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H01L2224/93

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/93Batch processes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,637,086
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,631,654
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 10,840,215
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,204,878
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked chips, a re-distribution layer,...
- Patent number 9,917,066
- Issue date Mar 13, 2018
- Panasonic Corporation
- Nobuo Aoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic device package
- Patent number 9,771,259
- Issue date Sep 26, 2017
- Xintec Inc.
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,748,191
- Issue date Aug 29, 2017
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 9,620,430
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,508,630
- Issue date Nov 29, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,287
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,286
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of forming protection and support s...
- Patent number 9,484,259
- Issue date Nov 1, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost low-profile solder bump process for enabling ultra-thin wa...
- Patent number 9,425,064
- Issue date Aug 23, 2016
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment for semiconductor devices
- Patent number 9,418,955
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming 3D semiconductor package...
- Patent number 9,391,046
- Issue date Jul 12, 2016
- STATS ChipPAC Pte. Ltd.
- Yeonglm Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interposers and stacked memory devices
- Patent number 9,287,235
- Issue date Mar 15, 2016
- Sanmina Corporation
- Paul Sweere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 9,181,084
- Issue date Nov 10, 2015
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 9,034,751
- Issue date May 19, 2015
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 9,018,770
- Issue date Apr 28, 2015
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing delamination between an underfill and a buffer layer in a...
- Patent number 8,963,328
- Issue date Feb 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,922,026
- Issue date Dec 30, 2014
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method for forming the same, and package wafer
- Patent number 8,810,012
- Issue date Aug 19, 2014
- Yuan-Ru Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 8,803,326
- Issue date Aug 12, 2014
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 8,802,553
- Issue date Aug 12, 2014
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 8,802,564
- Issue date Aug 12, 2014
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,785,318
- Issue date Jul 22, 2014
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 8,778,798
- Issue date Jul 15, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210125964
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210057383
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170338197
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
CHIP PACKAGE
- Publication number 20140327152
- Publication date Nov 6, 2014
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20140329361
- Publication date Nov 6, 2014
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140327157
- Publication date Nov 6, 2014
- NOBUO AOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140312493
- Publication date Oct 23, 2014
- Shinya Suzuki
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES
- Publication number 20140263585
- Publication date Sep 18, 2014
- Sanmina Corporation
- Paul Sweere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140193950
- Publication date Jul 10, 2014
- Xintec Inc.
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
- Publication number 20140170814
- Publication date Jun 19, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WA...
- Publication number 20140167252
- Publication date Jun 19, 2014
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Treatment for Semiconductor Devices
- Publication number 20140131861
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING
- Publication number 20140131892
- Publication date May 15, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Delamination Between an Underfill and a Buffer Layer in a...
- Publication number 20140087522
- Publication date Mar 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140017854
- Publication date Jan 16, 2014
- Xintec Inc.
- Ching-Yu NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130344693
- Publication date Dec 26, 2013
- Renesas Electronics Corporation
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20130187258
- Publication date Jul 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE
- Publication number 20130143400
- Publication date Jun 6, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20130119556
- Publication date May 16, 2013
- Xintec Inc.
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD FOR FORMING THE SAME, AND PACKAGE WAFER
- Publication number 20130119524
- Publication date May 16, 2013
- Xintec Inc.
- Yuan-Ru CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL APPLIED RF SHIELDS
- Publication number 20130093067
- Publication date Apr 18, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protection and Support S...
- Publication number 20130069225
- Publication date Mar 21, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING FULLY EMBEDDED BUMPLESS BUILD-UP LAYER PACKAGES...
- Publication number 20130023088
- Publication date Jan 24, 2013
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130020701
- Publication date Jan 24, 2013
- Renesas Electronics Corporation
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
Semiconductor Device and Method of Forming 3D Semiconductor Package...
- Publication number 20120292745
- Publication date Nov 22, 2012
- STATS ChipPAC, Ltd.
- YeongIm Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120280389
- Publication date Nov 8, 2012
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20120282772
- Publication date Nov 8, 2012
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120263946
- Publication date Oct 18, 2012
- Kazuyuki Mitsukura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20120208323
- Publication date Aug 16, 2012
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS

Batch processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sawing underfill in packaging processes

Sawing underfill in packaging processes

Semiconductor device and a method of manufacturing the same

Method for transferring and placing a semiconductor device on a sub...

Sawing underfill in packaging processes

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device having stacked chips, a re-distribution layer,...

Method for fabricating electronic device package

Semiconductor device and a method of manufacturing the same

Sawing underfill in packaging processes

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of forming protection and support s...

Low-cost low-profile solder bump process for enabling ultra-thin wa...

Plasma treatment for semiconductor devices

Semiconductor device and method of forming 3D semiconductor package...

Method for forming interposers and stacked memory devices

Electronic device package and fabrication method thereof

Method for mounting a semiconductor chip on a carrier

Chip package

Reducing delamination between an underfill and a buffer layer in a...

Chip package and fabrication method thereof

Chip package, method for forming the same, and package wafer

Chip package

Method for mounting a semiconductor chip on a carrier

Method of manufacturing a semiconductor component

Semiconductor device and a method of manufacturing the same

Electronic device package and fabrication method thereof

Patents Applicationslast 30 patents

Sawing Underfill in Packaging Processes

Sawing Underfill in Packaging Processes

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE

Method for Mounting a Semiconductor Chip on a Carrier

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WA...

Plasma Treatment for Semiconductor Devices

CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING

Reducing Delamination Between an Underfill and a Buffer Layer in a...

CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Sawing Underfill in Packaging Processes

METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE

CHIP PACKAGE

CHIP PACKAGE, METHOD FOR FORMING THE SAME, AND PACKAGE WAFER

WAFER LEVEL APPLIED RF SHIELDS

Semiconductor Device and Method of Forming Protection and Support S...

METHODS OF FORMING FULLY EMBEDDED BUMPLESS BUILD-UP LAYER PACKAGES...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming 3D Semiconductor Package...

Doping Minor Elements into Metal Bumps

CHIP PACKAGE AND FABRICATION METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

Method for Mounting a Semiconductor Chip on a Carrier