being a strip line type

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CPC
H01L2924/19031

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19031being a strip line type

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming microwave tunable composited thin-film dielectr...
- Patent number 12,048,948
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Yueh Sheng Ow
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor devices comprising planar waveguide transmission lines
- Patent number 11,784,144
- Issue date Oct 10, 2023
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including mold material with recessed conductiv...
- Patent number 11,515,225
- Issue date Nov 29, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency module, board equipped with antenna, and high freque...
- Patent number 11,284,506
- Issue date Mar 22, 2022
- Murata Manufacturing Co., Ltd.
- Hideki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing carrier
- Patent number 11,114,394
- Issue date Sep 7, 2021
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circularly-polarized dielectric waveguide launch for millimeter-wav...
- Patent number 11,011,815
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Hassan Omar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency module, board equipped with antenna, and high freque...
- Patent number 10,925,149
- Issue date Feb 16, 2021
- Murata Manufacturing Co., Ltd.
- Hideki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifiers and amplifier modules with ground plane height variation...
- Patent number 10,861,806
- Issue date Dec 8, 2020
- NXP USA, INC.
- Yu-Ting David Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit chip packaging including a heat sink topped cavity
- Patent number 10,818,572
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Amplifiers and amplifier modules with ground plane height variation...
- Patent number 10,629,552
- Issue date Apr 21, 2020
- NXP USA, INC.
- Yu-Ting David Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density triple diamond stripline interconnects
- Patent number 10,607,952
- Issue date Mar 31, 2020
- Intel Corporation
- Albert Sutono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip packaging
- Patent number 10,600,715
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna apparatus having bond wires
- Patent number 10,490,524
- Issue date Nov 26, 2019
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Ivan Ndip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide including first and second metal plates and having a slot...
- Patent number 10,056,672
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer including an integrated waveguide for communica...
- Patent number 10,038,232
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a package substrate having an integrate...
- Patent number 10,033,081
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with passive devices and methods of forming the same
- Patent number 9,040,381
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with passive devices and methods of forming the same
- Patent number 8,680,647
- Issue date Mar 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230335512
- Publication date Oct 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Shuuichi KARIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...
- Publication number 20220077015
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING CARRIER
- Publication number 20210043588
- Publication date Feb 11, 2021
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING PLANAR WAVEGUIDE TRANSMISSION LINES
- Publication number 20200388583
- Publication date Dec 10, 2020
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168524
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168525
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULARLY-POLARIZED DIELECTRIC WAVEGUIDE LAUNCH FOR MILLIMETER-WAV...
- Publication number 20190334220
- Publication date Oct 31, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Hassan Omar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA APPARATUS HAVING BOND WIRES
- Publication number 20180190612
- Publication date Jul 5, 2018
- Ivan NDIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20170243816
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...
- Publication number 20160336282
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Passive Devices and Methods of Forming the Same
- Publication number 20140073091
- Publication date Mar 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Passive Devices and Methods of Forming the Same
- Publication number 20130168805
- Publication date Jul 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

being a strip line type

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for forming microwave tunable composited thin-film dielectr...

Semiconductor devices comprising planar waveguide transmission lines

Reconstituted wafer including mold material with recessed conductiv...

High frequency module, board equipped with antenna, and high freque...

Signal routing carrier

Circularly-polarized dielectric waveguide launch for millimeter-wav...

High frequency module, board equipped with antenna, and high freque...

Amplifiers and amplifier modules with ground plane height variation...

Integrated circuit chip packaging including a heat sink topped cavity

Amplifiers and amplifier modules with ground plane height variation...

High-density triple diamond stripline interconnects

Integrated circuit chip packaging

Antenna apparatus having bond wires

Waveguide including first and second metal plates and having a slot...

Semiconductor wafer including an integrated waveguide for communica...

Package structure including a package substrate having an integrate...

Packages with passive devices and methods of forming the same

Packages with passive devices and methods of forming the same

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...

SIGNAL ROUTING CARRIER

SEMICONDUCTOR DEVICES COMPRISING PLANAR WAVEGUIDE TRANSMISSION LINES

INTEGRATED CIRCUIT CHIP PACKAGING

INTEGRATED CIRCUIT CHIP PACKAGING

CIRCULARLY-POLARIZED DIELECTRIC WAVEGUIDE LAUNCH FOR MILLIMETER-WAV...

ANTENNA APPARATUS HAVING BOND WIRES

INTEGRATED CIRCUIT CHIP PACKAGING

PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...

Packages with Passive Devices and Methods of Forming the Same

Packages with Passive Devices and Methods of Forming the Same