2022
- Kabushiki Kaisha Toshiba
- Shun TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210020591
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20200219780
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ASSEMBLY
- Publication number 20200144226
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ASSEMBLY
- Publication number 20190123025
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...
- Publication number 20180040591
- Publication date Feb 8, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ASSEMBLY
- Publication number 20180019229
- Publication date Jan 18, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20170352635
- Publication date Dec 7, 2017
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING COOLER
- Publication number 20140361425
- Publication date Dec 11, 2014
- Kuniaki MAMITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20140335660
- Publication date Nov 13, 2014
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Package by Using Internal Stacking Modules
- Publication number 20140319702
- Publication date Oct 30, 2014
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT
- Publication number 20140312102
- Publication date Oct 23, 2014
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...
- Publication number 20140284788
- Publication date Sep 25, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING COOLER
- Publication number 20140203426
- Publication date Jul 24, 2014
- DENSO CORPORATION
- Kuniaki MAMITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140138817
- Publication date May 22, 2014
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FAN-OUT SEMICONDUCTOR CHIP
- Publication number 20140015131
- Publication date Jan 16, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING COOLER
- Publication number 20140015120
- Publication date Jan 16, 2014
- DENSO CORPORATION
- Kuniaki MAMITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20130187266
- Publication date Jul 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Material for Semiconductor Devices
- Publication number 20130134591
- Publication date May 30, 2013
- Yoshitsugu Sakamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor Device and Method of Forming Sloped Surface in Patter...
- Publication number 20130113118
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS

Base material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fingerprint sensor and manufacturing method thereof

Semiconductor device comprising semiconductor die and interposer an...

Recess portion in the surface of an interconnection layer mounted t...

Fingerprint sensor and manufacturing method thereof

Integrated circuit package assembly

Contact structures with porous networks for solder connections, and...

Semiconductor device having an encapsulated front side and interpos...

Low-temperature bonding with spaced nanorods and eutectic alloys

Semiconductor device and method of forming PIP with inner known goo...

Integrated circuit package assembly

Fingerprint sensor and manufacturing method thereof

Integrated electronic device with transceiving antenna and magnetic...

Fingerprint sensor and manufacturing method thereof

Integrated circuit package assembly

Bonding structure and method

Lead frames with wettable flanks

Semiconductor device and method of self-confinement of conductive b...

Occam process for components having variations in part dimensions

Semiconductor packages and other circuit modules with porous and no...

Semiconductor device mounting method

Integrated circuit package assembly

Bonding structure and method

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing method

Semiconductor device and method of self-confinement of conductive b...

Solder joint structure, power module, power module substrate with h...

Stackable package by using internal stacking modules

Semiconductor die package and method for making the same

Method of forming an integrated circuit package

Patents Applicationslast 30 patents

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

POWER MODULE, POWER SUPPLY CIRCUIT, AND CHIP

NON-CONDUCTIVE FILM FOR BONDING A FLIP CHIP DIE TO A SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

ARRAY SUBSTRATE, METHOD OF MANUFACTURING SAME, DISPLAY PANEL AND SP...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE ASSEMBLY

INTEGRATED CIRCUIT PACKAGE ASSEMBLY

INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...

INTEGRATED CIRCUIT PACKAGE ASSEMBLY

BONDING STRUCTURE AND METHOD

SEMICONDUCTOR DEVICE INCLUDING COOLER

BONDING STRUCTURE AND METHOD

Stackable Package by Using Internal Stacking Modules

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT

SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...

SEMICONDUCTOR DEVICE INCLUDING COOLER

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STACKED FAN-OUT SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE INCLUDING COOLER

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME

Bonding Material for Semiconductor Devices

Semiconductor Device and Method of Forming Sloped Surface in Patter...