being non uniform along the bump connector

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CPC
H01L2224/16058

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16058being non uniform along the bump connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pre-molded leadframes in semiconductor devices
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- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
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- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
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Information Patent Grant
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- Issue date Nov 26, 2024
- Murata Manufacturing Co., Ltd.
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Semiconductor device package and methods of manufacture
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- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
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Information Patent Grant
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- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
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- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace interconnect
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- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
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- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
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- Issue date Sep 20, 2022
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- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped interconnect bumps in semiconductor devices
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- Issue date Sep 13, 2022
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- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, method for producing the same, endosco...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
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- Issue date May 24, 2022
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- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having elongated...
- Patent number 11,289,415
- Issue date Mar 29, 2022
- Murata Manufacturing Co., Ltd.
- Mizuho Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 11,217,548
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 11,152,322
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a carrier with components, pigment for assemb...
- Patent number 11,127,890
- Issue date Sep 21, 2021
- OSRAM OLED GmbH
- Andreas Ploessl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing interconnect structure
- Patent number 11,121,104
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Renesas Electronics Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
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- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
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- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 10,957,666
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 10,910,335
- Issue date Feb 2, 2021
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with intermetallic palladium joints and ass...
- Patent number 10,861,825
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
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- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20240339426
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- NXP B.V.
- Wen Yuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20240306303
- Publication date Sep 12, 2024
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
- Publication number 20240258266
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- Taiwan Semiconductor Manufacturing Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
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INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS
- Publication number 20230230949
- Publication date Jul 20, 2023
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230099844
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230091632
- Publication date Mar 23, 2023
- Rohm Co., Ltd.
- Satoshi KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230069490
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20230017939
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- EPISTAR CORPORATION
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...
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- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220270962
- Publication date Aug 25, 2022
- Murata Manufacturing Co., Ltd.
- Mizuho ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
- Publication number 20220238480
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes in Semiconductor Devices
- Publication number 20220037277
- Publication date Feb 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Molded Leadframes in Semiconductor Devices
- Publication number 20210210453
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20210151405
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- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Interconnect
- Publication number 20210074673
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20200343224
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20200243493
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20200227371
- Publication date Jul 16, 2020
- Epistar Corporation
- Shih-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...
- Publication number 20200219836
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- SONY CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS

being non uniform along the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Semiconductor device including semiconductor chip having elongated...

Semiconductor device and a method of manufacturing thereof

Conductive terminal for side facing packages

Semiconductor package

Semiconductor device package and methods of manufacture

Multilayer substrate

Methods of manufacturing a semiconductor device including a joint a...

Industrial chip scale package for microelectronic device

Bump-on-trace interconnect

Semiconductor device assembly with through-package interconnect and...

Semiconductor device and a method of manufacturing thereof

Shaped interconnect bumps in semiconductor devices

Electronic component module, method for producing the same, endosco...

Semiconductor packages and methods of forming same

Semiconductor device including semiconductor chip having elongated...

Semiconductor device structure and manufacturing method

Leadframes in semiconductor devices

Method for assembling a carrier with components, pigment for assemb...

Method for manufacturing interconnect structure

Surface mounting semiconductor components

Semiconductor device

Lead-free solder joining of electronic structures

Assembly comprising hybrid interconnecting means including intermed...

Interconnection structure including a metal post encapsulated by a...

Pre-molded leadframes in semiconductor devices

Semiconductor device and a method of manufacturing thereof

Mechanisms for forming hybrid bonding structures with elongated bumps

Interconnect structures with intermetallic palladium joints and ass...

Patents Applicationslast 30 patents

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

SEMICONDUCTOR PACKAGE

LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE

RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE

Leadframes in Semiconductor Devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Pre-Molded Leadframes in Semiconductor Devices

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

Bump-on-Trace Interconnect

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF

ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES