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H01L2224/0918

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0918being disposed on at least two different sides of the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connecting multiple chips using an interconnect device
- Patent number 12,154,858
- Issue date Nov 26, 2024
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,132,040
- Issue date Oct 29, 2024
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for forming a three-dimensional (3D) memory device having bo...
- Patent number 12,080,697
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,068,299
- Issue date Aug 20, 2024
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having adjoined via structures formed by bond...
- Patent number 11,887,954
- Issue date Jan 30, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 11,855,130
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packages with visible solder fillets
- Patent number 11,855,024
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Qiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 11,830,853
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 11,824,042
- Issue date Nov 21, 2023
- Xcelsis Corporation
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 11,791,307
- Issue date Oct 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, semiconductor package including semiconduc...
- Patent number 11,769,700
- Issue date Sep 26, 2023
- SK hynix Inc.
- Bok Gyu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,721,684
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,710,727
- Issue date Jul 25, 2023
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Vias in composite IC chip structures
- Patent number 11,694,986
- Issue date Jul 4, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 11,658,172
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,594,524
- Issue date Feb 28, 2023
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Serializer-deserializer die for high speed signal interconnect
- Patent number 11,581,282
- Issue date Feb 14, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing front side back-end-of-l...
- Patent number 11,552,055
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 11,488,878
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices having bonding layers
- Patent number 11,450,653
- Issue date Sep 20, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,435,523
- Issue date Sep 6, 2022
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having adjoined via structures formed by bond...
- Patent number 11,424,208
- Issue date Aug 23, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor module for PCB embedding
- Patent number 11,404,392
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die assembly including double-sided inter-die bonding conne...
- Patent number 11,309,301
- Issue date Apr 19, 2022
- SanDisk Technologies LLC
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bonding pads and method of manufacturing...
- Patent number 11,257,802
- Issue date Feb 22, 2022
- TOSHIBA MEMORY CORPORATION
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 11,257,793
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,251,156
- Issue date Feb 15, 2022
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20240387618
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371849
- Publication date Nov 7, 2024
- KIOXIA Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP SHARING DATA BUS
- Publication number 20240266325
- Publication date Aug 8, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240186284
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20240112966
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079392
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079391
- Publication date Mar 7, 2024
- Taiwan Semiconductor Mqanufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Package and Method Forming the Same
- Publication number 20240072034
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20230378247
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230197553
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- KYUNGDON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230163102
- Publication date May 25, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20230081238
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Minho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS
- Publication number 20230065075
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20230069315
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, APPARATUS, AND CHIP
- Publication number 20220238470
- Publication date Jul 28, 2022
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220199597
- Publication date Jun 23, 2022
- INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.
- YA CHU HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-COMPONENT MATERIAL IN MICROELECTRONIC ASSEMBLIES HAVING DIREC...
- Publication number 20220189839
- Publication date Jun 16, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING FRONT SIDE BACK-END-OF-L...
- Publication number 20220165707
- Publication date May 26, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20220149013
- Publication date May 12, 2022
- Samsung Electronics Co., Ltd.
- AE-NEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220149028
- Publication date May 12, 2022
- KIOXIA Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...
- Publication number 20220130803
- Publication date Apr 28, 2022
- Intel Corporation
- Brennen K. MUELLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20220068905
- Publication date Mar 3, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING ADJOINED VIA STRUCTURES FORMED BY BOND...
- Publication number 20220059482
- Publication date Feb 24, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS IN COMPOSITE IC CHIP STRUCTURES
- Publication number 20220037281
- Publication date Feb 3, 2022
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ASSEMBLY INCLUDING DOUBLE-SIDED INTER-DIE BONDING CONNE...
- Publication number 20210375848
- Publication date Dec 2, 2021
- SANDISK TECHNOLOGIES LLC
- Fei ZHOU
- H01 - BASIC ELECTRIC ELEMENTS

being disposed on at least two different sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting multiple chips using an interconnect device

Semiconductor storage device

Method for forming a three-dimensional (3D) memory device having bo...

Semiconductor device and method of manufacturing the same

Chip package structure

Semiconductor devices having adjoined via structures formed by bond...

Three-dimensional device structure including substrate-embedded int...

Wafer chip scale packages with visible solder fillets

Wafer scale bonded active photonics interposer

Semiconductor devices and methods for manufacturing the same

3D chip sharing data bus

DBI to SI bonding for simplified handle wafer

Semiconductor substrate, semiconductor package including semiconduc...

Semiconductor device

Semiconductor storage device

Vias in composite IC chip structures

Hybrid bonding with through substrate via (TSV)

Fabrication and use of through silicon vias on double sided interco...

Serializer-deserializer die for high speed signal interconnect

Integrated circuit (IC) packages employing front side back-end-of-l...

Packaging mechanisms for dies with different sizes of connectors

Bonded three-dimensional memory devices having bonding layers

Wafer scale bonded active photonics interposer

Chip package structure

Semiconductor devices having adjoined via structures formed by bond...

Molded semiconductor module for PCB embedding

Stacked die assembly including double-sided inter-die bonding conne...

Semiconductor device with bonding pads and method of manufacturing...

Semiconductor devices and methods for manufacturing the same

Fabrication and use of through silicon vias on double sided interco...

Patents Applicationslast 30 patents

MIM Capacitor in IC Heterogenous Integration

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

3D CHIP SHARING DATA BUS

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

MULTISIDED INTEGRATED CIRCUIT ASSEMBLY

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Die Structures and Methods of Forming the Same

3DIC Package and Method Forming the Same

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

SEMICONDUCTOR PACKAGE

BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR

IMAGE SENSOR

WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR ELEMENT, APPARATUS, AND CHIP

DISPLAY DEVICE

INTER-COMPONENT MATERIAL IN MICROELECTRONIC ASSEMBLIES HAVING DIREC...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING FRONT SIDE BACK-END-OF-L...

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

SEMICONDUCTOR DEVICES HAVING ADJOINED VIA STRUCTURES FORMED BY BOND...

VIAS IN COMPOSITE IC CHIP STRUCTURES

STACKED DIE ASSEMBLY INCLUDING DOUBLE-SIDED INTER-DIE BONDING CONNE...