being a coplanar line type

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CPC
H01L2924/19033

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19033being a coplanar line type

Industries

Patents Grantslast 30 patents

Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
- Patent number 11,894,324
- Issue date Feb 6, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising planar waveguide transmission lines
- Patent number 11,784,144
- Issue date Oct 10, 2023
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,784,155
- Issue date Oct 10, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,640,935
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor chip
- Patent number 11,373,964
- Issue date Jun 28, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuji Kiyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,289,441
- Issue date Mar 29, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single layer radio frequency integrated circuit package and related...
- Patent number 11,277,902
- Issue date Mar 15, 2022
- Arbe Robotics Ltd.
- Nadav Snir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
- Patent number 11,211,345
- Issue date Dec 28, 2021
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in package device having substrate stack
- Patent number 10,910,705
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip scale packages
- Patent number 10,553,511
- Issue date Feb 4, 2020
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip scale packages
- Patent number 10,319,654
- Issue date Jun 11, 2019
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide including first and second metal plates and having a slot...
- Patent number 10,056,672
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer including an integrated waveguide for communica...
- Patent number 10,038,232
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a package substrate having an integrate...
- Patent number 10,033,081
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, method of manufacturing electronic circuit, and...
- Patent number 9,596,750
- Issue date Mar 14, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tomoari Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost high frequency device package and methods
- Patent number 9,275,961
- Issue date Mar 1, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adjustable integrated circuit antenna structure
- Patent number 9,276,313
- Issue date Mar 1, 2016
- Broadcom Corporation
- Ahmadreza Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packages with passive devices and methods of forming the same
- Patent number 9,040,381
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency wiring board comprised of interconnected first and s...
- Patent number 9,019,035
- Issue date Apr 28, 2015
- NEC Corporation
- Risato Ohhira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a high frequency device package
- Patent number 8,839,508
- Issue date Sep 23, 2014
- Rosenberger Hochfrequenztechnick GmbH & Co. KG
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit
- Patent number 8,829,659
- Issue date Sep 9, 2014
- Sony Corporation
- Xiaobing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, high frequency module, and radar apparatus
- Patent number 8,760,342
- Issue date Jun 24, 2014
- Kyocera Corporation
- Kazuki Hayata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages with passive devices and methods of forming the same
- Patent number 8,680,647
- Issue date Mar 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable integrated circuit antenna structure
- Patent number 8,659,491
- Issue date Feb 25, 2014
- Broadcom Corporation
- Ahmadreza Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power recovery circuit based on partial standing waves
- Patent number 8,600,442
- Issue date Dec 3, 2013
- Broadcom Corporation
- Ahmadreza Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low cost high frequency device package and methods
- Patent number 8,581,113
- Issue date Nov 12, 2013
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency circuit package and high-frequency circuit device
- Patent number 8,552,304
- Issue date Oct 8, 2013
- Fujitsu Limited
- Satoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with intra-chip clock interface and methods for...
- Patent number 8,520,400
- Issue date Aug 27, 2013
- Broadcom Corporation
- Ahmadreza (Reza) Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power recovery circuit based on partial standing waves
- Patent number 8,478,344
- Issue date Jul 2, 2013
- Broadcom Corporation
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20230245967
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...
- Publication number 20230100769
- Publication date Mar 30, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230018511
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY
- Publication number 20220216175
- Publication date Jul 7, 2022
- Wolfspeed, Inc.
- Sung Chul JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE RF WAVEGUIDES AS HIGH BANDWIDTH CHIP-TO-CHIP INTERCONNEC...
- Publication number 20220084965
- Publication date Mar 17, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LAYER RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGE AND RELATED...
- Publication number 20210368615
- Publication date Nov 25, 2021
- Nadav Snir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Processes for Increasing Semiconductor Device Reliability
- Publication number 20210111144
- Publication date Apr 15, 2021
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE DEVICE HAVING SUBSTRATE STACK
- Publication number 20200403299
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING PLANAR WAVEGUIDE TRANSMISSION LINES
- Publication number 20200388583
- Publication date Dec 10, 2020
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE RF WAVEGUIDES AS HIGH BANDWIDTH CHIP-TO-CHIP INTERCONNEC...
- Publication number 20200118951
- Publication date Apr 16, 2020
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20190371748
- Publication date Dec 5, 2019
- Sony Semiconductor Solutions Corporation
- YUJI KIYOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP SCALE PACKAGES
- Publication number 20190287869
- Publication date Sep 19, 2019
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP SCALE PACKAGES
- Publication number 20190172764
- Publication date Jun 6, 2019
- Nuvotronics, INC
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...
- Publication number 20160336282
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE INTEGRATED CIRCUIT ANTENNA STRUCTURE
- Publication number 20140118216
- Publication date May 1, 2014
- BROADCOM CORPORATION
- Ahmadreza Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Passive Devices and Methods of Forming the Same
- Publication number 20140073091
- Publication date Mar 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RECOVERY CIRCUIT BASED ON PARTIAL STANDING WAVES
- Publication number 20130260708
- Publication date Oct 3, 2013
- Ahmadreza Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Passive Devices and Methods of Forming the Same
- Publication number 20130168805
- Publication date Jul 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT, METHOD OF MANUFACTURING ELECTRONIC CIRCUIT, AND...
- Publication number 20130114218
- Publication date May 9, 2013
- SONY CORPORATION
- Tomoari Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE INTEGRATED CIRCUIT ANTENNA STRUCTURE
- Publication number 20130063324
- Publication date Mar 14, 2013
- BROADCOM CORPORATION
- Ahmadreza Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS
- Publication number 20120234588
- Publication date Sep 20, 2012
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT WITH INTRA-CHIP CLOCK INTERFACE AND METHODS FOR...
- Publication number 20120069537
- Publication date Mar 22, 2012
- BROADCOM CORPORATION
- Ahmadreza (Reza) Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS
- Publication number 20120066894
- Publication date Mar 22, 2012
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT PACKAGE AND HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20120061133
- Publication date Mar 15, 2012
- FUJITSU LIMITED
- Satoshi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC MICROWAVE INTEGRATED CIRCUIT
- Publication number 20120063097
- Publication date Mar 15, 2012
- Raytheon Company
- Shahed Reza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board, High Frequency Module, and Radar Apparatus
- Publication number 20120013499
- Publication date Jan 19, 2012
- KYOCERA CORPORATION
- Kazuki Hayata
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT WITH SUPPLY LINE INTRA-CHIP CLOCK INTERFACE AND...
- Publication number 20110273008
- Publication date Nov 10, 2011
- BROADCOM CORPORATION
- Ahmadreza (Reza) Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE INTEGRATED CIRCUIT ANTENNA STRUCTURE
- Publication number 20110221643
- Publication date Sep 15, 2011
- BROADCOM CORPORATION
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
- Publication number 20110186974
- Publication date Aug 4, 2011
- National Chiao Tung University
- Edward-yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY WIRING BOARD AND HIGH-FREQUENCY MODULE THAT USES THE...
- Publication number 20110128100
- Publication date Jun 2, 2011
- Risato Ohhira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

being a coplanar line type

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density interconnection and wiring layers, package structures,...

In-package RF waveguides as high bandwidth chip-to-chip interconnec...

Semiconductor devices comprising planar waveguide transmission lines

Systems and processes for increasing semiconductor device reliability

Semiconductor package and manufacturing method thereof

Semiconductor chip

Systems and processes for increasing semiconductor device reliability

Single layer radio frequency integrated circuit package and related...

In-package RF waveguides as high bandwidth chip-to-chip interconnec...

Antenna in package device having substrate stack

Integrated chip scale packages

Integrated chip scale packages

Waveguide including first and second metal plates and having a slot...

Semiconductor wafer including an integrated waveguide for communica...

Package structure including a package substrate having an integrate...

Electronic circuit, method of manufacturing electronic circuit, and...

Low cost high frequency device package and methods

Adjustable integrated circuit antenna structure

Packages with passive devices and methods of forming the same

High frequency wiring board comprised of interconnected first and s...

Method of making a high frequency device package

Integrated circuit

Circuit board, high frequency module, and radar apparatus

Packages with passive devices and methods of forming the same

Adjustable integrated circuit antenna structure

Power recovery circuit based on partial standing waves

Low cost high frequency device package and methods

High-frequency circuit package and high-frequency circuit device

Integrated circuit with intra-chip clock interface and methods for...

Power recovery circuit based on partial standing waves

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY

IN-PACKAGE RF WAVEGUIDES AS HIGH BANDWIDTH CHIP-TO-CHIP INTERCONNEC...

SINGLE LAYER RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGE AND RELATED...

Systems and Processes for Increasing Semiconductor Device Reliability

ANTENNA IN PACKAGE DEVICE HAVING SUBSTRATE STACK

SEMICONDUCTOR DEVICES COMPRISING PLANAR WAVEGUIDE TRANSMISSION LINES

IN-PACKAGE RF WAVEGUIDES AS HIGH BANDWIDTH CHIP-TO-CHIP INTERCONNEC...

SEMICONDUCTOR CHIP

INTEGRATED CHIP SCALE PACKAGES

INTEGRATED CHIP SCALE PACKAGES

PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...

ADJUSTABLE INTEGRATED CIRCUIT ANTENNA STRUCTURE

Packages with Passive Devices and Methods of Forming the Same

POWER RECOVERY CIRCUIT BASED ON PARTIAL STANDING WAVES

Packages with Passive Devices and Methods of Forming the Same

ELECTRONIC CIRCUIT, METHOD OF MANUFACTURING ELECTRONIC CIRCUIT, AND...

ADJUSTABLE INTEGRATED CIRCUIT ANTENNA STRUCTURE

LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS

INTEGRATED CIRCUIT WITH INTRA-CHIP CLOCK INTERFACE AND METHODS FOR...

LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS

HIGH-FREQUENCY CIRCUIT PACKAGE AND HIGH-FREQUENCY CIRCUIT DEVICE

MONOLITHIC MICROWAVE INTEGRATED CIRCUIT

Circuit Board, High Frequency Module, and Radar Apparatus

INTEGRATED CIRCUIT WITH SUPPLY LINE INTRA-CHIP CLOCK INTERFACE AND...

ADJUSTABLE INTEGRATED CIRCUIT ANTENNA STRUCTURE

HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE

HIGH-FREQUENCY WIRING BOARD AND HIGH-FREQUENCY MODULE THAT USES THE...