being formed on the semiconductor or solid-state body to be connected

Industry

CPC
H01L2224/24991

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24991being formed on the semiconductor or solid-state body to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and manufacturing method therefor
- Patent number 12,040,318
- Issue date Jul 16, 2024
- Samsung Display Co., Ltd.
- Jong Hyuk Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bridged fanout chiplet connectivity
- Patent number 11,658,123
- Issue date May 23, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging module and manufacturing method for the same
- Patent number 11,552,039
- Issue date Jan 10, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Zengsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,508,687
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,833,039
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating at least one 3D interconnection for the manu...
- Patent number 10,438,923
- Issue date Oct 8, 2019
- 3DIS Technologies
- Ayad Ghannam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,163,857
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die package with openings surrounding end-portions of through packa...
- Patent number 10,079,225
- Issue date Sep 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 9,691,706
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting a plurality of unpackaged substrates
- Patent number 9,165,905
- Issue date Oct 20, 2015
- EPCOS AG
- Hans Krueger
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240178357
- Publication date May 30, 2024
- AUO Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR
- Publication number 20240105658
- Publication date Mar 28, 2024
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230386949
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Jiyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230967
- Publication date Jul 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- In Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20230066130
- Publication date Mar 2, 2023
- LG Display Co., Ltd.
- MinJae KANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220359478
- Publication date Nov 10, 2022
- SAMSUNG DISPLAY CO., LTD.
- Xinxing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE
- Publication number 20220139863
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY
- Publication number 20220102276
- Publication date Mar 31, 2022
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200251438
- Publication date Aug 6, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Zengsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Fan Out Package and Methods of Forming the Same
- Publication number 20190109118
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANU...
- Publication number 20180254258
- Publication date Sep 6, 2018
- 3DIS Technologies
- Ayad Ghannam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die package with Openings Surrounding End-portions of Through Packa...
- Publication number 20170229432
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Fan Out Package and Methods of Forming the Same
- Publication number 20130187270
- Publication date Jul 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Connecting a Plurality of Unpackaged Substrates
- Publication number 20120159778
- Publication date Jun 28, 2012
- EPCOS AG
- Hans Krueger
- B81 - MICRO-STRUCTURAL TECHNOLOGY

being formed on the semiconductor or solid-state body to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and manufacturing method therefor

Hybrid bridged fanout chiplet connectivity

Embedded packaging module and manufacturing method for the same

Semiconductor package

Bare die integration with printed components on flexible substrate...

Multi-chip fan out package and methods of forming the same

Method for integrating at least one 3D interconnection for the manu...

Multi-chip fan out package and methods of forming the same

Bare die integration with printed components on flexible substrate...

Die package with openings surrounding end-portions of through packa...

Multi-chip fan out package and methods of forming the same

Method for connecting a plurality of unpackaged substrates

Patents Applicationslast 30 patents

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME

INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE

HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY

EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

Multi-Chip Fan Out Package and Methods of Forming the Same

METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANU...

Die package with Openings Surrounding End-portions of Through Packa...

Multi-Chip Fan Out Package and Methods of Forming the Same

Method for Connecting a Plurality of Unpackaged Substrates