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H01L2224/83065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83065being reducing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having high yield strength intermediate plate
- Patent number 12,009,332
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding electronic component and method for manufacturin...
- Patent number 10,875,127
- Issue date Dec 29, 2020
- Nichia Corporation
- Teppei Kunimune
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining a surface-mount component to a substrate with sol...
- Patent number 10,879,211
- Issue date Dec 29, 2020
- RSM Electron Power, Inc.
- Robert Conte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing soldered product
- Patent number 10,843,300
- Issue date Nov 24, 2020
- ORIGIN COMPANY, LIMITED
- Yukiko Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint manufacturing method
- Patent number 10,821,543
- Issue date Nov 3, 2020
- Nitto Denko Corporation
- Nao Kamakura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,615,145
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,497,585
- Issue date Dec 3, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-bonding structure and method of forming the same
- Patent number 10,388,627
- Issue date Aug 20, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel particle composition, bonding material, and bonding method i...
- Patent number 10,207,373
- Issue date Feb 19, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Takayuki Shimizu
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing member for semiconductor device and semiconduc...
- Patent number 10,153,246
- Issue date Dec 11, 2018
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal joining structure using metal nanoparticles and metal joining...
- Patent number 9,960,140
- Issue date May 1, 2018
- Nippon Steel & Sumitomo Metal Corporation
- Kohei Tatsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module bonding wire connection method
- Patent number 9,925,588
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS-MEMS integration by sequential bonding method
- Patent number 9,761,557
- Issue date Sep 12, 2017
- Invensense, Inc.
- Jong Il Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding substrates
- Patent number 9,673,167
- Issue date Jun 6, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mounting method
- Patent number 9,508,679
- Issue date Nov 29, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsuhiko Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for bonding substrates
- Patent number 9,443,820
- Issue date Sep 13, 2016
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer stack protection seal
- Patent number 9,406,577
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,385,103
- Issue date Jul 5, 2016
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser mounting for improved frequency stability
- Patent number 9,368,934
- Issue date Jun 14, 2016
- SpectraSensors, Inc.
- Gabi Neubauer
- G01 - MEASURING TESTING
Information Patent Grant
Method for coating and bonding substrates
- Patent number 9,358,765
- Issue date Jun 7, 2016
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220293553
- Publication date Sep 15, 2022
- Mitsubishi Electric Corporation
- Mana NISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200243480
- Publication date Jul 30, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190157235
- Publication date May 23, 2019
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
- Publication number 20190081020
- Publication date Mar 14, 2019
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20190035764
- Publication date Jan 31, 2019
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...
- Publication number 20170243851
- Publication date Aug 24, 2017
- ATV TECHNOLOGIE GMBH
- Ventzeslav RANGELOV
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD I...
- Publication number 20170136585
- Publication date May 18, 2017
- NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD.
- Takayuki SHIMIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD
- Publication number 20150333034
- Publication date Nov 19, 2015
- INFINEON TECHNOLOGIES AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CMOS-MEMS INTEGRATION BY SEQUENTIAL BONDING METHOD
- Publication number 20150311178
- Publication date Oct 29, 2015
- InvenSense, Inc.
- Jong Il SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT
- Publication number 20140312102
- Publication date Oct 23, 2014
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged Device Comprising Non-Integer Lead Pitches and Method of M...
- Publication number 20140264798
- Publication date Sep 18, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140224862
- Publication date Aug 14, 2014
- Fuji Electric Co., Ltd.
- Takeshi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20140111956
- Publication date Apr 24, 2014
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...
- Publication number 20140097534
- Publication date Apr 10, 2014
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...
- Publication number 20140091131
- Publication date Apr 3, 2014
- Fuji Electric Co., Ltd.
- Hideaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE
- Publication number 20140048942
- Publication date Feb 20, 2014
- Taichi Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Bonding Material for Semiconductor Devices
- Publication number 20130134591
- Publication date May 30, 2013
- Yoshitsugu Sakamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor Laser Mounting for Improved Frequency Stability
- Publication number 20120236893
- Publication date Sep 20, 2012
- Gabi Neubauer
- G01 - MEASURING TESTING
Information Patent Application
ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...
- Publication number 20120202322
- Publication date Aug 9, 2012
- Fuji Electric Co., Ltd.
- Hideaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING OF CHIPS ON WAFERS
- Publication number 20120184069
- Publication date Jul 19, 2012
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A HIGH-TEMPERATURE AND TEMPERATURE-CHANGE RESI...
- Publication number 20120037688
- Publication date Feb 16, 2012
- Danfoss Silicon Power GmbH
- Mathias Kock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...
- Publication number 20110290863
- Publication date Dec 1, 2011
- Ryoichi KAJIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux-free chip to wafer joint serial thermal processor arrangement
- Publication number 20110198388
- Publication date Aug 18, 2011
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...
- Publication number 20100270515
- Publication date Oct 28, 2010
- Yuusuke YASUDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

being reducing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having high yield strength intermediate plate

Chip assembly

Soldering a conductor to an aluminum metallization

Member for semiconductor device

Bonded structure and method of manufacturing the same

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Method for bonding electronic component and method for manufacturin...

Method of joining a surface-mount component to a substrate with sol...

Method for producing soldered product

Joint manufacturing method

Method for producing a silver sintering agent having silver oxide s...

Chip assembly

Soldering a conductor to an aluminum metallization

Bonded body, substrate for power module with heat sink, heat sink,...

Micro-bonding structure and method of forming the same

Nickel particle composition, bonding material, and bonding method i...

Method for producing member for semiconductor device and semiconduc...

Metal joining structure using metal nanoparticles and metal joining...

Semiconductor module bonding wire connection method

Method of forming a chip assembly with a die attach liquid

Wafer stack protection seal

CMOS-MEMS integration by sequential bonding method

Method for bonding substrates

Mounting method

Device and method for bonding substrates

Wafer stack protection seal

Semiconductor device manufacturing method

Semiconductor laser mounting for improved frequency stability

Method for coating and bonding substrates

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

DIE BONDING APPARATUS AND DIE BONDING METHOD

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

DIE BONDING APPARATUS AND DIE BONDING METHOD

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...

NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD I...

SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD

CMOS-MEMS INTEGRATION BY SEQUENTIAL BONDING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT

WAFER STACK PROTECTION SEAL

Packaged Device Comprising Non-Integer Lead Pitches and Method of M...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...

DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...

ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...

MOUNTED STRUCTURE

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

Bonding Material for Semiconductor Devices

Semiconductor Laser Mounting for Improved Frequency Stability

ASSEMBLY JIG FOR A SEMICONDUCTOR DEVICE AND ASSEMBLY METHOD FOR A S...

METHOD FOR BONDING OF CHIPS ON WAFERS

METHOD FOR PRODUCING A HIGH-TEMPERATURE AND TEMPERATURE-CHANGE RESI...

SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...

Flux-free chip to wafer joint serial thermal processor arrangement

ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...