being a temporary substrate

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H01L2224/84005

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/84005being a temporary substrate

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Patents Grantslast 30 patents

Information Patent Grant
Cascode power electronic device packaging method and packaging stru...
- Patent number 11,476,242
- Issue date Oct 18, 2022
- ULTRABAND TECHNOLOGIES INC.
- Tai-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding material and method for packaging semiconductor chips
- Patent number 9,209,152
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device and Method of Forming Leadframe with Clip Bond...
- Publication number 20220208686
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cascode power electronic device Packaging method and Packaging Stru...
- Publication number 20210358899
- Publication date Nov 18, 2021
- Ultraband Technologies Inc.
- Tai-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Material and Method for Packaging Semiconductor Chips
- Publication number 20140312497
- Publication date Oct 23, 2014
- INFINEON TECHNOLOGIES AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS