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H01L2224/06152

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06152being non uniform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,080,664
- Issue date Sep 3, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SSD wafer device and method of manufacturing same
- Patent number 12,009,354
- Issue date Jun 11, 2024
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a display panel with multiple pads
- Patent number 11,894,294
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Hanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 11,817,537
- Issue date Nov 14, 2023
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 11,398,591
- Issue date Jul 26, 2022
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,081,503
- Issue date Aug 3, 2021
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 10,879,441
- Issue date Dec 29, 2020
- Cree, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 10,840,205
- Issue date Nov 17, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 10,840,423
- Issue date Nov 17, 2020
- Cree, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 10,804,452
- Issue date Oct 13, 2020
- Cree, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, production method thereof, and electronic compo...
- Patent number 10,453,780
- Issue date Oct 22, 2019
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 10,373,987
- Issue date Aug 6, 2019
- Samsung Display Co., Ltd.
- Dae Geun Lee
- G02 - OPTICS
Information Patent Grant
Solid-state imaging device and imaging system
- Patent number 10,312,282
- Issue date Jun 4, 2019
- Olympus Corporation
- Toru Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor device and manufacturing process...
- Patent number 10,014,268
- Issue date Jul 3, 2018
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip scale package and manufacturing method thereof
- Patent number 9,941,240
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 9,917,113
- Issue date Mar 13, 2018
- Samsung Display Co., Ltd.
- Dae Geun Lee
- G02 - OPTICS
Information Patent Grant
Semiconductor devices with redistribution pads
- Patent number 9,859,204
- Issue date Jan 2, 2018
- Samsung Electronics Co., Ltd.
- Myeong Soon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing same
- Patent number 9,478,722
- Issue date Oct 25, 2016
- Kabushiki Kaisha Toshiba
- Yoshiaki Sugizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit, production method thereof, and electronic compo...
- Patent number 9,252,087
- Issue date Feb 2, 2016
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing same
- Patent number 9,184,357
- Issue date Nov 10, 2015
- Kabushiki Kaisha Toshiba
- Yoshiaki Sugizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having main dummy pattern located in path of stress
- Patent number 8,796,847
- Issue date Aug 5, 2014
- Samsung Electronics Co., Ltd.
- Jong-Joo Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light emitting device and method for manufacturing same
- Patent number 8,110,421
- Issue date Feb 7, 2012
- Kabushiki Kaisha Toshiba
- Yoshiaki Sugizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 7,619,303
- Issue date Nov 17, 2009
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with shaped bonding pads
- Patent number 5,925,935
- Issue date Jul 20, 1999
- Samsung Electronics Co., Ltd.
- Sang Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332276
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240304578
- Publication date Sep 12, 2024
- AUO Corporation
- Woei-Chyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240250093
- Publication date Jul 25, 2024
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240251610
- Publication date Jul 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVER IC AND DISPLAY DEVICE
- Publication number 20240243083
- Publication date Jul 18, 2024
- Huatao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE
- Publication number 20240234338
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Tetsunari SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20240234443
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...
- Publication number 20240213430
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240155892
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Junhyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153898
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Minseung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240030167
- Publication date Jan 25, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230361170
- Publication date Nov 9, 2023
- MURATA MANUFACTURING CO., LTD.
- Fuminori MORISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230307393
- Publication date Sep 28, 2023
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230299091
- Publication date Sep 21, 2023
- InnoLux Corporation
- Jia-Yan LAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20230187430
- Publication date Jun 15, 2023
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-Side Folded Source Driver Outputs of a Display Panel Having a...
- Publication number 20230045931
- Publication date Feb 16, 2023
- PARADE TECHNOLOGIES, LTD.
- You Ben Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT MODULE AND LIDAR APPARATUS HAVING AT LEAST ONE LIGHT MODULE O...
- Publication number 20230023489
- Publication date Jan 26, 2023
- Elmos Semiconductor SE
- Andre SROWIG
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECTS FOR LIGHT EMITTING DIODE CHIPS
- Publication number 20220246816
- Publication date Aug 4, 2022
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210289626
- Publication date Sep 16, 2021
- SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.
- Tsuchiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20210066233
- Publication date Mar 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FOR LIGHT EMITTING DIODE CHIPS
- Publication number 20200395524
- Publication date Dec 17, 2020
- Cree, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTING SEMICONDUCTOR COMPONENTS
- Publication number 20180211935
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20180182781
- Publication date Jun 28, 2018
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun Lee
- G02 - OPTICS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND IMAGING SYSTEM
- Publication number 20180040660
- Publication date Feb 8, 2018
- OLYMPUS CORPORATION
- Toru Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS...
- Publication number 20170256508
- Publication date Sep 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Chun-Jun ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPO...
- Publication number 20140138706
- Publication date May 22, 2014
- Mitsubishi Electric Corporation
- Rei YONEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Reduced On-Resistance and Top Metal Spre...
- Publication number 20120175688
- Publication date Jul 12, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Rupert Burbidge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20120097972
- Publication date Apr 26, 2012
- KABUSHIKI KAISHA TOSHIBA
- Yoshiaki SUGIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FLIP CHIP PACKAGE INCLUDING THE SAME
- Publication number 20120049351
- Publication date Mar 1, 2012
- JONG-JOO LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

being non uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and semiconductor module

SSD wafer device and method of manufacturing same

Array substrate and method of mounting integrated circuit using the...

Display apparatus including a display panel with multiple pads

Interconnects for light emitting diode chips

Chemical mechanical polishing for hybrid bonding

Interconnects for light emitting diode chips

Surface mounting semiconductor components

Array substrate and method of mounting integrated circuit using the...

Interconnects for light emitting diode chips

Chemical mechanical polishing for hybrid bonding

Interconnects for light emitting diode chips

Interconnects for light emitting diode chips

Electronic circuit, production method thereof, and electronic compo...

Array substrate and method of mounting integrated circuit using the...

Solid-state imaging device and imaging system

Semiconductor chip, semiconductor device and manufacturing process...

Semiconductor chip scale package and manufacturing method thereof

Array substrate and method of mounting integrated circuit using the...

Semiconductor devices with redistribution pads

Light emitting device and method for manufacturing same

Electronic circuit, production method thereof, and electronic compo...

Light emitting device and method for manufacturing same

Package substrate having main dummy pattern located in path of stress

Light emitting device and method for manufacturing same

Integrated circuit package

Semiconductor chip with shaped bonding pads

Patents Applicationslast 30 patents

SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME

ELECTRONIC DEVICE

DISPLAY PANEL AND DISPLAY DEVICE

DISPLAY PANEL AND DISPLAY DEVICE

DRIVER IC AND DISPLAY DEVICE

HIGH-FREQUENCY SEMICONDUCTOR PACKAGE

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

ELECTRONIC DEVICE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME

Dual-Side Folded Source Driver Outputs of a Display Panel Having a...

LIGHT MODULE AND LIDAR APPARATUS HAVING AT LEAST ONE LIGHT MODULE O...

INTERCONNECTS FOR LIGHT EMITTING DIODE CHIPS

DISPLAY DEVICE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

INTERCONNECTS FOR LIGHT EMITTING DIODE CHIPS

SURFACE MOUNTING SEMICONDUCTOR COMPONENTS

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

SOLID-STATE IMAGING DEVICE AND IMAGING SYSTEM

SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS...

ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPO...

Semiconductor Package with Reduced On-Resistance and Top Metal Spre...

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

PACKAGE SUBSTRATE AND FLIP CHIP PACKAGE INCLUDING THE SAME