being a removable or sacrificial coating

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80004being a removable or sacrificial coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having hybrid bonding...
- Patent number 11,894,247
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 11,894,335
- Issue date Feb 6, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reusing substrates during manufacture of a bonded assem...
- Patent number 11,398,451
- Issue date Jul 26, 2022
- SanDisk Technologies LLC
- Ashish Baraskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,295,978
- Issue date Apr 5, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having hybrid bonding interface, method of man...
- Patent number 11,257,694
- Issue date Feb 22, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,056,459
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,847,571
- Issue date Nov 24, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,700,120
- Issue date Jun 30, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct bonding with self-alignment using ultrasound
- Patent number 10,438,921
- Issue date Oct 8, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing self-aligned interlockin...
- Patent number 10,381,322
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Yasunobu Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Direct bonding method
- Patent number 10,236,210
- Issue date Mar 19, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Aurélie Tauzin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,134,803
- Issue date Nov 20, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,020,281
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, electronic device, and method of manufactu...
- Patent number 9,379,006
- Issue date Jun 28, 2016
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,048,283
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Transistor formation using cold welding
- Patent number 8,941,147
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Cheng-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bonded semiconductor structures including interc...
- Patent number 8,728,863
- Issue date May 20, 2014
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thin die-to-wafer bonding
- Patent number 8,697,542
- Issue date Apr 15, 2014
- The Research Foundation of State University of New York
- Daniel Pascual
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus, electronic device, and method of manufactu...
- Patent number 8,664,763
- Issue date Mar 4, 2014
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembly of chips on a substrate
- Patent number 8,642,391
- Issue date Feb 4, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030169
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Woon Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230343743
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING
- Publication number 20230260955
- Publication date Aug 17, 2023
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS
- Publication number 20230207515
- Publication date Jun 29, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20230207611
- Publication date Jun 29, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20230100455
- Publication date Mar 30, 2023
- SEMES CO., LTD.
- Hang Lim LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING
- Publication number 20230029338
- Publication date Jan 26, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20220320035
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING SPACERS FOR IMPROVED TOP VIA CRITICAL DIMENSIO...
- Publication number 20220157652
- Publication date May 19, 2022
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20220139869
- Publication date May 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING HYBRID BONDING...
- Publication number 20220059372
- Publication date Feb 24, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210398939
- Publication date Dec 23, 2021
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH REDISTRIBUTION LAYER HAVING BONDING POR...
- Publication number 20210335750
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING HYBRID BONDING INTERFACE, METHOD OF MAN...
- Publication number 20210242050
- Publication date Aug 5, 2021
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20200328249
- Publication date Oct 15, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200058614
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20180358405
- Publication date Dec 13, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20180358404
- Publication date Dec 13, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180269177
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIRECT BONDING WITH SELF-ALIGNMENT USING ULTRASOUND
- Publication number 20180218997
- Publication date Aug 2, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180061804
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR FORMATION USING COLD WELDING
- Publication number 20150311179
- Publication date Oct 29, 2015
- International Business Machines Corporation
- CHENG-WEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, ELECTRONIC DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20140131874
- Publication date May 15, 2014
- SONY CORPORATION
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR FORMATION USING COLD WELDING
- Publication number 20140094006
- Publication date Apr 3, 2014
- International Business Machines Corporation
- CHENG-WEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR FORMATION USING COLD WELDING
- Publication number 20140091370
- Publication date Apr 3, 2014
- International Business Machines Corporation
- CHENG-WEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20140011324
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING
- Publication number 20130273691
- Publication date Oct 17, 2013
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Daniel PASCUAL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

being a removable or sacrificial coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnects having spacers for improved top via critical dimensio...

Method of manufacturing semiconductor device having hybrid bonding...

Display device and method for manufacturing the same

Micro device integration into system substrate

Methods for reusing substrates during manufacture of a bonded assem...

Interconnects having spacers for improved top via critical dimensio...

Semiconductor device having hybrid bonding interface, method of man...

Chip package structure and method for forming the same

Method for transferring micro device

Micro device integration into system substrate

Metal bonding pads for packaging applications

Micro device integration into system substrate

Method for direct bonding with self-alignment using ultrasound

Three-dimensional memory device containing self-aligned interlockin...

Metal bonding pads for packaging applications

Hybrid bonding systems and methods for semiconductor wafers

Direct bonding method

Micro device integration into system substrate

Hybrid bonding systems and methods for semiconductor wafers

Metal bonding pads for packaging applications

Hybrid bonding systems and methods for semiconductor wafers

Semiconductor apparatus, electronic device, and method of manufactu...

Hybrid bonding systems and methods for semiconductor wafers

Transistor formation using cold welding

Methods of forming bonded semiconductor structures including interc...

Method for thin die-to-wafer bonding

Semiconductor apparatus, electronic device, and method of manufactu...

Self-assembly of chips on a substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME

A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING

METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

BONDING METHOD

METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING

DIRECT BONDING METHODS AND STRUCTURES

INTERCONNECTS HAVING SPACERS FOR IMPROVED TOP VIA CRITICAL DIMENSIO...

DIRECT BONDING METHODS AND STRUCTURES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING HYBRID BONDING...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE WITH REDISTRIBUTION LAYER HAVING BONDING POR...

SEMICONDUCTOR DEVICE HAVING HYBRID BONDING INTERFACE, METHOD OF MAN...

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

METAL BONDING PADS FOR PACKAGING APPLICATIONS

Hybrid Bonding Systems and Methods for Semiconductor Wafers

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

METAL BONDING PADS FOR PACKAGING APPLICATIONS

METHOD FOR DIRECT BONDING WITH SELF-ALIGNMENT USING ULTRASOUND

METAL BONDING PADS FOR PACKAGING APPLICATIONS

Hybrid Bonding Systems and Methods for Semiconductor Wafers

TRANSISTOR FORMATION USING COLD WELDING

SEMICONDUCTOR APPARATUS, ELECTRONIC DEVICE, AND METHOD OF MANUFACTU...

TRANSISTOR FORMATION USING COLD WELDING

TRANSISTOR FORMATION USING COLD WELDING

Hybrid Bonding Systems and Methods for Semiconductor Wafers

APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING