being a via with at least a lining layer

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H01L2224/05087

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05087being a via with at least a lining layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
- Patent number 11,935,850
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure
- Patent number 11,837,564
- Issue date Dec 5, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with slanted conductive layers and method for...
- Patent number 11,398,441
- Issue date Jul 26, 2022
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-contact thin film semiconductor device structures and methods...
- Patent number 11,398,575
- Issue date Jul 26, 2022
- MicroLink Devices, Inc.
- Christopher Youtsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad architecture using capacitive deep trench isolation (CD...
- Patent number 10,892,291
- Issue date Jan 12, 2021
- STMicroelectronics (Crolles 2) SAS
- Sonarith Chhun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal controlled oscillator and manufacturing method of crystal c...
- Patent number 10,581,437
- Issue date Mar 3, 2020
- Nihon Dempa Kogyo Co., Ltd.
- Hiroyasu Kunitomo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Multi-layer metal pads
- Patent number 9,887,170
- Issue date Feb 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,711,468
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,041,204
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,788,738
- Issue date Jul 22, 2014
- Yoshiro Riho
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230113465
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor bonding structure
- Publication number 20230018214
- Publication date Jan 19, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220375887
- Publication date Nov 24, 2022
- KIOXIA Corporation
- Shinya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220336394
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE...
- Publication number 20220093545
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...
- Publication number 20220084967
- Publication date Mar 17, 2022
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL CONTROLLED OSCILLATOR AND MANUFACTURING METHOD OF CRYSTAL C...
- Publication number 20180248556
- Publication date Aug 30, 2018
- NIHON DEMPA KOGYO CO., LTD.
- Hiroyasu KUNITOMO
- C30 - CRYSTAL GROWTH
Information Patent Application
Multi-Layer Metal Pads
- Publication number 20170317042
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140321223
- Publication date Oct 30, 2014
- Yoshiro RIHO
- G11 - INFORMATION STORAGE
Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20130256893
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120146707
- Publication date Jun 14, 2012
- Elpida Memory, Inc.
- Yoshiro Riho
- G11 - INFORMATION STORAGE
Information Patent Application
THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF
- Publication number 20110260297
- Publication date Oct 27, 2011
- Shian-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS

being a via with at least a lining layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating semiconductor device with slanted conductive...

Semiconductor bonding structure

Semiconductor device with slanted conductive layers and method for...

Back-contact thin film semiconductor device structures and methods...

Bonding pad architecture using capacitive deep trench isolation (CD...

Crystal controlled oscillator and manufacturing method of crystal c...

Multi-layer metal pads

Bonding pad structure with dense via array

Bonding pad structure with dense via array

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor bonding structure

SEMICONDUCTOR DEVICE

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE...

SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...

CRYSTAL CONTROLLED OSCILLATOR AND MANUFACTURING METHOD OF CRYSTAL C...

Multi-Layer Metal Pads

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BONDING PAD STRUCTURE WITH DENSE VIA ARRAY

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF