being a temporary or sacrificial substrate

Industry

CPC
H01L2224/85005

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85005being a temporary or sacrificial substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 12,027,472
- Issue date Jul 2, 2024
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,961,775
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
- Patent number 11,929,349
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 11,784,163
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor device and method
- Patent number 11,727,714
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flat lead package formation method
- Patent number 11,652,084
- Issue date May 16, 2023
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 11,616,027
- Issue date Mar 28, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,495,505
- Issue date Nov 8, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 11,404,355
- Issue date Aug 2, 2022
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multirow gull-wing package for microelectronic devices
- Patent number 11,335,570
- Issue date May 17, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-purpose non-linear semiconductor package assembly line
- Patent number 11,302,668
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor device and method
- Patent number 11,194,990
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 11,114,413
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining a micorelectronic chip to a wire element
- Patent number 11,081,466
- Issue date Aug 3, 2021
- PRIMO1D
- Delphine Rolland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
- Patent number 11,037,910
- Issue date Jun 15, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,971,429
- Issue date Apr 6, 2021
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,944,046
- Issue date Mar 9, 2021
- Rohm Co., Ltd.
- Yuya Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,854,560
- Issue date Dec 1, 2020
- AOI Electronics Co., Ltd.
- Shuichi Sawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging with metallic shielding layer
- Patent number 10,854,557
- Issue date Dec 1, 2020
- AOI Electronics Co., Ltd.
- Shuichi Sawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CTE compensation for wafer-level and chip-scale packages and assemb...
- Patent number 10,847,469
- Issue date Nov 24, 2020
- Cubic Corporation
- Kenneth J. Vanhille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having a conductive layer protruding through a lead recess
- Patent number 10,796,984
- Issue date Oct 6, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 10,763,194
- Issue date Sep 1, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic detection device, current detection device, method for man...
- Patent number 10,698,005
- Issue date Jun 30, 2020
- Asahi Kasei Microdevices Corporation
- Toshiaki Fukunaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,607,920
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,607,921
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package mold assembly
- Patent number 10,573,537
- Issue date Feb 25, 2020
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with processor package
- Patent number 10,566,369
- Issue date Feb 18, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Tim Thian Hwee Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20240304569
- Publication date Sep 12, 2024
- Analong Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan et al.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20240258182
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...
- Publication number 20230361086
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20230343133
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20230207489
- Publication date Jun 29, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20230070922
- Publication date Mar 9, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES
- Publication number 20220277965
- Publication date Sep 1, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR DEVICE AND METHOD
- Publication number 20220067334
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...
- Publication number 20210384164
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LATERALLY OFFSET STACKED SEMICONDUCTOR...
- Publication number 20210272932
- Publication date Sep 2, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20210183790
- Publication date Jun 17, 2021
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat Lead Package Formation Method
- Publication number 20210043603
- Publication date Feb 11, 2021
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...
- Publication number 20200411476
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20200411397
- Publication date Dec 31, 2020
- Amkor Technology Singapore Holding Pte. Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20200365492
- Publication date Nov 19, 2020
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LATERALLY OFFSET STACKED SEMICONDUCTOR...
- Publication number 20200350293
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR JOINING A MICORELECTRONIC CHIP TO A WIRE ELEMENT
- Publication number 20200335475
- Publication date Oct 22, 2020
- PRIMO1D
- Delphine Rolland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
- Publication number 20200203310
- Publication date Jun 25, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES
- Publication number 20200203184
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE
- Publication number 20200194340
- Publication date Jun 18, 2020
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200091416
- Publication date Mar 19, 2020
- ROHM CO., LTD.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT
- Publication number 20200035577
- Publication date Jan 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- JAMES RICHARD HUCKABEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Semiconductor Device Manufacturing Method
- Publication number 20190326227
- Publication date Oct 24, 2019
- AOI ELECTRONICS CO., LTD.
- Shuichi SAWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20190244004
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY
- Publication number 20190157110
- Publication date May 23, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE
- Publication number 20190148271
- Publication date May 16, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20190096788
- Publication date Mar 28, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190074431
- Publication date Mar 7, 2019
- ROHM CO., LTD.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20190013283
- Publication date Jan 10, 2019
- Powertech Technology Inc.
- HIROYUKI FUJISHIMA
- H01 - BASIC ELECTRIC ELEMENTS

being a temporary or sacrificial substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit packages to minimize stress on a semiconductor die

Semiconductor devices and related methods

Semiconductor device having laterally offset stacked semiconductor...

Stacking structure, package structure and method of fabricating the...

Fingerprint sensor device and method

Flat lead package formation method

Integrated circuit packages to minimize stress on a semiconductor die

Semiconductor devices and related methods

Package with lead frame with improved lead design for discrete elec...

Multirow gull-wing package for microelectronic devices

Multi-purpose non-linear semiconductor package assembly line

Fingerprint sensor device and method

Stacking structure, package structure and method of fabricating the...

Method for joining a micorelectronic chip to a wire element

Semiconductor device having laterally offset stacked semiconductor...

Method for forming a semiconductor package

Semiconductor device

Semiconductor device and semiconductor device manufacturing method

Semiconductor device packaging with metallic shielding layer

CTE compensation for wafer-level and chip-scale packages and assemb...

Leadframe having a conductive layer protruding through a lead recess

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Package with lead frame with improved lead design for discrete elec...

Wafer level flat no-lead semiconductor packages and methods of manu...

Magnetic detection device, current detection device, method for man...

Semiconductor package

Method for forming a semiconductor package

Integrated circuit package mold assembly

Image sensor with processor package

Patents Applicationslast 30 patents

Fingerprint Sensor Device and Method

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICES AND RELATED METHODS

STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...

Fingerprint Sensor Device and Method

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICES AND RELATED METHODS

MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES

FINGERPRINT SENSOR DEVICE AND METHOD

STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...

SEMICONDUCTOR DEVICE HAVING LATERALLY OFFSET STACKED SEMICONDUCTOR...

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

Flat Lead Package Formation Method

STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...

SEMICONDUCTOR DEVICES AND RELATED METHODS

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...

SEMICONDUCTOR DEVICE HAVING LATERALLY OFFSET STACKED SEMICONDUCTOR...

METHOD FOR JOINING A MICORELECTRONIC CHIP TO A WIRE ELEMENT

Multi-Purpose Non-Linear Semiconductor Package Assembly Line

MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

PACKAGED INTEGRATED CIRCUIT

Semiconductor Device and Semiconductor Device Manufacturing Method

Fingerprint Sensor Device and Method

INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY

LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...

SEMICONDUCTOR DEVICE

Semiconductor package and manufacturing method thereof