being a removable or sacrificial coating

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82002being a removable or sacrificial coating

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device having air cavity in R...
- Patent number 12,148,731
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a microelectronic device package
- Patent number 9,686,870
- Issue date Jun 20, 2017
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with pre-molding chip bonding
- Patent number 9,659,885
- Issue date May 23, 2017
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,559,078
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting devices in substrate and device-mounting substra...
- Patent number 9,119,332
- Issue date Aug 25, 2015
- Sony Corporation
- Katsuhiro Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with pre-molding chip bonding
- Patent number 8,872,355
- Issue date Oct 28, 2014
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure for high temperature applications
- Patent number 6,229,203
- Issue date May 8, 2001
- General Electric Company
- Robert John Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
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- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY
- Publication number 20240222317
- Publication date Jul 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105661
- Publication date Mar 28, 2024
- Unimicron Technology Corp.
- Yu-Shen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY
- Publication number 20230326904
- Publication date Oct 12, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
- Publication number 20230121991
- Publication date Apr 20, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING MICRO LED
- Publication number 20220231002
- Publication date Jul 21, 2022
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Jaekyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- Publication number 20160141265
- Publication date May 19, 2016
- Intel Corporation
- Liwen Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
- Publication number 20140177193
- Publication date Jun 26, 2014
- Liwen Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PRE-MOLDING CHIP BONDING
- Publication number 20140061954
- Publication date Mar 6, 2014
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20130021766
- Publication date Jan 24, 2013
- INFINEON TECHNOLOGIES AG
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECONDARY DEVICE INTEGRATION INTO CORELESS MICROELECTRONIC DEVICE P...
- Publication number 20120326271
- Publication date Dec 27, 2012
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...
- Publication number 20110266039
- Publication date Nov 3, 2011
- SONY CORPORATION
- Katsuhiro TOMODA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

being a removable or sacrificial coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device having air cavity in R...

Electrical interconnect structure using metal bridges to interconne...

Method of forming a microelectronic device package

Semiconductor device with pre-molding chip bonding

Electrode connection structure and electrode connection method

Electronic component

Light emitting diodes and a method of packaging the same

Light emitting diodes and a method of packaging the same

Method of mounting devices in substrate and device-mounting substra...

Semiconductor device with pre-molding chip bonding

Semiconductor interconnect structure for high temperature applications

Patents Applicationslast 30 patents

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY

CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY

ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...

METHOD FOR TRANSFERRING MICRO LED

BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER

BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER

SEMICONDUCTOR DEVICE WITH PRE-MOLDING CHIP BONDING

Electronic Component

SECONDARY DEVICE INTEGRATION INTO CORELESS MICROELECTRONIC DEVICE P...

METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...