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being disposed in different wiring levels
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CPC
H01L2224/06189
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/06189
being disposed in different wiring levels
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-die semiconductor structure with intermediate vertical side c...
Patent number
9,812,425
Issue date
Nov 7, 2017
Intel Corporation
Bok Eng Cheah
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...
Publication number
20250201768
Publication date
Jun 19, 2025
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE SEMICONDUCTOR STRUCTURE WITH INTERMEDIATE VERTICAL SIDE C...
Publication number
20170018530
Publication date
Jan 19, 2017
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS