Patent Application
20200243477
The present disclosure relates to a die bonding apparatus and a die bonding method.
A die bonding apparatus is used for bonding a first member such as a support base member to a second member such as a semiconductor chip (see Japanese Patent No. 4935491 and Japanese Laid-open Patent Publication No. 2009-81218). Usually, the die bonding apparatus performs the bonding by heating the first member to melt a brazing material applied on its surface, or by supplying a brazing material to the first member on a heater, heating and melting the brazing material, and then contacting the first member with the second member. The brazing material used for the bonding is, for example, solder or electrically conductive adhesive.
However, when a temperature of the second member immediately before bonding is lower than a temperature of the brazing material on the surface of the first member, the brazing material would be solidified in a short period of time at the time of bonding; therefore, a bonding operation may be completed without sufficient wettability between the brazing material and the second member. In this case, there is a problem that a thermal resistance between the first member and the second member increases and the property and reliability of the second member may decrease. Moreover, when a size of the second member is large such as a chip of a long-cavity-type semiconductor laser element and a chip of a laser bar in which semiconductor lasers are arranged in arrays, the bonding operation may be completed with a region having locally insufficient wettability due to a warp in a longitudinal direction of the chip. In this case, there may also be the problem of decreasing property and reliability of the chips.
There is a need for a die bonding apparatus and a die bonding method that are capable of performing a preferable bonding without decreasing property and reliability of members.
A die bonding apparatus may include: a mounting base including a mounting area on which a first member is mounted; a heater arranged below the mounting base; a side wall configured to surround the mounting area; a collet configured to hold a second member by vacuum-chucking at an end portion; a lid including a hole configured to allow the first and second members pass therethrough, the lid being mounted on the side wall; a moving structure configured to move the collet to transport the second member held by the collet through the hole for bonding the second member to the first member; and a gas-supplying tube arranged on the side wall and configured to supply a heating gas to a heating space formed by the side wall and the lid, and the lid may contain a material capable of: reflecting an infrared radiation caused by the heater and the heating gas; or absorbing and re-radiating the infrared radiation.
A die bonding method may include: mounting a first member on a mounting area of a mounting base; heating the first member by a heater; supplying a heating gas to a heating space formed by the mounting base, a side wall configured to surround the mounting area, and a lid including a hole configured to allow the first member and a second member to pass therethrough, the lid being mounted on the side wall; introducing the second member held by the collet into the heating space through the hole of the lid; and bonding the second member to the first member by contacting the second member with the first member, and the lid may contain a material capable of: reflecting an infrared radiation caused by the heater and the heating gas; or absorbing and re-radiating the infrared radiation.
The above and other objects, features, advantages and technical and industrial significance of this disclosure will be better understood by reading the following detailed description of the disclosure, when considered in connection with the accompanying drawings.
FIG. is a schematic partially-cut-off side view of a die bonding apparatus according to an embodiment;
Next, an embodiment of the present disclosure will be explained in detail with reference to the drawings. The present disclosure is not limited to this embodiment.
The die bonding apparatus 100 includes a mounting base 1, a heater 2, a side wall 3, a lid 4, a collet 5, a moving structure 6 for the collet 5, a gas-supplying tube 7, and position-adjusting arms 8 and 9.
Although the mounting base 1 is made of stainless steel, the mounting base 1 may be made of other metal material such as copper or the like. The mounting base 1 includes a mounting area 1a. The sub-mount is mounted on a surface of the mounting area 1a. Moreover, a suction hole 1b communicating with a vacuum pump is formed in the mounting area 1a of the mounting base 1.
The heater 2 is arranged below the mounting area 1a of the mounting base 1. The side wall 3 is configured to surround the mounting area 1a of the mounting base 1 and has a multi-layer structure configured by two layers including a metal plate member 3a and a metal plate member 3b which are arranged with a space therebetween. The metal plate members 3a and 3b are made of stainless steel but may be made of other metal material such as copper or the like.
The lid 4 is mounted on the side wall 3. The lid 4 is a plate member made of stainless steel but may be a plate member made of other metal material such as copper or the like. The lid 4 has a hole 4a which is large enough to allow the sub-mount and the semiconductor chip to pass therethrough. The side wall 3 and the lid 4 form a heating space HS. The lid 4 is not fixed to the side wall 3 but detachable from the side wall 3. By this, it is easy to perform maintenance on (cleaning, adjustment or the like) the heating space HS by detaching the lid 4. Alternatively, the lid 4 and the side wall 3 may be monolithically formed or may have a structure for preventing gas leakage or thermal leakage caused by radiation. The hole 4a of the lid 4 mounted on the side wall 3 is positioned above the mounting area 1a of the mounting base 1.
The collet 5 includes: a main body portion 5a made of metal; and an end portion 5b made of polyimide resin, and the collet 5 is a round collet having a round end surface. Moreover, a suction hole 5c is formed in the collet 5. The suction hole 5c is opened at an end surface of the end portion 5b and communicates with the vacuum pump. The collet 5 may hold the semiconductor chip on the end portion 5b by sucking the semiconductor chip through the suction hole 5c by vacuum-chucking.
The collet 5 is attached to the moving structure 6. The moving structure 6 is a structure for moving the collet 5. A suction hole 6a is formed in the moving structure 6. The suction hole 5c communicates to the vacuum pump through the suction hole 6a.
The gas-supplying tube 7 is arranged to penetrate through the side wall 3 and supplies a heating gas to the heating space HS. The position-adjusting arms 8 and 9 penetrate through the side wall 3 and are arranged movably in directions orthogonal to each other. More specifically, the position-adjusting arm 8 is movable in a left-right direction on
The die bonding apparatus 100 has a conveying mechanism (not illustrated) for moving the sub-mount to the mounting area 1a of the mounting base 1 and mounting the sub-mount on the mounting area 1a.
Next, a die bonding method using the die bonding apparatus 100 will be explained with reference to
First, as illustrated in
Next, a heating step is performed in which the sub-mount M is heated by the heater 2. Next, a gas-supplying step is performed in which a heating gas G is injected and supplied from the gas-supplying tube 7 as indicated by an arrow illustrated in
Herein, the inside of the heating space HS is heated by the heater 2 and the heating gas G, an infrared radiation occurs from the mounting base 1 and the side wall 3. In the die bonding apparatus 100 of the embodiment, since the lid 4 is made of stainless steel that is a metal material, the lid 4 reflects, or absorbs and re-radiates the infrared radiation. As a result, the decrease of the temperature in the heating space HS is prevented.
Next, a bonding step is performed. Specifically, the semiconductor chip C held by the vacuum-chucking of the collet 5 is introduced into the heating space HS through the hole 4a of the lid 4 by the moving structure 6. The semiconductor chip C is heated preliminarily in the heating space HS. After that, the semiconductor chip C is contact with and pressed to the brazing material layer M3 of the sub-mount M with the collet 5 to perform the bonding. After that, by taking out the sub-mount M from the die bonding apparatus 100 and performing a predetermined wiring step between the electrode layer M2 and the semiconductor chip C, the chip-on-sub-mount is manufactured.
A time period from the heating step until the semiconductor chip C is contacted with and pressed to the brazing material layer M3 of the sub-mount M to perform the bonding is set not to alter the brazing material layer M3.
Moreover, in order to heat the semiconductor chip C to an appropriate temperature reliably, a semiconductor chip C may be transported inside the heating space HS at a relatively slow first speed and after that, the semiconductor chip C may be contacted with the sub-mount M at a second speed which is faster than the first speed. Alternatively, the transportation of the semiconductor chip C may be paused inside the heating space HS for a predetermined period, and after that, the semiconductor chip C may be transported to contact with the sub-mount M.
In the die bonding apparatus 100 according to the embodiment, as a result of the reflection, or absorption and re-radiation of the infrared radiation by the lid 4, the temperature inside the heating space HS is restrained from lowering. For that reason, the temperature of the semiconductor chip C immediately before bonding is maintained appropriately relative to the temperature of the brazing material layer M3 of the sub-mount M. Hereby, at the time of the bonding, the brazing material layer M3 is solidified with sufficient wettability between the brazing material layer M3 and the semiconductor chip C, and the bonding is completed. As a result, since thermal resistances of the semiconductor chip C and the sub-mount M are restricted or prevented from increasing, a property of the semiconductor chip C is restricted or prevented from being deteriorated, thus reliability improves.
In order to reduce a gap between the lid 4 and the side wall 3, it is preferable to make the lid 4 heavy. By reducing the gap, the heating gas G may be prevented from leaking via the gap.
If the lid 4 is made of a transparent material such as glass, although a bonding operation becomes visible, the infrared radiation would transmit through the lid, and the temperature of the semiconductor chip C immediately before bonding would decrease relative to the temperature of the brazing material layer M3 of the sub-mount M, and an increase in the thermal resistance might occur due to a poor bonding.
Especially, when the semiconductor chip C is large (for example, 4 mm or longer in a longitudinal direction), a warp may occur in the longitudinal direction of the chip. In this case, if the temperature of the semiconductor chip C is low, there exists an area of the semiconductor chip C contacting with the brazing material layer M3 early, and the temperature of the brazing material layer M3 decreases and the brazing material layer M3 may be solidified as soon as the area has contacted with the brazing material layer M3. In such a case, a wettability of an area contacting with the brazing material layer M3 later may be insufficient locally. By contrast, since the temperature of the semiconductor chip C immediately before bonding is maintained appropriately in the die bonding apparatus 100, generation of an area where wettability is insufficient locally as explained above is restricted or prevented.
In addition, since the side wall 3 has the multi-layer structure in the die bonding apparatus 100, heat inside the heating space HS is hardly dissipated, and so the temperature is restrained from decreasing more effectively.
Moreover, in order to maintain a high temperature uniformly in the heating space HS, it is preferable to make a volume of the heating space HS as small as possible (not make the volume large beyond the necessity) comparing to the sizes of the sub-mount M and the semiconductor chip C.
Although the heating gas G supplied from the gas-supplying tube 7 is nitrogen gas in the embodiment, for example, it may be other inert gas such as argon gas, reducing gas such as hydrogen gas, or mixture gas of inert gas and reducing gas. When the heating gas G is reducing gas, there is an effect of preventing oxidation of the brazing material layer M3. Alternatively, the heating gas G may be air.
In the die bonding apparatus 100, the end portion 5b of the collet 5 as a part contacting with the semiconductor chip C is made of a resin, and its thermal conductivity is lower than that of metal. As a result, decrease in the temperature of the semiconductor chip C caused by the heat of the semiconductor chip C conducted to the collet 5 is restricted or prevented. Moreover, a gap between the semiconductor chip C and the end portion 5b is reduced since the end portion 5b is made of a resin, adhesion between the semiconductor chip C and the end portion 5b increases. As a result, decrease in the temperature of the semiconductor chip C caused by an inflow of the gas from the gap is restricted or prevented. By using a resin having a lower hardness, the effect of decreasing the gap further increases. Moreover, since the end portion 5b is made of a resin, the semiconductor chip C is restricted or prevented from receiving an impact from the collet 5 when performing vacuum-chucking or the like. Although polyimide is an example for a preferable resin from viewpoints of heat resistance and hardness, other resins may be used.
In the die bonding apparatus 100, the collet 5 is a round collet.
Another Arrangement Example of Gas-Supplying Tube
Another Structural Example for Collet
An area of the end surface of the end portion 5Ab of the collet 5A is smaller than a vacuum-chucked area of the semiconductor chip C. Therefore, an area of the suction hole 5Ac which is an area where the collet 5A vacuum-chucks the semiconductor chip C is also smaller than the vacuum-chucked area of the surface of the semiconductor chip C. Hereby, when the collet 5A vacuum-chucks the semiconductor chip C, the suction hole 5Ac is prevented from being offset from the semiconductor chip C to cause inflow of gas from there.
When using the flat collet having a shape illustrated in
Another Structural Example for Lid
As an example 1, a plurality of samples of chip-on-sub-mounts were manufactured, in the configuration of the die bonding apparatus 100 according to the embodiment, by die-bonding the semiconductor chips having lengths of 1 to 5 mm on the sub-mounts by using a die bonding apparatus in which the collet was the flat collet. On the other hand, as a comparative example, a plurality of samples of chip-on-sub-mounts were manufactured, in the configuration of the die bonding apparatus according to the example 1, by die-bonding semiconductor chips having lengths of 1 to 5 mm on the sub-mounts by using a die bonding apparatus in which a glass plate was used as the lid. After that, the semiconductor chips were removed from the sub-mounts of the manufactured chip-on-sub-mounts, and bonding conditions thereof were examined. The comparative example is different from the example 1 only in the material of the lid. Table 1 shows the results. The temperature in the heating space (preliminary heating temperature) was changed between 100° C. and 440° C., but the Table 1 only shows the result obtained at the temperature of 420° C.
As shown in the Table 1, in case of the comparative example, the bonding conditions of all the samples were good (as represented by “good”) when the lengths of the semiconductor chips were 1 to 2 mm; however, the bonding conditions of some samples were poor (as represented by “poor”) when the length of the semiconductor chip was 3 mm, and the bonding conditions of all the samples were poor (as represented by “bad”) when the lengths of the semiconductor chips were 4 to 5. On the other hand, in the example 1, the bonding conditions of all the samples of the semiconductor chips were good in all lengths. When the bonding condition is “good”, it indicates that a ratio of a trace of a chip remaining on the sub-mount after removing the semiconductor chip was 90% or more of a chip size.
Next, as an example 2, a plurality of samples of the chip-on-sub-mounts were manufactured by die-bonding the semiconductor chips having lengths of 4 mm on the sub-mounts by using a die bonding apparatus having the configuration of the die bonding apparatus 100 according to the embodiment (that is, the configuration using the round collet). Moreover, as an example 3, a plurality of samples of the chip-on-sub-mounts were manufactured by die-bonding the semiconductor chips having lengths of 4 mm on the sub-mounts by using the die bonding apparatus of the configuration of the example 2. However, in the example 3, the volume of the brazing material (AuSn solder) in the sub-mounts was increased to 1.5 to 3 times in comparison to those of the examples 1 and 2. After that, the semiconductor chips were removed from the sub-mounts of the manufactured chip-on-sub-mounts, and the bonding conditions were examined. Table 2 shows results together with results of the comparative example and results of the example 1 in which the lengths of the semiconductor chips were 4 mm.
As shown in the Table 2, when the lengths of the semiconductor chips were 4 mm or longer in the comparative example, the bonding conditions of all the samples were poor at all of the temperatures. However, in the example 1, the bonding conditions of all the samples were good in the temperature range of 400° C. to 420° C. Moreover, in the example 2, the bonding conditions of all the samples were good in the temperature range of 380° C. to 420° C. Moreover, in the example 3, the bonding conditions of all the samples were good in the temperature range of 360° C. to 420° C.
The disclosure is not limited to the above-described Embodiment. The disclosure includes a configuration appropriately combining the above-described elements. Further effects or modification examples may be derived by an ordinary skilled person in the art easily. Therefore, further wide aspects of the disclosure are not limited to the above-described Embodiments, and various modifications may be made.
As described above, the die bonding apparatus and the die bonding method according to the present disclosure are suitable for use in, for example, die bonding a semiconductor chip.
The present disclosure attains an effect of performing a preferable bonding without decreasing property and reliability of members.
Although the disclosure has been described with respect to specific embodiments for a complete and clear disclosure, the appended claims are not to be thus limited but are to be construed as embodying all modifications and alternative constructions that may occur to one skilled in the art that fairly fall within the basic teaching herein set forth.
This application is a divisional of U.S. application Ser. No. 15/631,541, filed Jun. 23, 2017, which is a continuation of International Application No. PCT/JP2016/082313, filed on Oct. 31, 2016, which claims the benefit of priority from U.S. Provisional Patent Application 62/251,484 filed on Nov. 5, 2015, the entire contents of which are incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 62251484 | Nov 2015 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 15631541 | Jun 2017 | US |
| Child | 16849564 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2016/082313 | Oct 2016 | US |
| Child | 15631541 | US |
