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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/15313
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Patents Grants
last 30 patents
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Patent Grant
Methods related to radio-frequency switching devices having improve...
Patent number
11,901,243
Issue date
Feb 13, 2024
Skyworks Solutions, Inc.
Guillaume Alexandre Blin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with routing patch and conductive interconnec...
Patent number
11,901,335
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,894,308
Issue date
Feb 6, 2024
Advanced Semiconductor Engineering, Inc.
Sheng-Ming Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices related to dual-sided module with land-grid array (LGA) foo...
Patent number
11,894,323
Issue date
Feb 6, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,848,294
Issue date
Dec 19, 2023
Intel Corporation
Christoph Kutter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component
Patent number
11,817,846
Issue date
Nov 14, 2023
Murata Manufacturing Co., Ltd.
Yasuaki Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Land grid array patterns for modular electronics platforms and meth...
Patent number
11,798,902
Issue date
Oct 24, 2023
Hand Held Products, Inc.
Bruce Morton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack assembly for radio-frequency applications
Patent number
11,785,853
Issue date
Oct 10, 2023
Skyworks Solutions, Inc.
Hardik Bhupendra Modi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board with phase change material
Patent number
11,742,259
Issue date
Aug 29, 2023
Advanced Micro Devices, Inc.
Manish Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process including a re-etching process for forming a semiconductor...
Patent number
11,742,317
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patch on interposer package with wireless communication interface
Patent number
11,737,154
Issue date
Aug 22, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating electronic package
Patent number
11,728,178
Issue date
Aug 15, 2023
Siliconware Precision Industries Co., Ltd.
Shu-Chi Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and methods for bias switching of power amplifiers
Patent number
11,728,773
Issue date
Aug 15, 2023
Skyworks Solutions, Inc.
Netsanet Gebeyehu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor package and manufacturing method thereof
Patent number
11,682,598
Issue date
Jun 20, 2023
Amkor Technology Singapore Holding Pte.
Ji Young Chung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
Patent number
11,676,889
Issue date
Jun 13, 2023
Intel Corporation
Arnab Sarkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of making a semiconductor device
Patent number
11,664,447
Issue date
May 30, 2023
Nexperia B.V.
Jeroen Croon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including antenna substrate and manufacturing...
Patent number
11,664,580
Issue date
May 30, 2023
Advanced Semiconductor Engineering, Inc.
Han-Chee Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under-bump-metallization structure and redistribution layer design...
Patent number
11,631,658
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
Patent number
11,626,372
Issue date
Apr 11, 2023
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective EMI shielding using preformed mask with fang design
Patent number
11,616,025
Issue date
Mar 28, 2023
STATS ChipPAC Pte. Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,587,902
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,557,561
Issue date
Jan 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package for integrated circuits and related methods
Patent number
11,538,717
Issue date
Dec 27, 2022
Texas Instruments Incorporated
Kurt Peter Wachtler
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Package device
Patent number
11,488,899
Issue date
Nov 1, 2022
Innolux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminated component carrier with a thermoplastic structure
Patent number
11,483,923
Issue date
Oct 25, 2022
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Thomas Krivec
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Zinc layer for a semiconductor die pillar
Patent number
11,443,996
Issue date
Sep 13, 2022
Texas Instruments Incorporated
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF devices and methods thereof involving a vertical switched filter...
Patent number
11,437,696
Issue date
Sep 6, 2022
Knowles Cazenovia, Inc.
David Bates
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating package structure having encapsulate sensing...
Patent number
11,404,361
Issue date
Aug 2, 2022
Siliconware Precision Industries Co., Ltd.
Shao-Tzu Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and methods for bias switching of power amplifiers
Patent number
11,394,347
Issue date
Jul 19, 2022
Skyworks Solutions, Inc.
Netsanet Gebeyehu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming an integrated SiP module...
Patent number
11,367,690
Issue date
Jun 21, 2022
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
Publication number
20240114794
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Hardik Bhupendra MODI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Standoff And Support Structures for Reliable Land Grid Array and Hy...
Publication number
20240008208
Publication date
Jan 4, 2024
International Business Machines Corporation
Mark K. Hoffmeyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
Publication number
20230352442
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Co., Ltd.
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20230343603
Publication date
Oct 26, 2023
Siliconware Precision Industries CO, Ltd
Shu-Chi Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Conductive Vias to Have...
Publication number
20230275013
Publication date
Aug 31, 2023
STATS ChipPAC Pte Ltd.
SungSoo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
Publication number
20230253384
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
Publication number
20230223361
Publication date
Jul 13, 2023
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE BASE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230223327
Publication date
Jul 13, 2023
Samsung Electronics Co., Ltd.
Minkyeong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
Publication number
20230207485
Publication date
Jun 29, 2023
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKING A SEMICONDUCTOR DIE AND CHIP-SCALE-PACKAGE UNIT
Publication number
20230137977
Publication date
May 4, 2023
NXP B.V.
Akhilesh Kumar Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Laminated Component Carrier With a Thermoplastic Structure
Publication number
20230054846
Publication date
Feb 23, 2023
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Thomas Krivec
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Zinc Layer For A Semiconductor Die Pillar
Publication number
20230005807
Publication date
Jan 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACTIVATION OF DYNAMIC FILTER GENERATION FOR MESSAGE MANAGEMENT SYST...
Publication number
20220392775
Publication date
Dec 8, 2022
DROPBOX, INC.
Adam Cue
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
Publication number
20220338342
Publication date
Oct 20, 2022
Skyworks Solutions, Inc.
Shaul BRANCHEVSKY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLOCK-GATING IN DIE-TO-DIE (D2D) INTERCONNECTS
Publication number
20220262756
Publication date
Aug 18, 2022
Narasimha Lanka
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20220246542
Publication date
Aug 4, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Ji Young CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY SYSTEM
Publication number
20220229587
Publication date
Jul 21, 2022
KIOXIA Corporation
Manabu MATSUMOTO
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
Publication number
20220199545
Publication date
Jun 23, 2022
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...
Publication number
20220148984
Publication date
May 12, 2022
Skyworks Solutions, Inc.
Howard E. CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
Publication number
20220013415
Publication date
Jan 13, 2022
Skyworks Solutions, Inc.
Guillaume Alexandre BLIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...
Publication number
20220013414
Publication date
Jan 13, 2022
Skyworks Solutions, Inc.
Guillaume Alexandre BLIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATCH ON INTERPOSER PACKAGE WITH WIRELESS COMMUNICATION INTERFACE
Publication number
20210400740
Publication date
Dec 23, 2021
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACK ASSEMBLY FOR RADIO-FREQUENCY APPLICATIONS
Publication number
20210376224
Publication date
Dec 2, 2021
Skyworks Solutions, Inc.
Hardik Bhupendra MODI
G01 - MEASURING TESTING
Information
Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
Publication number
20210366883
Publication date
Nov 25, 2021
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD WITH PHASE CHANGE MATERIAL
Publication number
20210313248
Publication date
Oct 7, 2021
ADVANCED MICRO DEVICES, INC.
MANISH ARORA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID READOUT PACKAGE FOR QUANTUM MULTICHIP BONDING
Publication number
20210305165
Publication date
Sep 30, 2021
International Business Machines Corporation
Dongbing Shao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LAND GRID ARRAY PATTERNS FOR MODULAR ELECTRONICS PLATFORMS AND METH...
Publication number
20210159195
Publication date
May 27, 2021
Hand Held Products, Inc.
Bruce Morton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
Publication number
20210143021
Publication date
May 13, 2021
Siliconware Precision Industries Co., Ltd.
Shu-Chi Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE PACKAGE
Publication number
20210090970
Publication date
Mar 25, 2021
Analog Devices, Inc.
Brian Hall
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS
Publication number
20210090940
Publication date
Mar 25, 2021
TEXAS INSTRUMENTS INCORPORATED
Kurt Peter Wachtler
B81 - MICRO-STRUCTURAL TECHNOLOGY