Being combinations of any of the materials from the groups H01L2924/042 - H01L2924/0584

Industry

CPC
H01L2924/059

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/059Being combinations of any of the materials from the groups H01L2924/042 - H01L2924/0584

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with graphene layers
- Patent number 11,908,816
- Issue date Feb 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-silicon via with low-K dielectric liner
- Patent number 11,600,551
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlocked redistribution layer interface for flip-chip integrated...
- Patent number 11,545,450
- Issue date Jan 3, 2023
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 11,502,050
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,488,886
- Issue date Nov 1, 2022
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with graphene layers and method for fabricatin...
- Patent number 11,424,198
- Issue date Aug 23, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure with hybrid bonding structure and method of fab...
- Patent number 11,251,157
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structure and method for forming the same
- Patent number 11,011,486
- Issue date May 18, 2021
- United Microelectronics Corp.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device comprising top conductive...
- Patent number 10,964,653
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Ping Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,916,517
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 10,804,153
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,734,336
- Issue date Aug 4, 2020
- Renesas Electronics Corporation
- Tatsuya Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via with low-K dielectric liner
- Patent number 10,707,149
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detecting delamination in an integrated circuit package s...
- Patent number 10,699,977
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,658,315
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding methods and wafer-bonded structures
- Patent number 10,446,519
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure and testing method using the same
- Patent number 10,347,548
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded body
- Patent number 10,290,601
- Issue date May 14, 2019
- Namics Corporation
- Raymond Dietz
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Semiconductor devices including conductive pillars
- Patent number 10,276,529
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with bump stop structure
- Patent number 10,269,749
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for anisotropic conductive film, anisotropic conductive...
- Patent number 10,224,303
- Issue date Mar 5, 2019
- Samsung SDI Co., Ltd.
- Youn Jo Ko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387422
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...
- Publication number 20240379738
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355900
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Man-Nung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...
- Publication number 20240349520
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Moorym CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321851
- Publication date Sep 26, 2024
- SAMSUNG ELECTERONICS CO., LTD.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20240321855
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20240304593
- Publication date Sep 12, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR VIDEO TRANSMISSION DISPLAY
- Publication number 20240292708
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Myeongeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20240274485
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS
- Publication number 20240266340
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chao CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20240222226
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HYBRID BONDING AND METHOD FOR MANUFACT...
- Publication number 20240213195
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-De HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
- Publication number 20240178167
- Publication date May 30, 2024
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...
- Publication number 20240153901
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240105674
- Publication date Mar 28, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240088048
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING METAL GAPFILL WITH LOW RESISTIVITY
- Publication number 20240088071
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION
- Publication number 20240071968
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-D...
- Publication number 20240072004
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Package and Method Forming the Same
- Publication number 20240072034
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Being combinations of any of the materials from the groups H01L2924/042 - H01L2924/0584

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method to minimize stress on stack via

Semiconductor device with metal film on surface between passivation...

Redistribution layer metallic structure and method

Semiconductor device with composite conductive features and method...

Method for fabricating semiconductor device with graphene layers

Diffusion soldering with contaminant protection

Through-silicon via with low-K dielectric liner

Interlocked redistribution layer interface for flip-chip integrated...

Redistribution layer metallic structure and method

Semiconductor device

Semiconductor device with graphene layers and method for fabricatin...

Die stack structure with hybrid bonding structure and method of fab...

Bonded semiconductor structure and method for forming the same

Method of forming a semiconductor device comprising top conductive...

Redistribution layer metallic structure and method

Method of bonding semiconductor substrates

Protrusion bump pads for bond-on-trace processing

Semiconductor device and method to minimize stress on stack via

Semiconductor devices and semiconductor devices including a redistr...

Semiconductor device and method for manufacturing the same

Through-silicon via with low-K dielectric liner

Method of detecting delamination in an integrated circuit package s...

Redistribution layer metallic structure and method

Packaging devices and methods of manufacture thereof

Wafer bonding methods and wafer-bonded structures

Integrated circuit package structure and testing method using the same

Method of manufacturing bonded body

Semiconductor devices including conductive pillars

Method of forming a semiconductor device with bump stop structure

Composition for anisotropic conductive film, anisotropic conductive...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRO...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME

BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

DIRECT BONDING METHODS AND STRUCTURES

SEMICONDUCTOR DEVICE FOR VIDEO TRANSMISSION DISPLAY

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

DEBONDING REPAIR DEVICES

SEMICONDUCTOR STRUCTURE WITH HYBRID BONDING AND METHOD FOR MANUFACT...

CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGES

Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BONDED STRUCTURE AND METHOD OF FORMING SAME

CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME

METHODS FOR FORMING METAL GAPFILL WITH LOW RESISTIVITY

SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION

SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-D...

3DIC Package and Method Forming the Same

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...