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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20240363612
    • Publication date Oct 31, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • Dae Geun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Honeycomb Pattern for Conductive Features
    • Publication number 20240186276
    • Publication date Jun 6, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shenggao Li
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
    • Publication number 20240178119
    • Publication date May 30, 2024
    • Intel Corporation
    • Mohammad Mamunur RAHMAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Honeycomb Pattern for Conductive Features
    • Publication number 20230253357
    • Publication date Aug 10, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shenggao Li
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20230026637
    • Publication date Jan 26, 2023
    • SAMSUNG DISPLAY CO., LTD.
    • Dae Geun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Honeycomb Pattern for Conductive Features
    • Publication number 20220367400
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Shenggao Li
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE AND CIRCUIT BOARD THEREOF
    • Publication number 20210257287
    • Publication date Aug 19, 2021
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20210193641
    • Publication date Jun 24, 2021
    • SAMSUNG DISPLAY CO., LTD.
    • Dae Geun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20210082856
    • Publication date Mar 18, 2021
    • Kioxia Corporation
    • Soichi HOMMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20190326274
    • Publication date Oct 24, 2019
    • SAMSUNG DISPLAY CO., LTD.
    • Dae Geun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP-ON-FILM PACKAGE STRUCTURE
    • Publication number 20190080996
    • Publication date Mar 14, 2019
    • CHIPMOS TECHNOLOGIES INC.
    • Pi-Chang Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
    • Publication number 20190074197
    • Publication date Mar 7, 2019
    • NANYA TECHNOLOGY CORPORATION
    • Po-Chun LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20170033085
    • Publication date Feb 2, 2017
    • Fujitsu Limited
    • Takahiro Shikibu
    • H01 - BASIC ELECTRIC ELEMENTS