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H01L2224/48477

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48477being a pre-ball (

Industries

Patents Grantslast 30 patents

Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wire bonding technique for integrated circuit board connections
- Patent number 10,600,756
- Issue date Mar 24, 2020
- United States of America, as represented by the Secretary of the Navy
- Evan A. Aanerud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,754,865
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Takanori Yamashita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Automatic wire tail adjustment system for wire bonders
- Patent number 9,502,374
- Issue date Nov 22, 2016
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts
- Patent number 9,461,015
- Issue date Oct 4, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 9,147,623
- Issue date Sep 29, 2015
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,816,514
- Issue date Aug 26, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 8,803,307
- Issue date Aug 12, 2014
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts
- Patent number 8,787,032
- Issue date Jul 22, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 8,501,546
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,410,618
- Issue date Apr 2, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,395,260
- Issue date Mar 12, 2013
- Fujitsu Semiconductor Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with plank stack of semiconductor dies
- Patent number 8,390,109
- Issue date Mar 5, 2013
- Oracle America, Inc.
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,319,354
- Issue date Nov 27, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,132,709
- Issue date Mar 13, 2012
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 8,093,702
- Issue date Jan 10, 2012
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,084,277
- Issue date Dec 27, 2011
- Fujitsu Semiconductor Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,008,785
- Issue date Aug 30, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,004,092
- Issue date Aug 23, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,550,844
- Issue date Jun 23, 2009
- Fujitsu Microelectronics Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low loop wire bonding
- Patent number 7,475,802
- Issue date Jan 13, 2009
- Texas Instruments Incorporated
- Kaoru Yajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 7,397,121
- Issue date Jul 8, 2008
- Megica Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-dimension microelectronic component assemblies with wire bo...
- Patent number 7,385,298
- Issue date Jun 10, 2008
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bumping die pads for wafer testing
- Patent number 7,160,797
- Issue date Jan 9, 2007
- Kulicke and Soffa Industries, Inc.
- David T. Beatson
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor component having conductors with wire bondable metali...
- Patent number 7,132,750
- Issue date Nov 7, 2006
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-dimension microelectronic component assemblies with wire bo...
- Patent number 7,095,122
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-ball wire bonds
- Patent number 7,064,433
- Issue date Jun 20, 2006
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for integrated circuit ball bonding using sta...
- Patent number 7,009,305
- Issue date Mar 7, 2006
- Agere Systems Inc.
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor components with conductors hav...
- Patent number 6,887,787
- Issue date May 3, 2005
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having conductors with wire bondable metali...
- Patent number 6,784,544
- Issue date Aug 31, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170323848
- Publication date Nov 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140374890
- Publication date Dec 25, 2014
- Renesas Electronics Corporation
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20140346683
- Publication date Nov 27, 2014
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
- Publication number 20140239513
- Publication date Aug 28, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20130292834
- Publication date Nov 7, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20130292854
- Publication date Nov 7, 2013
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC WIRE TAIL ADJUSTMENT SYSTEM FOR WIRE BONDERS
- Publication number 20130098877
- Publication date Apr 25, 2013
- Keng Yew SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
- Publication number 20120155049
- Publication date Jun 21, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20120108010
- Publication date May 3, 2012
- Micron Technology, Inc.
- Edmund Lua Koon Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120061847
- Publication date Mar 15, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110285020
- Publication date Nov 24, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20110266669
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110147953
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20090230560
- Publication date Sep 17, 2009
- Fujitsu Microelectronics Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20090045496
- Publication date Feb 19, 2009
- Micron Technology, Inc.
- Edmund Lua Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BO...
- Publication number 20080296781
- Publication date Dec 4, 2008
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20080265413
- Publication date Oct 30, 2008
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080116591
- Publication date May 22, 2008
- Nichia Corporation.
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070228561
- Publication date Oct 4, 2007
- FUJITSU LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip with post-passivation scheme formed over passiva...
- Publication number 20070096313
- Publication date May 3, 2007
- MEGIC Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor component having conductors an...
- Publication number 20070048999
- Publication date Mar 1, 2007
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced-dimension microelectronic component assemblies with wire bo...
- Publication number 20070029681
- Publication date Feb 8, 2007
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit packaging device and method for matching impedance
- Publication number 20060138650
- Publication date Jun 29, 2006
- Freescale Semiconductor, Inc.
- Fernando N. Hidalgo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced-dimension microelectronic component assemblies with wire bo...
- Publication number 20060043611
- Publication date Mar 2, 2006
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATED CIRCUIT BALL BONDING USING STA...
- Publication number 20060001157
- Publication date Jan 5, 2006
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of bumping die pads for wafer testing
- Publication number 20050253140
- Publication date Nov 17, 2005
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- G01 - MEASURING TESTING
Information Patent Application
System and method for low loop wire bonding
- Publication number 20050242159
- Publication date Nov 3, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Kaoru Yajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multiple-ball wire bonds
- Publication number 20050191839
- Publication date Sep 1, 2005
- ASM Technology Singapore Pte Ltd
- Yam Mo Wong
- H01 - BASIC ELECTRIC ELEMENTS

being a pre-ball (

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Curtain airbag device mounting structure and curtain airbag deploym...

Wire bonding technique for integrated circuit board connections

Semiconductor device and method for manufacturing the same

Automatic wire tail adjustment system for wire bonders

Enhanced stacked microelectronic assemblies with central contacts

Stacked microelectronic devices and methods for manufacturing stack...

Microelectronic assembly with joined bond elements having lowered i...

Stacked microelectronic devices and methods for manufacturing stack...

Enhanced stacked microelectronic assemblies with central contacts

Stacked microelectronic devices and methods for manufacturing stack...

Microelectronic assembly with joined bond elements having lowered i...

Semiconductor device and manufacturing method thereof

Chip package with plank stack of semiconductor dies

Semiconductor chip with post-passivation scheme formed over passiva...

Semiconductor device and method for manufacturing same

Stacked microelectronic devices and methods for manufacturing stack...

Semiconductor device and manufacturing method thereof

Microelectronic assembly with joined bond elements having lowered i...

Semiconductor chip with post-passivation scheme formed over passiva...

Semiconductor device and manufacturing method thereof

Method for low loop wire bonding

Semiconductor chip with post-passivation scheme formed over passiva...

Reduced-dimension microelectronic component assemblies with wire bo...

Method of bumping die pads for wafer testing

Semiconductor component having conductors with wire bondable metali...

Reduced-dimension microelectronic component assemblies with wire bo...

Multiple-ball wire bonds

Methods and apparatus for integrated circuit ball bonding using sta...

Method for fabricating semiconductor components with conductors hav...

Semiconductor component having conductors with wire bondable metali...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

AUTOMATIC WIRE TAIL ADJUSTMENT SYSTEM FOR WIRE BONDERS

CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

Semiconductor device and manufacturing method thereof

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BO...

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor device and manufacturing method thereof

Semiconductor chip with post-passivation scheme formed over passiva...

Method for fabricating semiconductor component having conductors an...

Reduced-dimension microelectronic component assemblies with wire bo...

Integrated circuit packaging device and method for matching impedance

Reduced-dimension microelectronic component assemblies with wire bo...

METHODS AND APPARATUS FOR INTEGRATED CIRCUIT BALL BONDING USING STA...

Method of bumping die pads for wafer testing

System and method for low loop wire bonding

Multiple-ball wire bonds