being a removable or sacrificial coating

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81002being a removable or sacrificial coating

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,823,913
- Issue date Nov 21, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for laser assisted bonding of an electronic device
- Patent number 11,742,216
- Issue date Aug 29, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ho Yoon
- G02 - OPTICS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chip package assembly with enhanced interconnects and method for fa...
- Patent number 11,217,550
- Issue date Jan 4, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,158,599
- Issue date Oct 26, 2021
- Sumitomo Bakelite Co., Ltd.
- Tatsuya Kazama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,031,259
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip method
- Patent number 10,770,425
- Issue date Sep 8, 2020
- TONGFU MICROELECTRONCS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for laser assisted bonding of an electronic device
- Patent number 10,763,129
- Issue date Sep 1, 2020
- Amkor Technology, Inc.
- Tae Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 10,734,345
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 10,468,272
- Issue date Nov 5, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for laser assisted bonding of semiconductor die
- Patent number 10,304,698
- Issue date May 28, 2019
- Amkor Technology, Inc.
- Tae Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,163,847
- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 9,929,118
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with thermal interface tape
- Patent number 9,627,281
- Issue date Apr 18, 2017
- Advanced Micro Device, Inc.
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication and testing of three-dimensional stacked int...
- Patent number 9,570,429
- Issue date Feb 14, 2017
- SHANGHAI JADIC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jianhong Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an interposer
- Patent number 9,515,048
- Issue date Dec 6, 2016
- Siliconware Precision Industries Co., Ltd.
- Wen-Kuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for high-density chip connectivity
- Patent number 9,472,529
- Issue date Oct 18, 2016
- TERAPEDE SYSTEMS INC.
- Madhukar B. Vora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip support substrate, chip support method, three-dimensional inte...
- Patent number 9,449,948
- Issue date Sep 20, 2016
- Tohoku University
- Mitsumasa Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 9,412,715
- Issue date Aug 9, 2016
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic field assisted self-assembly with formation of elec...
- Patent number 9,137,935
- Issue date Sep 15, 2015
- The United States of America as represented by the Secretary of the Army
- Christopher James Morris
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 9,119,336
- Issue date Aug 25, 2015
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for high-density chip connectivity
- Patent number 9,082,869
- Issue date Jul 14, 2015
- TERAPEDE SYSTEMS, INC.
- Madhukar B. Vora
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND FABRICATION METHOD THEREOF, AND DISPLAY APPARATUS
- Publication number 20240038781
- Publication date Feb 1, 2024
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Xiaoli LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20210143122
- Publication date May 13, 2021
- SUMITOMO BAKELITE CO., LTD.
- Tatsuya KAZAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...
- Publication number 20200035635
- Publication date Jan 30, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP METHOD
- Publication number 20190385974
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE
- Publication number 20190287816
- Publication date Sep 19, 2019
- Amkor Technology, Inc.
- Tae Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging through Pre-Formed Metal Pins
- Publication number 20180204816
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN INTERPOSER
- Publication number 20160020190
- Publication date Jan 21, 2016
- Siliconware Precision Industries Co., Ltd.
- Wen-Kuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20150024555
- Publication date Jan 22, 2015
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES
- Publication number 20140264854
- Publication date Sep 18, 2014
- Oracle International Corporation
- Hiren D. Thacker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
- Publication number 20140246481
- Publication date Sep 4, 2014
- Hideyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...
- Publication number 20140170813
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICES AND METHODS OF FORMING SAME
- Publication number 20140151823
- Publication date Jun 5, 2014
- Bruce C.S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Self-Assembly of Substrates and Devices Obtained Thereof
- Publication number 20140054771
- Publication date Feb 27, 2014
- IMEC
- Philippe Soussan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...
- Publication number 20130249098
- Publication date Sep 26, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELEC...
- Publication number 20130199831
- Publication date Aug 8, 2013
- Christopher Morris
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20130187293
- Publication date Jul 25, 2013
- Fujitsu Limited
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer Wafer Bonding Method and Apparatus
- Publication number 20130140713
- Publication date Jun 6, 2013
- Taiwan Semiconductro Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure Manufacturing Method, Heating And Melting Treatme...
- Publication number 20130105558
- Publication date May 2, 2013
- AYUMI INDUSTRY CO., LTD.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20130087912
- Publication date Apr 11, 2013
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Devices and Methods of Forming Same
- Publication number 20130020718
- Publication date Jan 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING METHOD
- Publication number 20120329182
- Publication date Dec 27, 2012
- Teppei Kojio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...
- Publication number 20120306085
- Publication date Dec 6, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20120256312
- Publication date Oct 11, 2012
- PANASONIC CORPORATION
- Shinya TSUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120171858
- Publication date Jul 5, 2012
- TOKYO ELECTRON LIMITED
- Haruo Iwatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE VIAS AND METHOD FOR...
- Publication number 20120086120
- Publication date Apr 12, 2012
- Advanced Semiconductor Engineering, Inc.
- Jen-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS

being a removable or sacrificial coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing an electronic device and electronic device...

System and method for laser assisted bonding of an electronic device

Sintering materials and attachment methods using same

Chip package assembly with enhanced interconnects and method for fa...

Method for manufacturing electronic device

Method of manufacturing an electronic device and electronic device...

Mounting Method of a semiconductor device using a colored auxiliary...

Flip-chip method

System and method for laser assisted bonding of an electronic device

Packaging through pre-formed metal pins

Method of manufacturing an electronic device and electronic device...

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Method for producing semiconductor chip

System and method for laser assisted bonding of semiconductor die

Method for producing semiconductor package

Micro-transfer printing with volatile adhesive layer

Packaging through pre-formed metal pins

Method of manufacturing an electronic device, and electronic device...

Semiconductor chip with thermal interface tape

Method and apparatus for chip-to-wafer integration

Electrode connection structure and electrode connection method

Methods of fabrication and testing of three-dimensional stacked int...

Method for fabricating an interposer

Apparatus and methods for high-density chip connectivity

Chip support substrate, chip support method, three-dimensional inte...

Semiconductor device, electronic device, and semiconductor device m...

Chip-on-wafer bonding method and bonding device, and structure comp...

Electromagnetic field assisted self-assembly with formation of elec...

Bonding structure manufacturing method, heating and melting treatme...

Apparatus and methods for high-density chip connectivity

Patents Applicationslast 30 patents

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

DISPLAY PANEL AND FABRICATION METHOD THEREOF, AND DISPLAY APPARATUS

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...

FLIP-CHIP METHOD

SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

Packaging through Pre-Formed Metal Pins

METHOD FOR FABRICATING AN INTERPOSER

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...

METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...

MEMS DEVICES AND METHODS OF FORMING SAME

Method for Self-Assembly of Substrates and Devices Obtained Thereof

PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...

ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELEC...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

Interposer Wafer Bonding Method and Apparatus

Bonding Structure Manufacturing Method, Heating And Melting Treatme...

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

MEMS Devices and Methods of Forming Same

SEMICONDUCTOR DEVICE MOUNTING METHOD

PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE VIAS AND METHOD FOR...