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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/2908
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Patents Grants
last 30 patents
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Patent Grant
Adhesive member, display device, and manufacturing method of displa...
Patent number
11,923,330
Issue date
Mar 5, 2024
Samsung Display Co., Ltd.
Jung Hoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic electrically conductive film
Patent number
11,923,333
Issue date
Mar 5, 2024
Dexerials Corporation
Yasushi Akutsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer substrate
Patent number
11,901,325
Issue date
Feb 13, 2024
Dexerials Corporation
Seiichiro Shinohara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
Patent number
11,894,284
Issue date
Feb 6, 2024
LMDJ MANAGEMENT LLC
Yongjun Huo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, semiconductor arrangement and method for prod...
Patent number
11,887,961
Issue date
Jan 30, 2024
Infineon Technologies Austria AG
Paul Frank
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nanowires plated on nanoparticles
Patent number
11,869,864
Issue date
Jan 9, 2024
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective elements for bonded structures
Patent number
11,848,284
Issue date
Dec 19, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Javier A DeLaCruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor apparatus, power module, and manufacturing method of...
Patent number
11,848,298
Issue date
Dec 19, 2023
Mitsubishi Electric Corporation
Yosuke Nakata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
11,842,975
Issue date
Dec 12, 2023
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to stack structures including passivati...
Patent number
11,804,460
Issue date
Oct 31, 2023
Skyworks Solutions, Inc.
Jiro Yota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing anisotropic conductive film and anisotropic con...
Patent number
11,787,976
Issue date
Oct 17, 2023
Dexerials Corporation
Seiichiro Shinohara
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Anisotropic conductive film and method of producing the same
Patent number
11,784,154
Issue date
Oct 10, 2023
Dexerials Corporation
Seiichiro Shinohara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for wavelength conversion using layers of different photo...
Patent number
11,765,477
Issue date
Sep 19, 2023
Sony Group Corporation
Atsushi Toda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module
Patent number
11,721,670
Issue date
Aug 8, 2023
Mitsubishi Electric Corporation
Takashi Tsubakidani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Layered bonding material, semiconductor package, and power module
Patent number
11,712,760
Issue date
Aug 1, 2023
Senju Metal Industry Co., Ltd.
Naoto Kameda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Anisotropic conductive film and method of producing the same
Patent number
11,710,716
Issue date
Jul 25, 2023
Dexerials Corporation
Seiichiro Shinohara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and display device using the same
Patent number
11,683,963
Issue date
Jun 20, 2023
SAMSUNG DISPLAY CO., LTD.
Chungseok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive bonding composition and method of use
Patent number
11,648,750
Issue date
May 16, 2023
Immunolight, LLC
Zakaryae Fathi
B32 - LAYERED PRODUCTS
Information
Patent Grant
Electronic device, electronic module and methods for fabricating th...
Patent number
11,615,963
Issue date
Mar 28, 2023
Infineon Technologies AG
Paul Frank
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diffusion soldering with contaminant protection
Patent number
11,610,861
Issue date
Mar 21, 2023
Infineon Technologies Austria AG
Victor Verdugo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Adhesive member and display device including the same
Patent number
11,545,461
Issue date
Jan 3, 2023
Samsung Display Co., Ltd.
Hong Am Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembly
Patent number
11,508,694
Issue date
Nov 22, 2022
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure having antenna module
Patent number
11,508,675
Issue date
Nov 22, 2022
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back side metallization
Patent number
11,488,922
Issue date
Nov 1, 2022
Advanced Micro Devices, Inc.
Thomas P. Dolbear
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
High-dielectric adhesive film
Patent number
11,485,879
Issue date
Nov 1, 2022
ICH Co., Ltd.
Young Hun Kim
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Silver nano-twinned thin film structure and method for forming the...
Patent number
11,488,920
Issue date
Nov 1, 2022
AG MATERIALS TECHNOLOGY CO., LTD.
Hsing-Hua Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and method of producing the same
Patent number
11,404,391
Issue date
Aug 2, 2022
Dexerials Corporation
Seiichiro Shinohara
B32 - LAYERED PRODUCTS
Information
Patent Grant
Composite and multilayered silver films for joining electrical and...
Patent number
11,390,054
Issue date
Jul 19, 2022
Alpha Assembly Solutions Inc.
Oscar Khaselev
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Protective elements for bonded structures
Patent number
11,373,963
Issue date
Jun 28, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Javier A. DeLaCruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silver-indium transient liquid phase method of bonding semiconducto...
Patent number
11,373,925
Issue date
Jun 28, 2022
LIGHT-MED (USA), INC.
Yongjun Huo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device Having a Layer Stack, Semiconductor Arrangemen...
Publication number
20240128226
Publication date
Apr 18, 2024
Infineon Technologies Austria AG
Paul Frank
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
Publication number
20240128224
Publication date
Apr 18, 2024
SAMSUNG DISPLAY CO., LTD.
Jung Hoon SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REFLECTORS FOR SUPPORT STRUCTURES IN LIGHT-EMITTING DIODE PACKAGES
Publication number
20240120452
Publication date
Apr 11, 2024
CreeLED, Inc.
Derek Miller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240113066
Publication date
Apr 4, 2024
Sony Semiconductor Solutions Corporation
Takashi IMAHIGASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
Publication number
20240105670
Publication date
Mar 28, 2024
CYNTEC CO., LTD.
Chi-Hung Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
Publication number
20240096823
Publication date
Mar 21, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Javier A. DeLaCruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
Publication number
20240096838
Publication date
Mar 21, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Chu-Chin HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
Publication number
20240088087
Publication date
Mar 14, 2024
INFINEON TECHNOLOGIES AG
Alexander HEINRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
Publication number
20240063165
Publication date
Feb 22, 2024
Micron Technology, Inc.
Ramesh NALLAVELLI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20240038711
Publication date
Feb 1, 2024
DENSO CORPORATION
TERUAKI KUMAZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240038626
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Fung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
Publication number
20230412941
Publication date
Dec 21, 2023
SONY GROUP CORPORATION
Atsushi TODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING MEMBER FOR SEMICONDUCTOR DEVICE
Publication number
20230395550
Publication date
Dec 7, 2023
SUPERUFO291 TEC
Akira FUKUI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230387062
Publication date
Nov 30, 2023
Fuji Electric Co., Ltd.
Fumihiko MOMOSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
Publication number
20230326897
Publication date
Oct 12, 2023
Wolfspeed, Inc.
Daniel Richter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
Publication number
20230307407
Publication date
Sep 28, 2023
Tohru YASHIRO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
Publication number
20230299026
Publication date
Sep 21, 2023
Magnachip Semiconductor, Ltd.
Myungho PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Protective Layer
Publication number
20230260949
Publication date
Aug 17, 2023
Western Digital Technologies, Inc.
Joyce Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
Publication number
20230191747
Publication date
Jun 22, 2023
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEIGHT ADAPTABLE MULTILAYER SPACER
Publication number
20230197665
Publication date
Jun 22, 2023
Heraeus Deutschland GmbH & Co. KG
Andreas HINRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...
Publication number
20230178509
Publication date
Jun 8, 2023
AMOSENSE CO., LTD.
Younghwan JUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL
Publication number
20230112531
Publication date
Apr 13, 2023
AU OPTRONICS CORPORATION
Yang-En Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
Publication number
20230100980
Publication date
Mar 30, 2023
SAMSUNG DISPLAY CO., LTD.
Hong Am KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
Publication number
20230090030
Publication date
Mar 23, 2023
AG MATERIALS TECHNOLOGY CO., LTD.
Tung-Han CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...
Publication number
20230054798
Publication date
Feb 23, 2023
Mitsubishi Electric Corporation
Takashi IJIMA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
Publication number
20230053037
Publication date
Feb 16, 2023
SAMSUNG DISPLAY CO., LTD.
Jin Woo CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
Publication number
20230017846
Publication date
Jan 19, 2023
Changxin Memory Technologies, Inc.
Ling-Yi CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING SHEET AND BONDED STRUCTURE
Publication number
20230005871
Publication date
Jan 5, 2023
Mitsui Mining and Smelting Co., Ltd.
Kei ANAI
B32 - LAYERED PRODUCTS
Information
Patent Application
LIQUID METAL THERMAL INTERFACE
Publication number
20220375817
Publication date
Nov 24, 2022
Indium Corporation
Ross B. Berntson
H01 - BASIC ELECTRIC ELEMENTS