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H01L2924/4035

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/4035being a fiber hosted LASER

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Patents Grantslast 30 patents

Information Patent Grant
Bonding device
- Patent number 9,437,571
- Issue date Sep 6, 2016
- Shibuya Kogyo Co., Ltd.
- Hiroyuki Yasuyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING DEVICE
- Publication number 20150171048
- Publication date Jun 18, 2015
- SHIBUYA KOGYO CO., LTD.
- Hiroyuki YASUYOSHI
- H01 - BASIC ELECTRIC ELEMENTS