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H01L2224/83055
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83055
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,626,352
Issue date
Apr 11, 2023
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembly
Patent number
11,508,694
Issue date
Nov 22, 2022
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded die assembly containing a manganese-containing oxide bonding...
Patent number
11,362,079
Issue date
Jun 14, 2022
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding electronic component and method for manufacturin...
Patent number
10,875,127
Issue date
Dec 29, 2020
Nichia Corporation
Teppei Kunimune
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing a silver sintering agent having silver oxide s...
Patent number
10,785,877
Issue date
Sep 22, 2020
Heraeus Deutschland GmbH & Co. KG
Michael Schäfer
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Chip assembly
Patent number
10,636,766
Issue date
Apr 28, 2020
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive paste and die bonding method
Patent number
10,615,144
Issue date
Apr 7, 2020
Kaken Tech Co., Ltd.
Shigeo Hori
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Metal joining structure using metal nanoparticles and metal joining...
Patent number
9,960,140
Issue date
May 1, 2018
Nippon Steel & Sumitomo Metal Corporation
Kohei Tatsumi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming a chip assembly with a die attach liquid
Patent number
9,837,381
Issue date
Dec 5, 2017
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive paste and die bonding method
Patent number
9,818,718
Issue date
Nov 14, 2017
Kaken Tech Co., Ltd.
Shigeo Hori
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for preventing die pad delamination
Patent number
9,601,414
Issue date
Mar 21, 2017
Texas Instruments Incorporated
Rongwei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Joint material, and jointed body
Patent number
9,543,265
Issue date
Jan 10, 2017
Hitachi, Ltd.
Motomune Kodama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive adhesive with reduced migration
Patent number
9,365,749
Issue date
Jun 14, 2016
Sunray Scientific, LLC
S. Kumar Khanna
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Compound structure and method for forming a compound structure
Patent number
9,219,049
Issue date
Dec 22, 2015
Infineon Technologies AG
Rudolf Berger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a bond and a semiconductor module
Patent number
9,202,800
Issue date
Dec 1, 2015
Infineon Technologies AG
Tao Hong
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Semiconductor device and production method therefor
Patent number
9,018,664
Issue date
Apr 28, 2015
Nichia Corporation
Masafumi Kuramoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and production method therefor
Patent number
8,642,392
Issue date
Feb 4, 2014
Nichia Corporation
Masafumi Kuramoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintering silver paste material and method for bonding semiconducto...
Patent number
8,303,854
Issue date
Nov 6, 2012
Hitachi, Ltd.
Ryoichi Kajiwara
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230207432
Publication date
Jun 29, 2023
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
Publication number
20200243477
Publication date
Jul 30, 2020
FURUKAWA ELECTRIC CO., LTD.
Teruyuki NAKAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
Publication number
20200219848
Publication date
Jul 9, 2020
INFINEON TECHNOLOGIES AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE PASTE AND DIE BONDING METHOD
Publication number
20190139930
Publication date
May 9, 2019
KAKEN TECH CO., LTD.
Shigeo Hori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Compound Structure and Method for Forming a Compound Structure
Publication number
20150171045
Publication date
Jun 18, 2015
INFINEON TECHNOLOGIES AG
Rudolf Berger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
Publication number
20140353540
Publication date
Dec 4, 2014
SUNRAY SCIENTIFIC, LLC
S. Kumar Khanna
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Joint Material, and Jointed Body
Publication number
20140287227
Publication date
Sep 25, 2014
Hitachi, Ltd
Motomune KODAMA
C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20140264383
Publication date
Sep 18, 2014
RENESAS ELECTRONICS CORPORATION
Ryoichi KAJIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20140110740
Publication date
Apr 24, 2014
Nichia Corporation.
Masafumi KURAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE
Publication number
20140013595
Publication date
Jan 16, 2014
Tao Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
Publication number
20130292168
Publication date
Nov 7, 2013
ROBERT BOSCH GmbH
Daniel Wolde-Giorgis
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...
Publication number
20110290863
Publication date
Dec 1, 2011
Ryoichi KAJIWARA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20100187563
Publication date
Jul 29, 2010
Masafumi Kuramoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP
Publication number
20100148282
Publication date
Jun 17, 2010
Dieter Donis
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Integrated Alignment and Bonding System
Publication number
20100122456
Publication date
May 20, 2010
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS