being non uniform along the connector

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H01L2224/45013

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45013being non uniform along the connector

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Patents Grantslast 30 patents

Information Patent Grant
Electrode connection structure, lead frame, and method for forming...
- Patent number 10,903,146
- Issue date Jan 26, 2021
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components with integral lead frame and wires
- Patent number 10,529,653
- Issue date Jan 7, 2020
- STMicroelectronics S.R.L.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,217,269
- Issue date Jul 10, 2012
- Raytheon Company
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,026,447
- Issue date Sep 27, 2011
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 7,626,123
- Issue date Dec 1, 2009
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit interconnect
- Patent number 6,794,760
- Issue date Sep 21, 2004
- Intel Corporation
- Edward Jaeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave circuit package and edge conductor structure
- Patent number 6,331,806
- Issue date Dec 18, 2001
- Honda Giken Kogyo Kabushiki Kaisha
- Masahito Shingyoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch bonding method using rectangular wire and capillary bore
- Patent number 6,109,508
- Issue date Aug 29, 2000
- Texas Instruments Incorporated
- John Orcutt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch bonding technique using rectangular wire and capillary bore
- Patent number 6,032,850
- Issue date Mar 7, 2000
- Texas Instruments Incorporated
- John Orcutt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon, bonding wire and microwave circuit package
- Patent number 5,936,492
- Issue date Aug 10, 1999
- Honda Giken Kogyo Kabushiki Kaisha
- Masahito Shingyoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable-width lead interconnection structure and method
- Patent number 5,736,784
- Issue date Apr 7, 1998
- Hewlett-Packard Co.
- Lewis R. Dove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bonding wires
- Patent number 5,177,590
- Issue date Jan 5, 1993
- Kabushiki Kaisha Toshiba
- Toshihiro Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 5,101,263
- Issue date Mar 31, 1992
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160126209
- Publication date May 5, 2016
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE
- Publication number 20110310577
- Publication date Dec 22, 2011
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical Microfilament to Circuit Interface
- Publication number 20100116869
- Publication date May 13, 2010
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus for wire bonding and integrated circuit chip package
- Publication number 20080197461
- Publication date Aug 21, 2008
- Taiwan Semiconductor Manufacturing Co.,Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical microfilament to circuit interface
- Publication number 20070132109
- Publication date Jun 14, 2007
- Sarcos Investments LC.
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

being non uniform along the connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrode connection structure, lead frame, and method for forming...

Electronic components with integral lead frame and wires

Electrical microfilament to circuit interface

Electrical microfilament to circuit interface

Electrical microfilament to circuit interface

Integrated circuit interconnect

Microwave circuit package and edge conductor structure

Fine pitch bonding method using rectangular wire and capillary bore

Fine pitch bonding technique using rectangular wire and capillary bore

Ribbon, bonding wire and microwave circuit package

Variable-width lead interconnection structure and method

Semiconductor device having bonding wires

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE

Electrical Microfilament to Circuit Interface

Apparatus for wire bonding and integrated circuit chip package

Electrical microfilament to circuit interface