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being disposed in different wiring levels
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CPC
H01L2224/06189
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/06189
being disposed in different wiring levels
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last 30 patents
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Patent Grant
Multi-die semiconductor structure with intermediate vertical side c...
Patent number
9,812,425
Issue date
Nov 7, 2017
Intel Corporation
Bok Eng Cheah
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
MULTI-DIE SEMICONDUCTOR STRUCTURE WITH INTERMEDIATE VERTICAL SIDE C...
Publication number
20170018530
Publication date
Jan 19, 2017
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS