being disposed in a single wiring level

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CPC
H01L2224/06188

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06188being disposed in a single wiring level

Industries

Patents Grantslast 30 patents

Information Patent Grant
High-frequency circuit
- Patent number 10,290,603
- Issue date May 14, 2019
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,984,986
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 9,339,868
- Issue date May 17, 2016
- Infineon Technologies AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Self-organizing network with chip package having multiple interconn...
- Patent number 9,190,371
- Issue date Nov 17, 2015
- Moon J. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 9,126,260
- Issue date Sep 8, 2015
- Infineon Technologies AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CHIP AND CHIP ARRANGEMENT
- Publication number 20140306331
- Publication date Oct 16, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20140220257
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20140216677
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Application
SELF-ORGANIZING NETWORK WITH CHIP PACKAGE HAVING MULTIPLE INTERCONN...
- Publication number 20120153450
- Publication date Jun 21, 2012
- Moon J. Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of processing a substrate
- Publication number 20120133084
- Publication date May 31, 2012
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B22 - CASTING POWDER METALLURGY