being non uniform

Industry

CPC
H01L2224/06132

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06132being non uniform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device including a pad where a driving chip is mounted
- Patent number 12,055,827
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit structure
- Patent number 12,035,471
- Issue date Jul 9, 2024
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Andu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,021,049
- Issue date Jun 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit for a hybrid molecular bonding
- Patent number 11,990,436
- Issue date May 21, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including conductive adhesive layer
- Patent number 11,805,685
- Issue date Oct 31, 2023
- Samsung Display Co., Ltd.
- Youngmin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method for same
- Patent number 11,776,943
- Issue date Oct 3, 2023
- Samsung Display Co., Ltd.
- Hyun A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods for the same
- Patent number 11,735,559
- Issue date Aug 22, 2023
- SK hynix Inc.
- Chan Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving chip and display panel
- Patent number 11,676,921
- Issue date Jun 13, 2023
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Yantao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a pad where a driving chip is mounted
- Patent number 11,650,465
- Issue date May 16, 2023
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and manufacturing methods for the same
- Patent number 11,437,342
- Issue date Sep 6, 2022
- SK hynix Inc.
- Chan Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 11,270,964
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power island segmentation for selective bond-out
- Patent number 11,211,329
- Issue date Dec 28, 2021
- Kioxia Corporation
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving chip including bonding pads in non-display area and display...
- Patent number 11,189,584
- Issue date Nov 30, 2021
- Wuhan China Star Optoeleetronies Technology Co., Ltd.
- Yantao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed under bump metallurgy (UBM) interconnect bridge structure
- Patent number 11,139,269
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,018,104
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,910,333
- Issue date Feb 2, 2021
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip and semiconductor device provided with same
- Patent number 10,825,760
- Issue date Nov 3, 2020
- SOCIONEXT INC.
- Toshihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 10,818,624
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,818,623
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,784,219
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power island segmentation for selective bond-out
- Patent number 10,629,533
- Issue date Apr 21, 2020
- TOSHIBA MEMORY CORPORATION
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection pads for low cross-talk vertical wirebonds
- Patent number 10,580,756
- Issue date Mar 3, 2020
- Intel Corporation
- Hungying L. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-conductive array disposed on target circuit substrate and condu...
- Patent number 10,431,561
- Issue date Oct 1, 2019
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device for facilitating alignment of a pad of a display pan...
- Patent number 10,410,987
- Issue date Sep 10, 2019
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structure for a microelectronic device
- Patent number 10,366,968
- Issue date Jul 30, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,249,586
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structures of integrated circuits
- Patent number 9,991,218
- Issue date Jun 5, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method for binding the same
- Patent number 9,960,132
- Issue date May 1, 2018
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240379600
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED
- Publication number 20240361650
- Publication date Oct 31, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE ASSEMBLY WITH ENHANCED SOLDER PITCH
- Publication number 20240321793
- Publication date Sep 26, 2024
- Xilinx, Inc.
- Yun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240312934
- Publication date Sep 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240234373
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240178357
- Publication date May 30, 2024
- AUO Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128218
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, DISPLAY PANEL, FLEXIBLE CIRCUIT BOARD AND DISPLA...
- Publication number 20240128278
- Publication date Apr 18, 2024
- HEFEI VISIONOX TECHNOLOGY CO., LTD.
- Fengjie XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240071964
- Publication date Feb 29, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE
- Publication number 20240006421
- Publication date Jan 4, 2024
- HKC Corporation Limited
- ZHONGXIE XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361012
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL HYBRID BONDING SURFACE LAYER USING AN ADAPTABLE INTERCONN...
- Publication number 20220415839
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME
- Publication number 20220359453
- Publication date Nov 10, 2022
- SK HYNIX INC.
- Chan Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20220278063
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR BONDING
- Publication number 20220157752
- Publication date May 19, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20220132662
- Publication date Apr 28, 2022
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Andu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220037446
- Publication date Feb 3, 2022
- SAMSUNG DISPLAY CO., LTD.
- YOUNGMIN CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME
- Publication number 20220013517
- Publication date Jan 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- HYUN A LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210280544
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure
- Publication number 20210233892
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME
- Publication number 20210210458
- Publication date Jul 8, 2021
- SK HYNIX INC.
- Chan Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210035935
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20210005561
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT
- Publication number 20200227353
- Publication date Jul 16, 2020
- Toshiba Memory Corporation
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielding Structures
- Publication number 20200168574
- Publication date May 28, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20190333886
- Publication date Oct 31, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT
- Publication number 20190287906
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20190164919
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS

being non uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including a pad where a driving chip is mounted

Circuit structure

Display panel and display device

Electronic circuit for a hybrid molecular bonding

Semiconductor device and method of manufacturing

Electronic device including conductive adhesive layer

Display panel and manufacturing method for same

Semiconductor packages and manufacturing methods for the same

Driving chip and display panel

Display device including a pad where a driving chip is mounted

Semiconductor packages and manufacturing methods for the same

Semiconductor device and method of manufacturing

Mixed UBM and mixed pitch on a single die

Power island segmentation for selective bond-out

Driving chip including bonding pads in non-display area and display...

Mixed under bump metallurgy (UBM) interconnect bridge structure

Semiconductor structure and method for manufacturing the same

Display device

Semiconductor chip and semiconductor device provided with same

Semiconductor structure and method for manufacturing the same

Mixed UBM and mixed pitch on a single die

Semiconductor device and method of manufacturing

Power island segmentation for selective bond-out

Connection pads for low cross-talk vertical wirebonds

Pre-conductive array disposed on target circuit substrate and condu...

Display device for facilitating alignment of a pad of a display pan...

Interconnect structure for a microelectronic device

Mixed UBM and mixed pitch on a single die

Connector structures of integrated circuits

Display apparatus and method for binding the same

Patents Applicationslast 30 patents

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED

CHIP PACKAGE ASSEMBLY WITH ENHANCED SOLDER PITCH

DISPLAY PANEL AND DISPLAY DEVICE

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURE, DISPLAY PANEL, FLEXIBLE CIRCUIT BOARD AND DISPLA...

DISPLAY PANEL AND DISPLAY DEVICE

METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

WINDOW BALL GRID ARRAY (WBGA) PACKAGE

UNIVERSAL HYBRID BONDING SURFACE LAYER USING AN ADAPTABLE INTERCONN...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME

Semiconductor Device and Method of Manufacturing

ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR BONDING

CIRCUIT STRUCTURE

ELECTRONIC DEVICE

DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS FOR THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Method of Manufacturing

POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT

Shielding Structures

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT

Semiconductor Device and Method of Manufacturing