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H01L2224/45578

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45578being disposed next to each other

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Patents Grantslast 30 patents

Information Patent Grant
Metal post bonding using pre-fabricated metal posts
- Patent number 10,034,390
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a plurality of metal posts
- Patent number 9,263,407
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,217,269
- Issue date Jul 10, 2012
- Raytheon Company
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,026,447
- Issue date Sep 27, 2011
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 7,626,123
- Issue date Dec 1, 2009
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
- Publication number 20140262470
- Publication date Sep 18, 2014
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE
- Publication number 20110310577
- Publication date Dec 22, 2011
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical Microfilament to Circuit Interface
- Publication number 20100116869
- Publication date May 13, 2010
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical microfilament to circuit interface
- Publication number 20070132109
- Publication date Jun 14, 2007
- Sarcos Investments LC.
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...