being non uniform along the connector

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H01L2224/37013

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/37013being non uniform along the connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor package and smart card having the same
- Patent number 12,294,000
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current shunt with reduced temperature relative to voltage drop
- Patent number 11,810,888
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Andreas Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode semiconductor device and method of manufacture
- Patent number 11,538,795
- Issue date Dec 27, 2022
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,380,608
- Issue date Jul 5, 2022
- Fuji Electric Co., Ltd.
- Hayato Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with space efficient lead and die pad design
- Patent number 11,069,600
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated spring mounted chip termination
- Patent number 10,818,992
- Issue date Oct 27, 2020
- Smiths Interconnect Americas, Inc.
- Christopher Raymond Hawn
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing a package having a power semiconductor chip
- Patent number 10,734,250
- Issue date Aug 4, 2020
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,658,274
- Issue date May 19, 2020
- Nexperia B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,600,712
- Issue date Mar 24, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yuji Morinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,510,636
- Issue date Dec 17, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,373,919
- Issue date Aug 6, 2019
- Fuji Electric Co., Ltd.
- Tatsuhiko Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,824,949
- Issue date Nov 21, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,530,723
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Akira Muto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and structure therefor
- Patent number 9,460,995
- Issue date Oct 4, 2016
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 9,455,238
- Issue date Sep 27, 2016
- Honda Motor Co., Ltd.
- Asako Yoneguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead for connection to a semiconductor device
- Patent number 9,418,918
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor strip with contact areas having cutouts
- Patent number 9,406,592
- Issue date Aug 2, 2016
- Continental Automotive GmbH
- Nico Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTING MEMBER AND SEMICONDUCTOR DEVICE
- Publication number 20250183218
- Publication date Jun 5, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118699
- Publication date Apr 10, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP
- Publication number 20250105198
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Heiming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20250022833
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid Immersion-Cooled Power Module
- Publication number 20240222225
- Publication date Jul 4, 2024
- Hyundai Motor Company
- Suk Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...
- Publication number 20240145353
- Publication date May 2, 2024
- Fuji Electric Co., Ltd.
- Tsubasa NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096843
- Publication date Mar 21, 2024
- Kabushiki Kaisha Toshiba
- Kyo TANABIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...
- Publication number 20240021436
- Publication date Jan 18, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- B60 - VEHICLES IN GENERAL
Information Patent Application
POWER SUBSTRATE ASSEMBLY WITH REDUCED WARPAGE
- Publication number 20240021568
- Publication date Jan 18, 2024
- LITTELFUSE, INC.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014193
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411337
- Publication date Dec 21, 2023
- Kabushiki Kaisha Toshiba
- Kyo TANABIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230395555
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230369279
- Publication date Nov 16, 2023
- STMicroelectronics S.r.l
- Thomas GOTTARDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230092121
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kakeru YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Clip Bond Having Multipl...
- Publication number 20220208716
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Hyung Mook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210272890
- Publication date Sep 2, 2021
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Clip with Angled Contact Surface and Raised Bridge Tec...
- Publication number 20210074667
- Publication date Mar 11, 2021
- Chai Chee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASCODE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20200365565
- Publication date Nov 19, 2020
- NEXPERIA B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPONENT
- Publication number 20200066672
- Publication date Feb 27, 2020
- SHENZHEN JINYANG ELECTRIC CO., LTD.
- CHAOYANG SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180076149
- Publication date Mar 15, 2018
- Fuji Electric Co., Ltd.
- Tatsuhiko ASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CI...
- Publication number 20150357303
- Publication date Dec 10, 2015
- CONTINENTAL AUTOMOTIVE GMBH
- Nico Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER
- Publication number 20140284809
- Publication date Sep 25, 2014
- Honda Motor Co., Ltd.
- Asako YONEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
- Publication number 20140264452
- Publication date Sep 18, 2014
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20140117523
- Publication date May 1, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140103510
- Publication date Apr 17, 2014
- RENESAS ELECTRONICS CORPORATION
- Hideko ANDOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20140061821
- Publication date Mar 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenya KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER UNIT DEVICE
- Publication number 20130241047
- Publication date Sep 19, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Katsuhiko Omae
- H01 - BASIC ELECTRIC ELEMENTS

being non uniform along the connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power substrate assembly with reduced warpage

Fingerprint sensor package and smart card having the same

Leadframe package with adjustable clip

Current shunt with reduced temperature relative to voltage drop

Semiconductor device

Cascode semiconductor device and method of manufacture

Electronic module, method of manufacturing connector, and method of...

Semiconductor module

Method for die and clip attachment

Semiconductor package with space efficient lead and die pad design

Semiconductor device

Solid top terminal for discrete power devices

Integrated spring mounted chip termination

Method of manufacturing a package having a power semiconductor chip

Electronic device

Electronic device

Electronic module

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device having multiple contact clips

Packaging solutions for devices and systems comprising lateral GaN...

Semiconductor module

Semiconductor module

Semiconductor device and manufacturing method thereof

Semiconductor module package and method of manufacturing the same

Semiconductor device and structure therefor

Power converter

Stacked synchronous buck converter having chip embedded in outside...

Lead for connection to a semiconductor device

Conductor strip with contact areas having cutouts

Semiconductor module

Patents Applicationslast 30 patents

ELECTRICAL CONNECTING MEMBER AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

CLIP

POWER MODULE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

Liquid Immersion-Cooled Power Module

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...

POWER SUBSTRATE ASSEMBLY WITH REDUCED WARPAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

POWER MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

Semiconductor Device and Method of Forming Clip Bond Having Multipl...

SEMICONDUCTOR MODULE

Interconnect Clip with Angled Contact Surface and Raised Bridge Tec...

CASCODE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

CHIP COMPONENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CI...

POWER CONVERTER

METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR

STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE AND POWER UNIT DEVICE