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H01L2224/29013

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member connection method
- Patent number 11,887,960
- Issue date Jan 30, 2024
- Resonac Corporation
- Motohiro Negishi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,456,270
- Issue date Sep 27, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mingxing Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cooling body with a groove
- Patent number 11,088,045
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bonding pad
- Patent number 10,504,867
- Issue date Dec 10, 2019
- ABLIC Inc.
- Koichi Shimazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package structure
- Patent number 10,431,564
- Issue date Oct 1, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-applying supporting materials between bonded package components
- Patent number 10,366,971
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 10,131,126
- Issue date Nov 20, 2018
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flip chip interconnection with reduced current density
- Patent number 10,090,274
- Issue date Oct 2, 2018
- Efficient Power Conversion Corporation
- Robert Strittmatter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly of an integrated circuit chip and of a plate
- Patent number 9,941,188
- Issue date Apr 10, 2018
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for eutectic bonding
- Patent number 9,935,077
- Issue date Apr 3, 2018
- Robert Bosch GmbH
- Ralf Hausner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding bare chip dies
- Patent number 9,859,247
- Issue date Jan 2, 2018
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter Smits
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS integrated pressure sensor devices having isotropic cavitites...
- Patent number 9,850,125
- Issue date Dec 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit chip assembled on an interposer
- Patent number 9,780,015
- Issue date Oct 3, 2017
- STMicroelectronics S.A.
- Pierre Bar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing thermal interface sheet
- Patent number 9,704,775
- Issue date Jul 11, 2017
- Fujitsu Limited
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate
- Patent number 9,655,240
- Issue date May 16, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 9,653,424
- Issue date May 16, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing structure for a bonded wafer and method of forming the seal...
- Patent number 9,653,312
- Issue date May 16, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 9,627,231
- Issue date Apr 18, 2017
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die power semiconductor device
- Patent number 9,613,941
- Issue date Apr 4, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Yanbo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic delivery member with filter and method of forming same
- Patent number 9,561,657
- Issue date Feb 7, 2017
- STMicroelectronics S.r.l.
- Simon Dodd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method
- Patent number 9,508,679
- Issue date Nov 29, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsuhiko Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 9,502,370
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame, Packaging Structure and Packaging Method
- Publication number 20240234259
- Publication date Jul 11, 2024
- DIODES INCORPORATED
- MeiDan Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
- Publication number 20240063165
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Ramesh NALLAVELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20240021565
- Publication date Jan 18, 2024
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME
- Publication number 20230387373
- Publication date Nov 30, 2023
- Nichia Corporation.
- Hiroki TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS
- Publication number 20230378209
- Publication date Nov 23, 2023
- Semiconductor Components Industries, LLC
- Chee Peng NEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220271000
- Publication date Aug 25, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Mingxing ZUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220216177
- Publication date Jul 7, 2022
- JUNGYUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170200693
- Publication date Jul 13, 2017
- Hamamatsu Photonics K.K.
- Yoshimaro FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE
- Publication number 20170133297
- Publication date May 11, 2017
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THERMAL INTERFACE SHEET
- Publication number 20170047269
- Publication date Feb 16, 2017
- Fujitsu Limited
- Naoaki Nakamura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170005024
- Publication date Jan 5, 2017
- SII Semiconductor Corporation
- Koichi SHIMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structure and Process
- Publication number 20160163670
- Publication date Jun 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20150214192
- Publication date Jul 30, 2015
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20150091192
- Publication date Apr 2, 2015
- Samsung SDI Co., Ltd.
- Young Ju SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Integrated Pressure Sensor Devices having Isotropic Cavities a...
- Publication number 20140319631
- Publication date Oct 30, 2014
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140264771
- Publication date Sep 18, 2014
- Xintec Inc.
- Hung-Jen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Applying Supporting Materials between Bonded Package Components
- Publication number 20140203456
- Publication date Jul 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structure and Process
- Publication number 20140117510
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20140099485
- Publication date Apr 10, 2014
- Kadthala Ramaya NARENDRNATH
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...
- Publication number 20140008779
- Publication date Jan 9, 2014
- Omron Corporation
- Toshiaki Okuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130214402
- Publication date Aug 22, 2013
- Amkor Technology, Inc.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Electrical Component Surface Interconnect
- Publication number 20130215583
- Publication date Aug 22, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS

being rectangular or square

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including connection pad part and electronic compone...

Member connection method

Electroconductive film, roll, connected structure, and process for...

Semiconductor device and method for manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor device having a cooling body with a groove

Semiconductor device having a bonding pad

Structure and formation method of chip package structure

Pre-applying supporting materials between bonded package components

Semiconductor devices and methods of forming thereof

Methods for bonding substrates

Flip chip interconnection with reduced current density

Assembly of an integrated circuit chip and of a plate

Apparatus for eutectic bonding

Method for bonding bare chip dies

MEMS integrated pressure sensor devices having isotropic cavitites...

Integrated circuit chip assembled on an interposer

Method for manufacturing thermal interface sheet

Methods of manufacturing a semiconductor device

Substrate

Semiconductor package with adhesive material pre-printed on the lea...

Sealing structure for a bonded wafer and method of forming the seal...

Methods for bonding substrates

Exposed die power semiconductor device

Wafer to wafer bonding process and structures

Solder fatigue arrest for wafer level package

Microfluidic delivery member with filter and method of forming same

Mounting method

Semiconductor bonding structure and process

Semiconductor devices and methods of forming thereof

Patents Applicationslast 30 patents

OPTICAL SENSOR PACKAGE

Lead Frame, Packaging Structure and Packaging Method

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

SEMICONDUCTOR PACKAGE

CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME

IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

ELECTRONIC COMPONENT

ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE

METHOD FOR MANUFACTURING THERMAL INTERFACE SHEET

SEMICONDUCTOR DEVICE

Semiconductor Bonding Structure and Process

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

MEMS Integrated Pressure Sensor Devices having Isotropic Cavities a...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Pre-Applying Supporting Materials between Bonded Package Components

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE

Semiconductor Bonding Structure and Process

METHODS FOR BONDING SUBSTRATES

WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Embedded Electrical Component Surface Interconnect