being a non conformal layer on a patterned surface

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H01L2224/05019

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05019being a non conformal layer on a patterned surface

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, redistribution layer (RDL) structure, and...
- Patent number 11,798,904
- Issue date Oct 24, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device including a force mitigation system...
- Patent number 11,682,642
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,581,279
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 11,476,212
- Issue date Oct 18, 2022
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,456,265
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad layer system, gas sensor and method for manufacturing a...
- Patent number 11,407,635
- Issue date Aug 9, 2022
- Robert Bosch GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,362,052
- Issue date Jun 14, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,189,583
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,004,814
- Issue date May 11, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact structure having stress buffer layer formed b...
- Patent number 10,903,179
- Issue date Jan 26, 2021
- United Microelectronics Corporation
- Yu-Jie Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device including a force mitigation system...
- Patent number 10,896,888
- Issue date Jan 19, 2021
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact hole structure and fabricating method of contact hole and f...
- Patent number 10,600,749
- Issue date Mar 24, 2020
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,522,487
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a surface insulating layter and manufac...
- Patent number 10,497,791
- Issue date Dec 3, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xianming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact hole structure and fabricating method of contact hole and f...
- Patent number 10,396,048
- Issue date Aug 27, 2019
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a surface insulator layer and manufactu...
- Patent number 10,312,093
- Issue date Jun 4, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xianming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a pad structure having enhanced rel...
- Patent number 9,911,707
- Issue date Mar 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a TSV, a front-side bumping pad, and a...
- Patent number 9,806,004
- Issue date Oct 31, 2017
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,786,619
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,711,468
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common drain semiconductor device structure and method
- Patent number 9,607,984
- Issue date Mar 28, 2017
- Semiconductor Components Industries, LLC
- Kazumasa Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 9,576,923
- Issue date Feb 21, 2017
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chromium/titanium/aluminum-based semiconductor device contact fabri...
- Patent number 9,514,947
- Issue date Dec 6, 2016
- Sensor Electronic Technology, Inc.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming multi-layered UBM with i...
- Patent number 9,252,093
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure with underbump metallization structure and integrate...
- Patent number 9,190,373
- Issue date Nov 17, 2015
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a chromium/titanium/aluminum-based semicondu...
- Patent number 9,064,845
- Issue date Jun 23, 2015
- Sensor Electronic Technology, Inc.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,041,204
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
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- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187393
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSING SIGNALS THROUGH MICRO DEVICE SIDEWALLS
- Publication number 20230170317
- Publication date Jun 1, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220392858
- Publication date Dec 8, 2022
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENT AND OPTICAL CONCENTRATION MEASURING APPARATUS
- Publication number 20220268693
- Publication date Aug 25, 2022
- ASAHI KASEI MICRODEVICES CORPORATION
- Daiki YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, REDISTRIBUTION LAYER (RDL) STRUCTURE, AND...
- Publication number 20210242149
- Publication date Aug 5, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233879
- Publication date Jul 29, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210202413
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Chang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...
- Publication number 20210104478
- Publication date Apr 8, 2021
- UNITED MICROELECTRONICS CORPORATION
- YU-JIE LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit (IC) Device Including A Force Mitigation System...
- Publication number 20200411462
- Publication date Dec 31, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200343207
- Publication date Oct 29, 2020
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20200251432
- Publication date Aug 6, 2020
- UNITED MICROELECTRONICS CORPORATION
- YU-JIE LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD LAYER SYSTEM, GAS SENSOR AND METHOD FOR MANUFACTURING A...
- Publication number 20200140261
- Publication date May 7, 2020
- ROBERT BOSCH GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200144207
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190385964
- Publication date Dec 19, 2019
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT HOLE STRUCTURE AND FABRICATING METHOD OF CONTACT HOLE AND F...
- Publication number 20190333884
- Publication date Oct 31, 2019
- UNITED MICROELECTRONICS CORP.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20190252194
- Publication date Aug 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xianming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20180277644
- Publication date Sep 27, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xianming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180033749
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170194273
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- SHENG-CHAU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chromium/Titanium/Aluminum-based Semiconductor Device Contact
- Publication number 20140308766
- Publication date Oct 16, 2014
- SENSOR ELECTRONIC TECHNOLOGY, INC.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING A PAD STRUCTURE HAVING ENHANCED REL...
- Publication number 20140225253
- Publication date Aug 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Multi-Layered UBM with I...
- Publication number 20140070410
- Publication date Mar 13, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions and Methods of Planarizing Across a Plu...
- Publication number 20130309861
- Publication date Nov 21, 2013
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20130256893
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCTIONS
- Publication number 20130234319
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD STRUCTURE FOR THICKNESS ENHANCEMENT OF POLYMER USED IN EL...
- Publication number 20130119534
- Publication date May 16, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
- Publication number 20130009286
- Publication date Jan 10, 2013
- Samsung Electronics Co., Ltd.
- Young-lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connection Region on a Side Wall of a Semico...
- Publication number 20120289047
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS

being a non conformal layer on a patterned surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Interposer, method for fabricating the same, and semiconductor pack...

Semiconductor structure, redistribution layer (RDL) structure, and...

Integrated circuit (IC) device including a force mitigation system...

Semiconductor device

Semiconductor contact structure having stress buffer layer formed b...

Semiconductor device and method of manufacturing the same

Bonding pad layer system, gas sensor and method for manufacturing a...

Semiconductor device package and method of manufacturing the same

Semiconductor chip with patterned underbump metallization and polym...

Semiconductor structure and manufacturing method thereof

Semiconductor device

Semiconductor contact structure having stress buffer layer formed b...

Integrated circuit (IC) device including a force mitigation system...

Contact hole structure and fabricating method of contact hole and f...

Semiconductor structure and manufacturing method thereof

Semiconductor device having a surface insulating layter and manufac...

Contact hole structure and fabricating method of contact hole and f...

Semiconductor device having a surface insulator layer and manufactu...

Structure and method of forming a pad structure having enhanced rel...

Semiconductor devices having a TSV, a front-side bumping pad, and a...

Semiconductor structure and manufacturing method thereof

Bonding pad structure with dense via array

Common drain semiconductor device structure and method

Semiconductor chip with patterned underbump metallization and polym...

Chromium/titanium/aluminum-based semiconductor device contact fabri...

Semiconductor device and method of forming multi-layered UBM with i...

Bump structure with underbump metallization structure and integrate...

Methods of fabricating a chromium/titanium/aluminum-based semicondu...

Bonding pad structure with dense via array

Patents Applicationslast 30 patents

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

THICK REDISTRIBUTION LAYER FEATURES

SEMICONDUCTOR DEVICE

PASSING SIGNALS THROUGH MICRO DEVICE SIDEWALLS

SEMICONDUCTOR DEVICE

OPTICAL ELEMENT AND OPTICAL CONCENTRATION MEASURING APPARATUS

SEMICONDUCTOR STRUCTURE, REDISTRIBUTION LAYER (RDL) STRUCTURE, AND...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...

Integrated Circuit (IC) Device Including A Force Mitigation System...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

BONDING PAD LAYER SYSTEM, GAS SENSOR AND METHOD FOR MANUFACTURING A...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

CONTACT HOLE STRUCTURE AND FABRICATING METHOD OF CONTACT HOLE AND F...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Chromium/Titanium/Aluminum-based Semiconductor Device Contact

STRUCTURE AND METHOD OF FORMING A PAD STRUCTURE HAVING ENHANCED REL...

Semiconductor Device and Method of Forming Multi-Layered UBM with I...

Semiconductor Constructions and Methods of Planarizing Across a Plu...

BONDING PAD STRUCTURE WITH DENSE VIA ARRAY

SEMICONDUCTOR CONSTRUCTIONS

METAL PAD STRUCTURE FOR THICKNESS ENHANCEMENT OF POLYMER USED IN EL...

SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME

Method for Producing a Connection Region on a Side Wall of a Semico...