being mutually engaged together

Industry

CPC
H01L2224/05076

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05076being mutually engaged together

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,087,748
- Issue date Sep 10, 2024
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,728,299
- Issue date Aug 15, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,646,280
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,469,195
- Issue date Oct 11, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads of semiconductor devices
- Patent number 11,244,915
- Issue date Feb 8, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing reentrant shaped bonding pads an...
- Patent number 11,201,139
- Issue date Dec 14, 2021
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure in microelectronic component
- Patent number 11,088,099
- Issue date Aug 10, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure and integrated circuit die using the same
- Patent number 10,910,330
- Issue date Feb 2, 2021
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic product
- Patent number 10,636,755
- Issue date Apr 28, 2020
- Hannstar Display Corporation
- Hsuan-Chen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 10,515,913
- Issue date Dec 24, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 10,483,241
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,153,241
- Issue date Dec 11, 2018
- Toyota Jidosha Kabushiki Kaisha
- Takemasa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paths through dielectric with a high aspect ratio for se...
- Patent number 9,576,918
- Issue date Feb 21, 2017
- Intel IP Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged nano-structured component and method of making a packaged...
- Patent number 9,249,014
- Issue date Feb 2, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,653,667
- Issue date Feb 18, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,586,480
- Issue date Nov 19, 2013
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic elements and devices with trench under bond pad feature
- Patent number 8,134,241
- Issue date Mar 13, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming an RF device with trench under bond pad feature
- Patent number 7,998,852
- Issue date Aug 16, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device
- Patent number 7,994,638
- Issue date Aug 9, 2011
- Panasonic Corporation
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure with stress-buffering layer capping interconnect...
- Patent number 7,741,714
- Issue date Jun 22, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021550
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021551
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230163087
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230091325
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Emiko INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005866
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...
- Publication number 20220278025
- Publication date Sep 1, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...
- Publication number 20220093490
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20220059478
- Publication date Feb 24, 2022
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20210335737
- Publication date Oct 28, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...
- Publication number 20210296284
- Publication date Sep 23, 2021
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210134744
- Publication date May 6, 2021
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS OF SEMICONDUCTOR DEVICES
- Publication number 20210134742
- Publication date May 6, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20200105692
- Publication date Apr 2, 2020
- INVENSAS BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190131510
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190103542
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-metal contact structure
- Publication number 20180269172
- Publication date Sep 20, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE AND INTEGRATED CIRCUIT DIE USING THE SAME
- Publication number 20180261561
- Publication date Sep 13, 2018
- MEDIATEK INC.
- Chun-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180218987
- Publication date Aug 2, 2018
- Toyota Jidosha Kabushiki Kaisha
- Takemasa WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PATHS THROUGH DIELECTRIC WITH A HIGH ASPECT RATIO FOR SE...
- Publication number 20160343677
- Publication date Nov 24, 2016
- Intel IP Corporation
- THORSTEN MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Nano-Structured Component and Method of Making a Packaged...
- Publication number 20140126165
- Publication date May 8, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
- Publication number 20140042624
- Publication date Feb 13, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENTS AND DEVICES WITH TRENCH UNDER BOND PAD FEATURE
- Publication number 20110266687
- Publication date Nov 3, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICE AND METHOD WITH TRENCH UNDER BOND PAD FEATURE
- Publication number 20100140814
- Publication date Jun 10, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20100032832
- Publication date Feb 11, 2010
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for bonding an IC chip
- Publication number 20060175711
- Publication date Aug 10, 2006
- Hannstar Display Corporation
- Pao-Yun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure with stress-buffering layer capping interconnect...
- Publication number 20060091536
- Publication date May 4, 2006
- Tai-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS

being mutually engaged together

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and manufacturing method thereof

Multi-metal contact structure

Semiconductor device with tilted insulating layers and method for f...

Method for fabricating semiconductor device

Semiconductor device with tilted insulating layers and method for f...

Bond pads of semiconductor devices

Semiconductor structure containing reentrant shaped bonding pads an...

Multi-metal contact structure in microelectronic component

Semiconductor devices with through silicon vias and package-level c...

Pad structure and integrated circuit die using the same

Electronic product

Two-component bump metallization

Two-component bump metallization

Multi-metal contact structure

Semiconductor devices with through silicon vias and package-level c...

Semiconductor device and method of manufacturing the same

Conductive paths through dielectric with a high aspect ratio for se...

Packaged nano-structured component and method of making a packaged...

Power MOSFET having selectively silvered pads for clip and bond wir...

Power MOSFET having selectively silvered pads for clip and bond wir...

Electronic elements and devices with trench under bond pad feature

Methods for forming an RF device with trench under bond pad feature

Semiconductor chip and semiconductor device

Bond pad structure with stress-buffering layer capping interconnect...

Patents Applicationslast 30 patents

MULTI-METAL CONTACT STRUCTURE

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...

SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

BOND PADS OF SEMICONDUCTOR DEVICES

MULTI-METAL CONTACT STRUCTURE

TWO-COMPONENT BUMP METALLIZATION

TWO-COMPONENT BUMP METALLIZATION

Multi-metal contact structure

PAD STRUCTURE AND INTEGRATED CIRCUIT DIE USING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE PATHS THROUGH DIELECTRIC WITH A HIGH ASPECT RATIO FOR SE...

Packaged Nano-Structured Component and Method of Making a Packaged...

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

ELECTRONIC ELEMENTS AND DEVICES WITH TRENCH UNDER BOND PAD FEATURE

RF DEVICE AND METHOD WITH TRENCH UNDER BOND PAD FEATURE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

Structure and method for bonding an IC chip

Bond pad structure with stress-buffering layer capping interconnect...