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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83055being oxidating

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded die assembly containing a manganese-containing oxide bonding...
- Patent number 11,362,079
- Issue date Jun 14, 2022
- SanDisk Technologies LLC
- Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding electronic component and method for manufacturin...
- Patent number 10,875,127
- Issue date Dec 29, 2020
- Nichia Corporation
- Teppei Kunimune
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal joining structure using metal nanoparticles and metal joining...
- Patent number 9,960,140
- Issue date May 1, 2018
- Nippon Steel & Sumitomo Metal Corporation
- Kohei Tatsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and die bonding method
- Patent number 9,818,718
- Issue date Nov 14, 2017
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preventing die pad delamination
- Patent number 9,601,414
- Issue date Mar 21, 2017
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive adhesive with reduced migration
- Patent number 9,365,749
- Issue date Jun 14, 2016
- Sunray Scientific, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Compound structure and method for forming a compound structure
- Patent number 9,219,049
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a bond and a semiconductor module
- Patent number 9,202,800
- Issue date Dec 1, 2015
- Infineon Technologies AG
- Tao Hong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,018,664
- Issue date Apr 28, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,642,392
- Issue date Feb 4, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering silver paste material and method for bonding semiconducto...
- Patent number 8,303,854
- Issue date Nov 6, 2012
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE AND DIE BONDING METHOD
- Publication number 20190139930
- Publication date May 9, 2019
- KAKEN TECH CO., LTD.
- Shigeo Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compound Structure and Method for Forming a Compound Structure
- Publication number 20150171045
- Publication date Jun 18, 2015
- INFINEON TECHNOLOGIES AG
- Rudolf Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE
- Publication number 20140013595
- Publication date Jan 16, 2014
- Tao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...
- Publication number 20110290863
- Publication date Dec 1, 2011
- Ryoichi KAJIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100187563
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP
- Publication number 20100148282
- Publication date Jun 17, 2010
- Dieter Donis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Alignment and Bonding System
- Publication number 20100122456
- Publication date May 20, 2010
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

being oxidating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Chip assembly

Bonded die assembly containing a manganese-containing oxide bonding...

Method for bonding electronic component and method for manufacturin...

Method for producing a silver sintering agent having silver oxide s...

Chip assembly

Conductive paste and die bonding method

Metal joining structure using metal nanoparticles and metal joining...

Method of forming a chip assembly with a die attach liquid

Conductive paste and die bonding method

Method for preventing die pad delamination

Joint material, and jointed body

Anisotropic conductive adhesive with reduced migration

Compound structure and method for forming a compound structure

Methods for producing a bond and a semiconductor module

Semiconductor device and production method therefor

Semiconductor device and production method therefor

Sintering silver paste material and method for bonding semiconducto...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DIE BONDING APPARATUS AND DIE BONDING METHOD

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

CONDUCTIVE PASTE AND DIE BONDING METHOD

Compound Structure and Method for Forming a Compound Structure

Anisotropic Conductive Adhesive with Reduced Migration

Joint Material, and Jointed Body

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP

Integrated Alignment and Bonding System