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H01L2224/83075

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83075being inert

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Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Component joining apparatus, component joining method and mounted s...
- Patent number 11,574,888
- Issue date Feb 7, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,456,263
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-eutectic bonding
- Patent number 11,141,810
- Issue date Oct 12, 2021
- TECHNI HOLDING AS
- Andreas Larsson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,903,185
- Issue date Jan 26, 2021
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for bonding electronic component and method for manufacturin...
- Patent number 10,875,127
- Issue date Dec 29, 2020
- Nichia Corporation
- Teppei Kunimune
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining a surface-mount component to a substrate with sol...
- Patent number 10,879,211
- Issue date Dec 29, 2020
- RSM Electron Power, Inc.
- Robert Conte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing soldered product
- Patent number 10,843,300
- Issue date Nov 24, 2020
- ORIGIN COMPANY, LIMITED
- Yukiko Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,821,558
- Issue date Nov 3, 2020
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joint manufacturing method
- Patent number 10,821,543
- Issue date Nov 3, 2020
- Nitto Denko Corporation
- Nao Kamakura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 10,692,826
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,529,638
- Issue date Jan 7, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,396,006
- Issue date Aug 27, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Strong, heat stable junction
- Patent number 10,026,708
- Issue date Jul 17, 2018
- The United States of America as represented by the Secretary of the Army
- Patrick J Taylor
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220367391
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT EXCHANGE METHOD USING FLUORINATED COMPOUNDS HAVING A LOW GWP
- Publication number 20220259477
- Publication date Aug 18, 2022
- SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
- Vito TORTELLI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200321294
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT JOINING APPARATUS, COMPONENT JOINING METHOD AND MOUNTED S...
- Publication number 20190189586
- Publication date Jun 20, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- RYO FUJITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20190096830
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20170229424
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20160172328
- Publication date Jun 16, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION FOR BONDING
- Publication number 20140312285
- Publication date Oct 23, 2014
- BANDO CHEMICAL INDUSTRIES, LTD.
- Masafumi Takesue
- B82 - NANO-TECHNOLOGY
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sintering Utilizing Non-Mechanical Pressure
- Publication number 20140224409
- Publication date Aug 14, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140197533
- Publication date Jul 17, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20140193658
- Publication date Jul 10, 2014
- Indium Corporation
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
- Publication number 20140153210
- Publication date Jun 5, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20140111956
- Publication date Apr 24, 2014
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRONG, HEAT STABLE JUNCTION
- Publication number 20140110848
- Publication date Apr 24, 2014
- U.S. ARMY RESEARCH LABORATORY ATTN: RDRL-LOC-I
- Patrick J. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE
- Publication number 20140103531
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Taichi Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...
- Publication number 20140008801
- Publication date Jan 9, 2014
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD
- Publication number 20130323529
- Publication date Dec 5, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130216847
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- B32 - LAYERED PRODUCTS

being inert

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Semiconductor structure

Advanced device assembly structures and methods

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Component joining apparatus, component joining method and mounted s...

Chip assembly

Semiconductor structure and method for forming the same

Alternative compositions for high temperature soldering applications

Non-eutectic bonding

Bonded structure and method of manufacturing the same

Low pressure sintering powder

Bonding material and bonding method using same

Method for bonding electronic component and method for manufacturin...

Method of joining a surface-mount component to a substrate with sol...

Method for producing soldered product

Bonding material and bonding method using same

Joint manufacturing method

Method for producing a silver sintering agent having silver oxide s...

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Semiconductor structure and method for forming the same

Chip assembly

Conductive paste and die bonding method

Molded air cavity packages and methods for the production thereof

Method for manufacturing semiconductor apparatus, method for manufa...

Molded air cavity packages and methods for the production thereof

Conductive connecting member and manufacturing method of same

Metallic particle paste, cured product using same, and semiconducto...

Bonding method using bonding material

Strong, heat stable junction

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

HEAT EXCHANGE METHOD USING FLUORINATED COMPOUNDS HAVING A LOW GWP

Advanced Device Assembly Structures And Methods

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

DIE BONDING APPARATUS AND DIE BONDING METHOD

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

COMPONENT JOINING APPARATUS, COMPONENT JOINING METHOD AND MOUNTED S...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

DIE BONDING APPARATUS AND DIE BONDING METHOD

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

BONDING MATERIAL AND BONDING METHOD USING THE SAME

COMPOSITION FOR BONDING

Joint Material, and Jointed Body

WAFER STACK PROTECTION SEAL

Sintering Utilizing Non-Mechanical Pressure

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

STRONG, HEAT STABLE JUNCTION

BONDED STRUCTURE

SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...

BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...