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H01L2224/84005

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/84005being a temporary substrate

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Patents Grantslast 30 patents

Information Patent Grant
Cascode power electronic device packaging method and packaging stru...
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- ULTRABAND TECHNOLOGIES INC.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding material and method for packaging semiconductor chips
- Patent number 9,209,152
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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Information Patent Application
Semiconductor Device and Method of Forming Leadframe with Clip Bond...
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- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
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Information Patent Application
Cascode power electronic device Packaging method and Packaging Stru...
- Publication number 20210358899
- Publication date Nov 18, 2021
- Ultraband Technologies Inc.
- Tai-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Material and Method for Packaging Semiconductor Chips
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