being an additional member attached to the bonding area through an adhesive or solder

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H01L2224/48491

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48491being an additional member attached to the bonding area through an adhesive or solder

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Board unit and semiconductor device
- Patent number 12,080,677
- Issue date Sep 3, 2024
- Kioxia Corporation
- Katsuya Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same and metal b...
- Patent number 11,908,824
- Issue date Feb 20, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
- Patent number 11,562,978
- Issue date Jan 24, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,888,941
- Issue date Jan 12, 2021
- Hitachi Power Semiconductor Device, Ltd.
- Daichi Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module based on multi-layer circuit board
- Patent number 10,636,732
- Issue date Apr 28, 2020
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor chips
- Patent number 10,607,962
- Issue date Mar 31, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 10,497,664
- Issue date Dec 3, 2019
- Automated Assembly Corporation
- Robert Neuman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with a wire bonding and a sintered region, and...
- Patent number 10,490,523
- Issue date Nov 26, 2019
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for manufacturing a semiconductor...
- Patent number 9,786,620
- Issue date Oct 10, 2017
- Infineon Technolgies AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a wire bonding and a sintered region, and...
- Patent number 9,786,626
- Issue date Oct 10, 2017
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a connection between metallic moulded bodies an...
- Patent number 9,786,627
- Issue date Oct 10, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,613,929
- Issue date Apr 4, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 9,406,637
- Issue date Aug 2, 2016
- Aoi Electronics Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with moisture barrier for sealing semicondu...
- Patent number 9,337,155
- Issue date May 10, 2016
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,318,421
- Issue date Apr 19, 2016
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor module, and method for con...
- Patent number 9,196,562
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with bimetallic interface element for wire bonding
- Patent number 9,184,150
- Issue date Nov 10, 2015
- STMicroelectronics S.R.L.
- Giuseppe Cristaldi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 9,087,827
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a bond
- Patent number 8,955,219
- Issue date Feb 17, 2015
- Infineon Technologies AG
- Roman Roth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor device
- Patent number 8,901,569
- Issue date Dec 2, 2014
- Nippon Steel & Sumitomo Metal Corporation
- Hosei Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,836,150
- Issue date Sep 16, 2014
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of light emitting devices with phosphor wavelength conv...
- Patent number 8,597,963
- Issue date Dec 3, 2013
- Intematix Corporation
- Jonathan Melman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 8,525,335
- Issue date Sep 3, 2013
- Teramikros, Inc.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip and metal plate
- Patent number 8,441,122
- Issue date May 14, 2013
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,395,248
- Issue date Mar 12, 2013
- Sharp Kabushiki Kaisha
- Yoshiaki Nozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including semiconduct...
- Patent number 8,309,434
- Issue date Nov 13, 2012
- Denso Corporation
- Yasutomi Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement
- Patent number 8,164,176
- Issue date Apr 24, 2012
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 8,125,090
- Issue date Feb 28, 2012
- Hitachi, Ltd.
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 8,105,932
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOARD UNIT AND SEMICONDUCTOR DEVICE
- Publication number 20230086136
- Publication date Mar 23, 2023
- KIOXIA Corporation
- Katsuya MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230047789
- Publication date Feb 16, 2023
- Mitsubishi Electric Corporation
- Motoru YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME AND METAL B...
- Publication number 20220359452
- Publication date Nov 10, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200399118
- Publication date Dec 24, 2020
- DENSO CORPORATION
- Yutaka HAYAKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING CAPACITOR MOUNTED ON AN INTEGRATED CIRCUIT DIE, AND METH...
- Publication number 20190312005
- Publication date Oct 10, 2019
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20190126374
- Publication date May 2, 2019
- HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
- Daichi KAWAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS
- Publication number 20180240776
- Publication date Aug 23, 2018
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A WIRE BONDING AND A SINTERED REGION, AND...
- Publication number 20170365577
- Publication date Dec 21, 2017
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20170033067
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20150097302
- Publication date Apr 9, 2015
- TERA PROBE, INC.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH BIMETALLIC INTERFACE ELEMENT FOR WIRE BONDING
- Publication number 20150076712
- Publication date Mar 19, 2015
- STMicroelectronics S.r. I.
- Giuseppe Cristaldi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component, Semiconductor Module and Methods for Produ...
- Publication number 20140284624
- Publication date Sep 25, 2014
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20140239511
- Publication date Aug 28, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...
- Publication number 20140230989
- Publication date Aug 21, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...
- Publication number 20140225247
- Publication date Aug 14, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20130320526
- Publication date Dec 5, 2013
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130241084
- Publication date Sep 19, 2013
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20120305945
- Publication date Dec 6, 2012
- Hosei Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE
- Publication number 20120091568
- Publication date Apr 19, 2012
- INFINEON TECHNOLOGIES AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120080800
- Publication date Apr 5, 2012
- Mitsubishi Electric Corporation
- Toshiaki SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Semiconductor Module, and Method for Con...
- Publication number 20110316160
- Publication date Dec 29, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having semiconductor chip and metal plate and...
- Publication number 20110042741
- Publication date Feb 24, 2011
- DENSO CORPORATION
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20110033975
- Publication date Feb 10, 2011
- DENSO CORPORATION
- Yasutomi Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20110001238
- Publication date Jan 6, 2011
- CASIO COMPUTER CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF LIGHT EMITTING DEVICES WITH PHOSPHOR WAVELENGTH CONV...
- Publication number 20100295077
- Publication date Nov 25, 2010
- Intematix Corporation
- Jonathan Melman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20100289148
- Publication date Nov 18, 2010
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100244213
- Publication date Sep 30, 2010
- Yoshiaki NOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Bond
- Publication number 20100212153
- Publication date Aug 26, 2010
- INFINEON TECHNOLOGIES AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SUSPENDED ISOLATING INTERCONNECT
- Publication number 20100052120
- Publication date Mar 4, 2010
- Linear Technology Corporation
- David Alan Pruitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THYRISTOR AND METHODS FOR PRODUCING A THYRISTOR
- Publication number 20090057714
- Publication date Mar 5, 2009
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS

being an additional member attached to the bonding area through an adhesive or solder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Board unit and semiconductor device

Semiconductor package, method of manufacturing the same and metal b...

Decoupling capacitor mounted on an integrated circuit die, and meth...

Power semiconductor module

Semiconductor chip package with resilient conductive paste post and...

Power module based on multi-layer circuit board

Method for manufacturing semiconductor chips

Wire bonded electronic devices to round wire

Semiconductor device with a wire bonding and a sintered region, and...

Semiconductor device and a method for manufacturing a semiconductor...

Semiconductor device with a wire bonding and a sintered region, and...

Method for creating a connection between metallic moulded bodies an...

Power semiconductor chip with a metallic moulded body for contactin...

Semiconductor construct and manufacturing method thereof as well as...

Semiconductor component with moisture barrier for sealing semicondu...

Power semiconductor chip with a metallic moulded body for contactin...

Semiconductor arrangement, semiconductor module, and method for con...

Electronic device with bimetallic interface element for wire bonding

Mixed wire semiconductor lead frame package

Method for fabricating a bond

Power semiconductor device

Semiconductor device

Manufacture of light emitting devices with phosphor wavelength conv...

Semiconductor construct and manufacturing method thereof as well as...

Semiconductor device having semiconductor chip and metal plate

Semiconductor device and manufacturing method therefor

Method for manufacturing semiconductor device including semiconduct...

Semiconductor module arrangement

Semiconductor power module

Mixed wire semiconductor lead frame package

Patents Applicationslast 30 patents

BOARD UNIT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME AND METAL B...

ELECTRONIC DEVICE

DECOUPLING CAPACITOR MOUNTED ON AN INTEGRATED CIRCUIT DIE, AND METH...

POWER SEMICONDUCTOR MODULE

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE WITH A WIRE BONDING AND A SINTERED REGION, AND...

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

ELECTRONIC DEVICE WITH BIMETALLIC INTERFACE ELEMENT FOR WIRE BONDING

Semiconductor Component, Semiconductor Module and Methods for Produ...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...

POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE

MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE

POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Arrangement, Semiconductor Module, and Method for Con...

Semiconductor device having semiconductor chip and metal plate and...

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

MANUFACTURE OF LIGHT EMITTING DEVICES WITH PHOSPHOR WAVELENGTH CONV...

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Method for Fabricating a Bond

SEMICONDUCTOR DEVICE HAVING A SUSPENDED ISOLATING INTERCONNECT

THYRISTOR AND METHODS FOR PRODUCING A THYRISTOR