being a land array

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CPC
H01L2924/15313

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15313being a land array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,040,238
- Issue date Jul 16, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 12,033,868
- Issue date Jul 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 12,002,793
- Issue date Jun 4, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,996,381
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to radio-frequency switching devices having improve...
- Patent number 11,901,243
- Issue date Feb 13, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with routing patch and conductive interconnec...
- Patent number 11,901,335
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,894,308
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices related to dual-sided module with land-grid array (LGA) foo...
- Patent number 11,894,323
- Issue date Feb 6, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,294
- Issue date Dec 19, 2023
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,817,846
- Issue date Nov 14, 2023
- Murata Manufacturing Co., Ltd.
- Yasuaki Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array patterns for modular electronics platforms and meth...
- Patent number 11,798,902
- Issue date Oct 24, 2023
- Hand Held Products, Inc.
- Bruce Morton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack assembly for radio-frequency applications
- Patent number 11,785,853
- Issue date Oct 10, 2023
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with phase change material
- Patent number 11,742,259
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Manish Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process including a re-etching process for forming a semiconductor...
- Patent number 11,742,317
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer package with wireless communication interface
- Patent number 11,737,154
- Issue date Aug 22, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,728,178
- Issue date Aug 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for bias switching of power amplifiers
- Patent number 11,728,773
- Issue date Aug 15, 2023
- Skyworks Solutions, Inc.
- Netsanet Gebeyehu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 11,676,889
- Issue date Jun 13, 2023
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of making a semiconductor device
- Patent number 11,664,447
- Issue date May 30, 2023
- Nexperia B.V.
- Jeroen Croon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna substrate and manufacturing...
- Patent number 11,664,580
- Issue date May 30, 2023
- Advanced Semiconductor Engineering, Inc.
- Han-Chee Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallization structure and redistribution layer design...
- Patent number 11,631,658
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask with fang design
- Patent number 11,616,025
- Issue date Mar 28, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,587,902
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20240321591
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240274567
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20240266324
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20240249982
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...
- Publication number 20240250045
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213168
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
- Publication number 20240114794
- Publication date Apr 4, 2024
- Skyworks Solutions, Inc.
- Hardik Bhupendra MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoff And Support Structures for Reliable Land Grid Array and Hy...
- Publication number 20240008208
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230343603
- Publication date Oct 26, 2023
- Siliconware Precision Industries CO, Ltd
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias to Have...
- Publication number 20230275013
- Publication date Aug 31, 2023
- STATS ChipPAC Pte Ltd.
- SungSoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
- Publication number 20230253384
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BASE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230223327
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20230207485
- Publication date Jun 29, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING A SEMICONDUCTOR DIE AND CHIP-SCALE-PACKAGE UNIT
- Publication number 20230137977
- Publication date May 4, 2023
- NXP B.V.
- Akhilesh Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zinc Layer For A Semiconductor Die Pillar
- Publication number 20230005807
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVATION OF DYNAMIC FILTER GENERATION FOR MESSAGE MANAGEMENT SYST...
- Publication number 20220392775
- Publication date Dec 8, 2022
- DROPBOX, INC.
- Adam Cue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20220338342
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOCK-GATING IN DIE-TO-DIE (D2D) INTERCONNECTS
- Publication number 20220262756
- Publication date Aug 18, 2022
- Narasimha Lanka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220246542
- Publication date Aug 4, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM
- Publication number 20220229587
- Publication date Jul 21, 2022
- KIOXIA Corporation
- Manabu MATSUMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20220199545
- Publication date Jun 23, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...
- Publication number 20220148984
- Publication date May 12, 2022
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20220013415
- Publication date Jan 13, 2022
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...
- Publication number 20220013414
- Publication date Jan 13, 2022
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH ON INTERPOSER PACKAGE WITH WIRELESS COMMUNICATION INTERFACE
- Publication number 20210400740
- Publication date Dec 23, 2021
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK ASSEMBLY FOR RADIO-FREQUENCY APPLICATIONS
- Publication number 20210376224
- Publication date Dec 2, 2021
- Skyworks Solutions, Inc.
- Hardik Bhupendra MODI
- G01 - MEASURING TESTING

being a land array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Guard ring design enabling in-line testing of silicon bridges for s...

Metal-free frame design for silicon bridges for semiconductor packages

Devices and methods related to metallization of ceramic substrates...

Laminated component carrier with a thermoplastic structure

Radio-frequency switching devices having improved voltage handling...

Electronic package and method for fabricating the same

Integrating system in package (SiP) with input/output (IO) board fo...

Sensor package and manufacturing method thereof

Package structure and method of fabricating the same

Methods related to radio-frequency switching devices having improve...

Semiconductor package with routing patch and conductive interconnec...

Semiconductor package and method of manufacturing the same

Devices related to dual-sided module with land-grid array (LGA) foo...

Semiconductor device

Electronic component

Land grid array patterns for modular electronics platforms and meth...

Stack assembly for radio-frequency applications

Circuit board with phase change material

Process including a re-etching process for forming a semiconductor...

Patch on interposer package with wireless communication interface

Method for fabricating electronic package

Apparatus and methods for bias switching of power amplifiers

Sensor package and manufacturing method thereof

Guard ring design enabling in-line testing of silicon bridges for s...

Semiconductor device and a method of making a semiconductor device

Semiconductor package including antenna substrate and manufacturing...

Under-bump-metallization structure and redistribution layer design...

Metal-free frame design for silicon bridges for semiconductor packages

Selective EMI shielding using preformed mask with fang design

Semiconductor structure and method of forming the same

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DEVICES AND METHODS RELATED TO STACK ASSEMBLY

Standoff And Support Structures for Reliable Land Grid Array and Hy...

Process Including a Re-etching Process for Forming a Semiconductor...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

Semiconductor Device and Method of Forming Conductive Vias to Have...

UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

PACKAGE BASE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Selective EMI Shielding Using Preformed Mask with Fang Design

STACKING A SEMICONDUCTOR DIE AND CHIP-SCALE-PACKAGE UNIT

Laminated Component Carrier With a Thermoplastic Structure

Zinc Layer For A Semiconductor Die Pillar

ACTIVATION OF DYNAMIC FILTER GENERATION FOR MESSAGE MANAGEMENT SYST...

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

CLOCK-GATING IN DIE-TO-DIE (D2D) INTERCONNECTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MEMORY SYSTEM

Selective EMI Shielding Using Preformed Mask with Fang Design

DEVICES RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...

PATCH ON INTERPOSER PACKAGE WITH WIRELESS COMMUNICATION INTERFACE

STACK ASSEMBLY FOR RADIO-FREQUENCY APPLICATIONS