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being a fiber hosted LASER

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  • CPC
  • H01L2924/4035
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/4035being a fiber hosted LASER
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding device
    • Patent number 9,437,571
    • Issue date Sep 6, 2016
    • Shibuya Kogyo Co., Ltd.
    • Hiroyuki Yasuyoshi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING DEVICE
    • Publication number 20150171048
    • Publication date Jun 18, 2015
    • SHIBUYA KOGYO CO., LTD.
    • Hiroyuki YASUYOSHI
    • H01 - BASIC ELECTRIC ELEMENTS