Bases or plates or solder therefor

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/492Bases or plates or solder therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dual-side cooling semiconductor packages and related methods
- Patent number 12,154,844
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,737
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuto Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package baseplate with step recess design
- Patent number 12,131,981
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor module
- Patent number 12,131,980
- Issue date Oct 29, 2024
- Fuji Electric Co., Ltd.
- Toru Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,107,023
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,688
- Issue date Sep 24, 2024
- Rohm Co., Ltd.
- Kaito Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blocking element for connecting pins of semiconductor dice
- Patent number 12,094,806
- Issue date Sep 17, 2024
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal substrates with structures formed therein and methods of maki...
- Patent number 12,087,670
- Issue date Sep 10, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,080,659
- Issue date Sep 3, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,375
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure and electrical junction box
- Patent number 12,027,500
- Issue date Jul 2, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,391
- Issue date May 21, 2024
- Denso Corporation
- Masayoshi Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element module
- Patent number 11,948,859
- Issue date Apr 2, 2024
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Takayuki Furuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a module with solder body having elevated edge
- Patent number 11,942,335
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Achim Muecke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package with flip chip die over multi-layer heatsink stan...
- Patent number 11,942,391
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device module with dummy pad die layout
- Patent number 11,935,817
- Issue date Mar 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with a redistribution layer and methods of manuf...
- Patent number 11,908,761
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Seung Nam Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with reinforced isolation
- Patent number 11,908,834
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and production method thereof, and semiconduc...
- Patent number 11,901,341
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for power supply module
- Patent number 11,887,942
- Issue date Jan 30, 2024
- Hefei Silergy Semiconductor Technology Co., Ltd.
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power module
- Patent number 11,887,910
- Issue date Jan 30, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Kremena Vladimirova
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering structure with groove portion and power module comprising...
- Patent number 11,862,537
- Issue date Jan 2, 2024
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus
- Patent number 11,848,245
- Issue date Dec 19, 2023
- Hitachi Astemo, Ltd.
- Hironori Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 11,842,941
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bus bar and power electronic device with current shaping terminal c...
- Patent number 11,837,826
- Issue date Dec 5, 2023
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
- Publication number 20250054839
- Publication date Feb 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCKING ELEMENT FOR CONNECTING PINS OF SEMICONDUCTOR DICE
- Publication number 20240429132
- Publication date Dec 26, 2024
- STMicroelectronics S.r.l.
- Agatino MINOTTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN
- Publication number 20240404922
- Publication date Dec 5, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. MOORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE WITH METAL CLIP FOR STACKING ELECTRONIC C...
- Publication number 20240347475
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240321774
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kitae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240304464
- Publication date Sep 12, 2024
- OIP Technology Pte Ltd
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20240282649
- Publication date Aug 22, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Yubun Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...
- Publication number 20240266237
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...
- Publication number 20240235138
- Publication date Jul 11, 2024
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT
- Publication number 20240222231
- Publication date Jul 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE
- Publication number 20240194546
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240194581
- Publication date Jun 13, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER AND METHODS OF MANUF...
- Publication number 20240194550
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seung Nam Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...
- Publication number 20240178096
- Publication date May 30, 2024
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240178100
- Publication date May 30, 2024
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEM AND METHOD OF MANUFACTURING STEM
- Publication number 20240145347
- Publication date May 2, 2024
- Shinko Electric Industries Co., Ltd.
- Masao KAINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...
- Publication number 20240136782
- Publication date Apr 25, 2024
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20240128166
- Publication date Apr 18, 2024
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087969
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Shunsuke KAMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240087994
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Kazuhiro WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE
- Publication number 20240079283
- Publication date Mar 7, 2024
- NEXPERIA B.V.
- Vegneswary Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240079288
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Youngho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20240079384
- Publication date Mar 7, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055386
- Publication date Feb 15, 2024
- Kabushiki Kaisha Toshiba
- Satoshi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES
- Publication number 20240055397
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS

Bases or plates or solder therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual-side cooling semiconductor packages and related methods

Semiconductor device

Semiconductor package structure and fabrication method thereof

Electronic package with interposer between integrated circuit dies

Power module package baseplate with step recess design

Hermetic metallized via with improved reliability

Semiconductor module

Power module

Semiconductor device

Blocking element for connecting pins of semiconductor dice

Metal substrates with structures formed therein and methods of maki...

Sensor package structure

Die attach surface copper layer with protective layer for microelec...

Semiconductor device and method for manufacturing semiconductor device

Circuit structure and electrical junction box

Semiconductor device

Semiconductor package having a chip carrier with a pad offset feature

Element module

Manufacturing a module with solder body having elevated edge

System in package with flip chip die over multi-layer heatsink stan...

Power device module with dummy pad die layout

Electronic devices with a redistribution layer and methods of manuf...

Multi-chip package with reinforced isolation

Semiconductor package and production method thereof, and semiconduc...

Package structure for power supply module

Electronic power module

Soldering structure with groove portion and power module comprising...

Power semiconductor apparatus

Semiconductor package structure and fabrication method thereof

Bus bar and power electronic device with current shaping terminal c...

Patents Applicationslast 30 patents

POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN

BLOCKING ELEMENT FOR CONNECTING PINS OF SEMICONDUCTOR DICE

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

INTEGRATED DEVICE PACKAGE WITH METAL CLIP FOR STACKING ELECTRONIC C...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SUBSTRATE SUPPORT

A SEMICONDUCTOR TRANSISTOR PACKAGE HAVING ELECTRICAL CONTACT LAYERS...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...

POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT

HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE

POWER MODULE AND MANUFACTURING METHOD THEREFOR

ELECTRONIC DEVICES WITH A REDISTRIBUTION LAYER AND METHODS OF MANUF...

SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STEM AND METHOD OF MANUFACTURING STEM

BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

LEAD FRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES