being disposed on at least two different sides of the body

Industry

CPC
H01L2224/1418

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1418being disposed on at least two different sides of the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having a high reliability
- Patent number 12,183,718
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,948,930
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,948,903
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,942,446
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,894,346
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
- Patent number 11,887,969
- Issue date Jan 30, 2024
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 11,855,029
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,817,427
- Issue date Nov 14, 2023
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,798,906
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a sidewall connection
- Patent number 11,749,627
- Issue date Sep 5, 2023
- STMicroelectronics Ltd.
- Endruw Jahja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 11,749,535
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,742,217
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection in integrated circuits
- Patent number 11,676,918
- Issue date Jun 13, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC PACKAGE STRUCTURE
- Publication number 20240411096
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL
- Publication number 20240332328
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Hui-Tzu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240304584
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hai-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED...
- Publication number 20240297165
- Publication date Sep 5, 2024
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20240282672
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- BONGWEE YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20240222325
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203813
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Wooseup HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240153834
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Jun Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD
- Publication number 20240071972
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20240057352
- Publication date Feb 15, 2024
- ChangXin Memory Technologies, Inc.
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...
- Publication number 20240021552
- Publication date Jan 18, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD T...
- Publication number 20240006370
- Publication date Jan 4, 2024
- STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
- ZELONG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...
- Publication number 20230395549
- Publication date Dec 7, 2023
- Hewlett-Packard Development Company, L.P.
- DAVID WAYNE GEORGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING
- Publication number 20230317562
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307404
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
- Publication number 20230282607
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Ting Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230260976
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230223373
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quantum Bit Chip and Method for Fabricating Quantum Bit Chip
- Publication number 20230200263
- Publication date Jun 22, 2023
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS

being disposed on at least two different sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package having a high reliability

Semiconductor device with enhanced thermal dissipation and method f...

Low cost package warpage solution

Forming large chips through stitching

Integrated fan-out package and the methods of manufacturing

Semiconductor bonding structures and methods

Method of manufacturing an integrated fan-out package having fan-ou...

Multi-die fine grain integrated voltage regulation

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Package structure with bridge die laterally wrapped by insulating e...

Chiplets with connection posts

Semiconductor package and manufacturing method thereof

Semiconductor assemblies using edge stacking and methods of manufac...

Semiconductor package and method of manufacturing the same

Semiconductor package

Semiconductor package and method of manufacturing the same

Method for fabricating a chip package

Semiconductor structure and manufacturing method thereof

Semiconductor package having a high reliability

Signal delivery in stacked device

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor die connection system and method

Semiconductor device having through silicon vias and manufacturing...

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Semiconductor chip

Low cost package warpage solution

Semiconductor package having a sidewall connection

Semiconductor bonding structures and methods

Passive devices in package-on-package structures and methods for fo...

Electrostatic discharge protection in integrated circuits

Patents Applicationslast 30 patents

OPTOELECTRONIC PACKAGE STRUCTURE

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

METHOD OF FORMING PACKAGE STRUCTURE

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

PACKAGE STRUCTURE

DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED...

SEMICONDUCTOR DEVICE INCLUDING A THREE-DIMENSIONAL INTEGRATED CIRCUIT

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

SEMICONDUCTOR PACKAGE

CHIPLETS WITH CONNECTION POSTS

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE

CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...

CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD T...

INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...

LOW COST PACKAGE WARPAGE SOLUTION

DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

Quantum Bit Chip and Method for Fabricating Quantum Bit Chip