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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05078being disposed next to each other

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,165,997
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,948,903
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having polygonal bo...
- Patent number 11,776,921
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,728,299
- Issue date Aug 15, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,616,039
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,469,195
- Issue date Oct 11, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-size package with redistribution layer
- Patent number 10,998,267
- Issue date May 4, 2021
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 10,923,448
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance matching circuit for RF devices and method therefor
- Patent number 10,707,180
- Issue date Jul 7, 2020
- NXP USA, INC.
- Ricardo Uscola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,651,038
- Issue date May 12, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yusuke Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 10,483,241
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device comprising active nanowires and contact nanow...
- Patent number 10,453,991
- Issue date Oct 22, 2019
- ALEDIA
- Sylvia Scaringella
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 10,262,963
- Issue date Apr 16, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure, bonding ring structure, and MEMS device pack...
- Patent number 10,134,698
- Issue date Nov 20, 2018
- Semiconductor Manufacturing International (Beijing) Corporation
- Fucheng Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 9,953,941
- Issue date Apr 24, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing architecture for integrated circuits
- Patent number 9,881,885
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for manufacturing electronic apparatus
- Patent number 9,754,904
- Issue date Sep 5, 2017
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,698,075
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a trench at least partially filled w...
- Patent number 9,570,566
- Issue date Feb 14, 2017
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (“IC”) assembly includes an IC die with a top me...
- Patent number 9,553,068
- Issue date Jan 24, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,496,198
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,478,487
- Issue date Oct 25, 2016
- Samsung Electronics Co., Ltd.
- Byeong-Wan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a trench in a semiconductor substrat...
- Patent number 9,219,144
- Issue date Dec 22, 2015
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF
- Publication number 20240113053
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AG
- Andreas Korzenietz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240030187
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230317649
- Publication date Oct 5, 2023
- Fuji Electric Co., Ltd.
- Masahide GOTOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230223373
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD
- Publication number 20230178503
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...
- Publication number 20230178501
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230119548
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
- Publication number 20230114550
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Yongbum KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230113465
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYO-COMPATIBLE QUANTUM COMPUTING ARRANGEMENT AND METHOD FOR PRODUC...
- Publication number 20230043673
- Publication date Feb 9, 2023
- Fraunhofer-Gesellschaft zur Forderung der angewandten Foschung e.V.
- Peter RAMM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device And Method Of Manufacturing The Same
- Publication number 20230026305
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20220336421
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- Seungyoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...
- Publication number 20220278025
- Publication date Sep 1, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...
- Publication number 20220093490
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210407949
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20210175194
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE MATCHING CIRCUIT FOR RF DEVICES AND METHOD THEREFOR
- Publication number 20190326233
- Publication date Oct 24, 2019
- NXP USA, Inc.
- Ricardo Uscola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20190237419
- Publication date Aug 1, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20180226371
- Publication date Aug 9, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACK...
- Publication number 20170084557
- Publication date Mar 23, 2017
- Semiconductor Manufacturing International (Beijing) Corporation
- FUCHENG CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20170062366
- Publication date Mar 2, 2017
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20170047302
- Publication date Feb 16, 2017
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Routing Architecture for Integrated Circuits
- Publication number 20160079192
- Publication date Mar 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND STRUCTURE
- Publication number 20150262965
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND STRUCTURE
- Publication number 20140210064
- Publication date Jul 31, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Routing Architecture for Integrated Circuits
- Publication number 20140191390
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A TRENCH IN A SEMICONDUCTOR SUBSTRAT...
- Publication number 20140042593
- Publication date Feb 13, 2014
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS

being disposed next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Bond pad with micro-protrusions for direct metallic bonding

Semiconductor package

Semiconductor structure having polygonal bonding pad

Conductive barrier direct hybrid bonding

Devices and methods related to stack structures including passivati...

Method of manufacturing semiconductor structure having polygonal bo...

Semiconductor device with tilted insulating layers and method for f...

Semiconductor package

Semiconductor device with tilted insulating layers and method for f...

Conductive barrier direct hybrid bonding

Stack structures in electronic devices including passivation layers...

Semiconductor devices with through silicon vias and package-level c...

Wafer-level chip-size package with redistribution layer

Bond pad with micro-protrusions for direct metallic bonding

Impedance matching circuit for RF devices and method therefor

Semiconductor device

Semiconductor devices with through silicon vias and package-level c...

Light-emitting device comprising active nanowires and contact nanow...

Conductive barrier direct hybrid bonding

Bonding pad structure, bonding ring structure, and MEMS device pack...

Conductive barrier direct hybrid bonding

Metal routing architecture for integrated circuits

Electronic apparatus and method for manufacturing electronic apparatus

Integration of backside heat spreader for thermal management

Semiconductor device including a trench at least partially filled w...

Integrated circuit (“IC”) assembly includes an IC die with a top me...

Integration of backside heat spreader for thermal management

Semiconductor package

Semiconductor device including a trench in a semiconductor substrat...

Patents Applicationslast 30 patents

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CRYO-COMPATIBLE QUANTUM COMPUTING ARRANGEMENT AND METHOD FOR PRODUC...

Semiconductor Device And Method Of Manufacturing The Same

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...

SEMICONDUCTOR PACKAGE

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

IMPEDANCE MATCHING CIRCUIT FOR RF DEVICES AND METHOD THEREFOR

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACK...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS

Metal Routing Architecture for Integrated Circuits

WIRE BONDING METHOD AND STRUCTURE

WIRE BONDING METHOD AND STRUCTURE

Metal Routing Architecture for Integrated Circuits

SEMICONDUCTOR DEVICE INCLUDING A TRENCH IN A SEMICONDUCTOR SUBSTRAT...