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H01L2224/75304

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75304being curved

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Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 11,791,223
- Issue date Oct 17, 2023
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering press and method for sintering electronic components on a...
- Patent number 11,380,647
- Issue date Jul 5, 2022
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 11,049,840
- Issue date Jun 29, 2021
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-stacking apparatus having a transport device configured to tra...
- Patent number 9,842,823
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handling tools for components, in particular eletronic components
- Patent number 8,262,146
- Issue date Sep 11, 2012
- Robert Bosch GmbH
- Klaus Stoppel
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flip-chip mounting method, flip-chip mounting apparatus and tool pr...
- Patent number 8,163,599
- Issue date Apr 24, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mounting method using thermocompression head
- Patent number 8,114,243
- Issue date Feb 14, 2012
- Sony Corporation
- Kazutaka Furuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of flip-chip mounting
- Patent number 7,670,873
- Issue date Mar 2, 2010
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding heater with differential heat transfer
- Patent number 7,176,422
- Issue date Feb 13, 2007
- Intel Corporation
- Song-Hua Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding heater with differential heat transfer
- Patent number 6,940,053
- Issue date Sep 6, 2005
- Intel Corporation
- Song-Hua Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20240014079
- Publication date Jan 11, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...
- Publication number 20190326250
- Publication date Oct 24, 2019
- AMX - AUTOMATRIX S.R.L.
- Nicola SCHIVALOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20190189587
- Publication date Jun 20, 2019
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sintering Utilizing Non-Mechanical Pressure
- Publication number 20140224409
- Publication date Aug 14, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20130255878
- Publication date Oct 3, 2013
- Fujitsu Limited
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION DEVICE, LIGHT-RECEIVING ELEMENT ARRAY, SEMICONDUCTOR CHIP...
- Publication number 20120032145
- Publication date Feb 9, 2012
- Sumitomo Electric Industries, Ltd.
- Youichi NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...
- Publication number 20110020983
- Publication date Jan 27, 2011
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING TOOLS FOR COMPONENTS, IN PARTICULAR ELETRONIC COMPONENTS
- Publication number 20100143088
- Publication date Jun 10, 2010
- Klaus Stoppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD USING THERMOCOMPRESSION HEAD
- Publication number 20090261149
- Publication date Oct 22, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazutaka Furuta
- B30 - PRESSES
Information Patent Application
CURVED HEAT SPREADER DESIGN FOR ELECTRONIC ASSEMBLIES
- Publication number 20080157345
- Publication date Jul 3, 2008
- Daoqiang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of flip-chip mounting
- Publication number 20070184582
- Publication date Aug 9, 2007
- FUJITSU LIMITED
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip bonding heater with differential heat transfer
- Publication number 20050230817
- Publication date Oct 20, 2005
- Song-Hua Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip bonding heater with differential heat transfer
- Publication number 20050103774
- Publication date May 19, 2005
- Song-Hua Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pick-up tool for mounting semiconductor chips
- Publication number 20030115747
- Publication date Jun 26, 2003
- ESEC Trading SA, a Swiss Corporation
- Daniel Schnetzler
- H01 - BASIC ELECTRIC ELEMENTS

being curved

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate bonding apparatus and substrate bonding method

Sintering press and method for sintering electronic components on a...

Bonding device

Chip-stacking apparatus having a transport device configured to tra...

Handling tools for components, in particular eletronic components

Flip-chip mounting method, flip-chip mounting apparatus and tool pr...

Mounting method using thermocompression head

Method of flip-chip mounting

Chip bonding heater with differential heat transfer

Chip bonding heater with differential heat transfer

Patents Applicationslast 30 patents

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...

BONDING DEVICE

Sintering Utilizing Non-Mechanical Pressure

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

DETECTION DEVICE, LIGHT-RECEIVING ELEMENT ARRAY, SEMICONDUCTOR CHIP...

FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...

HANDLING TOOLS FOR COMPONENTS, IN PARTICULAR ELETRONIC COMPONENTS

MOUNTING METHOD USING THERMOCOMPRESSION HEAD

CURVED HEAT SPREADER DESIGN FOR ELECTRONIC ASSEMBLIES

Method of flip-chip mounting

Chip bonding heater with differential heat transfer

Chip bonding heater with differential heat transfer

Pick-up tool for mounting semiconductor chips