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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/45015
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Patents Grants
last 30 patents
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Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,973,007
Issue date
Apr 30, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,967,543
Issue date
Apr 23, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing electronic components, corresponding electronic...
Patent number
11,935,818
Issue date
Mar 19, 2024
STMicroelectronics S.r.l.
Fabio Marchisi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Smart packaging for improved medication regimen compliance
Patent number
11,913,893
Issue date
Feb 27, 2024
QuantaEd, LLC
Mehran Mehregany
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
Patent number
11,894,349
Issue date
Feb 6, 2024
Rohm Co., Ltd.
Keiji Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect wires including relatively low resistivity cores
Patent number
11,881,432
Issue date
Jan 23, 2024
Hui Jae Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device
Patent number
11,873,435
Issue date
Jan 16, 2024
CITIZEN ELECTRONICS CO., LTD.
Byungchul Hong
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Stacked semiconductor die assemblies with die support members and a...
Patent number
11,824,044
Issue date
Nov 21, 2023
Micron Technology, Inc.
Seng Kim Ye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
Patent number
11,817,445
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond wires for interference shielding
Patent number
11,810,867
Issue date
Nov 7, 2023
Invensas LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for electrically connecting contact surfaces of electronic...
Patent number
11,791,309
Issue date
Oct 17, 2023
HERAEUS MATERIALS SINGAPORE PTE. LTD.
Yean Mee Pun
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package-on-package assembly with wire bond vias
Patent number
11,735,563
Issue date
Aug 22, 2023
Invensas LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer with opening...
Patent number
11,688,612
Issue date
Jun 27, 2023
STATS ChipPAC Pte. Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
Patent number
11,664,335
Issue date
May 30, 2023
Semikron Elektronik GmbH & Co., KG
Wolfgang-Michael Schulz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Smart packaging for improved medication regimen compliance
Patent number
11,635,397
Issue date
Apr 25, 2023
QuantaEd, LLC
Mehran Mehregany
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Illumination device
Patent number
11,613,698
Issue date
Mar 28, 2023
Citizen Electronics Co., Ltd.
Byungchul Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
Patent number
11,605,609
Issue date
Mar 14, 2023
General Electric Company
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for making thereof
Patent number
11,569,208
Issue date
Jan 31, 2023
BroadPak Corporation
Farhang Yazdani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect wires including relatively low resistivity cores
Patent number
11,569,126
Issue date
Jan 31, 2023
Intel Corporation
Hui Jae Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,532,537
Issue date
Dec 20, 2022
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package structure
Patent number
11,532,498
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
Patent number
11,502,063
Issue date
Nov 15, 2022
Rohm Co., Ltd.
Keiji Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for optimizing looping parameters and looping t...
Patent number
11,495,570
Issue date
Nov 8, 2022
Kulicke and Soffa Industries, Inc.
Ivy Wei Qin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Light-emitting apparatus
Patent number
11,476,227
Issue date
Oct 18, 2022
XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
Tsukasa Inoguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond wires for interference shielding
Patent number
11,462,483
Issue date
Oct 4, 2022
Invensas LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
Patent number
11,456,255
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power amplifier systems with control interface and bias circuit
Patent number
11,451,199
Issue date
Sep 20, 2022
Skyworks Solutions, Inc.
David Steven Ripley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device and power conversion device
Patent number
11,432,419
Issue date
Aug 30, 2022
Hitachi Astemo, Ltd.
Tokihito Suwa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting package
Patent number
11,424,210
Issue date
Aug 23, 2022
XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
Tsukasa Inoguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, electronic component and method
Patent number
11,380,612
Issue date
Jul 5, 2022
Infineon Technologies Austria AG
Matthias Stecher
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
Publication number
20240120322
Publication date
Apr 11, 2024
Rohm Co., Ltd.
Keiji Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20240112952
Publication date
Apr 4, 2024
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED CONNECTION MEANS
Publication number
20240096844
Publication date
Mar 21, 2024
SIEMENS AKTIENGESELLSCHAFT
PHILIPP KNEISSL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240071978
Publication date
Feb 29, 2024
NIPPON MICROMETAL CORPORATION
Yuya SUTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
Publication number
20240055393
Publication date
Feb 15, 2024
Invensas LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20240047376
Publication date
Feb 8, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
Publication number
20240014155
Publication date
Jan 11, 2024
CHIPMORE TECHNOLOGY CORPORATION LIMITED
Wenjie HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
Publication number
20230335530
Publication date
Oct 19, 2023
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20230130273
Publication date
Apr 27, 2023
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Wire and Method for Manufacturing the Same
Publication number
20230125151
Publication date
Apr 27, 2023
Nippon Telegraph and Telephone Corporation
Toshiki Kishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20230059375
Publication date
Feb 23, 2023
Invensas LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
Publication number
20230041977
Publication date
Feb 9, 2023
BroadPak Corporation
Farhang YAZDANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
Publication number
20230023328
Publication date
Jan 26, 2023
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED SEMICONDUCTOR STRUCTURES
Publication number
20230026177
Publication date
Jan 26, 2023
BroadPak Corporation
Farhang YAZDANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
Publication number
20230025045
Publication date
Jan 26, 2023
Rohm Co., Ltd.
Keiji Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
Publication number
20230020310
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
Publication number
20220320056
Publication date
Oct 6, 2022
BOE TECHNOLOGY GROUP CO., LTD.
Xuan Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF
Publication number
20220293575
Publication date
Sep 15, 2022
BroadPak Corporation
Farhang YAZDANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
Publication number
20220165703
Publication date
May 26, 2022
Invensas Corporation
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE
Publication number
20220157766
Publication date
May 19, 2022
NIPPON MICROMETAL CORPORATION
Takashi YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR ELECTRICALLY CONNECTING CONTACT SURFACES OF ELECTRONIC...
Publication number
20220037284
Publication date
Feb 3, 2022
Heraeus Materials Singapore Pte. Ltd.
Yean M. Pun
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
Publication number
20220013460
Publication date
Jan 13, 2022
Micron Technology, Inc.
Suan Jeung Boon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF
Publication number
20210242185
Publication date
Aug 5, 2021
BroadPak Corporation
Farhang YAZDANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENTS
Publication number
20210167034
Publication date
Jun 3, 2021
INFINEON TECHNOLOGIES AG
Manfred MENGEL
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE...
Publication number
20210159209
Publication date
May 27, 2021
Skyworks Solutions, Inc.
Sandra Louise Petty-Weeks
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
Publication number
20210104500
Publication date
Apr 8, 2021
Rohm Co., Ltd.
Keiji Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLOATING DIE PACKAGE
Publication number
20210091012
Publication date
Mar 25, 2021
TEXAS INSTRUMENTS INCORPORATED
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-on-package Assembly With Wire Bond Vias
Publication number
20210035948
Publication date
Feb 4, 2021
Invensas Corporation
Ellis Chau
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20210020502
Publication date
Jan 21, 2021
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING PACKAGE
Publication number
20200373287
Publication date
Nov 26, 2020
XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
Tsukasa Inoguchi
H01 - BASIC ELECTRIC ELEMENTS