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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0508being stacked

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,218,123
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 12,205,853
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modeling method and apparatus, computer device and storage medium
- Patent number 12,204,841
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kun Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and preparation method thereof, and display appar...
- Patent number 12,199,081
- Issue date Jan 14, 2025
- BOE Technology Group Co., Ltd.
- Wenqu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of semiconductor structure having elastic memb...
- Patent number 12,198,977
- Issue date Jan 14, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,191,266
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Emiko Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,159,882
- Issue date Dec 3, 2024
- KYOCERA Coporation
- Hiroaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,142,587
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jinho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,119,314
- Issue date Oct 15, 2024
- Mitsubishi Electric Corporation
- Nobuyoshi Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split RDL connection between die and UBM
- Patent number 12,107,058
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,087,748
- Issue date Sep 10, 2024
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device structure with a redistribution layer and a buffer layer
- Patent number 12,080,753
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 12,057,479
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20250062295
- Publication date Feb 20, 2025
- Seoul Viosys Co., Ltd.
- Seong Kyu JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250046659
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Se Ra Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Capacitor Within Metallization Structure
- Publication number 20250038102
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022822
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022823
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP METALLIZATION STRUCTURES AND ASSOCIATED METHODS OF FORMA...
- Publication number 20250022820
- Publication date Jan 16, 2025
- STMicroelectronics International N.V.
- Mohamed BOUFNICHEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS
- Publication number 20250015024
- Publication date Jan 9, 2025
- RF360 Singapore Pte. Ltd.
- Poh Hoong YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006718
- Publication date Jan 2, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hwan CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006644
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395744
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20240387423
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Vasantha Kumar Vaddagere Nagaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20240387424
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371920
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
- Publication number 20240355886
- Publication date Oct 24, 2024
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240324344
- Publication date Sep 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYUNEOK SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
- Publication number 20240321927
- Publication date Sep 26, 2024
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321789
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuyuki HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321790
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS

being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming micro interconnect struc...

Semiconductor device with composite conductive features and method...

Chip parts

Integrated circuit test method and structure thereof

Semiconductor package with intermetallic-compound solder-joint comp...

Modeling method and apparatus, computer device and storage medium

Semiconductor device, semiconductor package and method of manufactu...

Display substrate and preparation method thereof, and display appar...

Manufacturing method of semiconductor structure having elastic memb...

Semiconductor device and manufacturing method of semiconductor device

Stacked semiconductor devices and methods of forming same

Semiconductor device

Process flow for fabrication of cap metal over top metal with sinte...

Light emitting diode and display apparatus having the same

Display device

Semiconductor device and method of fabricating the same

Integrated chip for standard logic performance improvement having a...

Method of fabricating a semiconductor device

Bonding structures of integrated circuit devices and method forming...

Through-substrate via structure and method of manufacture

Semiconductor device and method for manufacturing semiconductor device

Split RDL connection between die and UBM

Semiconductor device with encapsulant deposited along sides and sur...

High reliability lead-free solder alloys for harsh environment elec...

Display device and manufacturing method thereof

Device structure with a redistribution layer and a buffer layer

Semiconductor device and method to minimize stress on stack via

Methods and devices for fabricating and assembling printable semico...

Semiconductor device having a junction portion contacting a Schottk...

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Patents Applicationslast 30 patents

LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME

SEMICONDUCTOR PACKAGES

Metal-Insulator-Metal Capacitor Within Metallization Structure

Grain Structure Engineering for Metal Gapfill Materials

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

UNDER-BUMP METALLIZATION STRUCTURES AND ASSOCIATED METHODS OF FORMA...

INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES

FILM STRUCTURE FOR BOND PAD

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Lead-Free Solder Ball

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...

SILICON CARBIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

BONDING-TYPE INTERCONNECTION MEMBER

BONDING-TYPE INTERCONNECTION MEMBER

SEMICONDUCTOR DEVICE