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H01L2224/05799

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05799Base material

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIES INCLUDING RECESSES FOR FACILITATING MECHANICAL D...
- Publication number 20240047424
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230066395
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20100164090
- Publication date Jul 1, 2010
- Sang-Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS