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H01L2224/0558

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0558being stacked

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,341,105
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip having pads of di...
- Patent number 12,315,818
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding pads and methods of forming the same
- Patent number 12,300,644
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 12,278,199
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and semiconductor device
- Patent number 12,224,256
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode display panel and manufacturing method t...
- Patent number 12,224,274
- Issue date Feb 11, 2025
- BOE Technology Group Co., Ltd.
- Yuju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad fabrication process for a semiconductor product
- Patent number 12,170,256
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Sudtida Lavangkul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,059
- Issue date Oct 1, 2024
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with increased thickness for metal pads
- Patent number 12,057,418
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Shu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 12,057,479
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation and corrosion prevention in semiconductor devices and sem...
- Patent number 12,051,661
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 12,021,066
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,996,433
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection between component parts, and comp...
- Patent number 11,961,820
- Issue date Apr 16, 2024
- OSRAM OLED GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having pixels with the same active layer and method...
- Patent number 11,942,025
- Issue date Mar 26, 2024
- Samsung Display Co., Ltd.
- Jin Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced bump height variation
- Patent number 11,935,866
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,916,029
- Issue date Feb 27, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,894,306
- Issue date Feb 6, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip including a passivation nitride layer in co...
- Patent number 11,887,948
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Simone Dario Mariani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20250218990
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201742
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192081
- Publication date Jun 12, 2025
- REALTEK SEMICONDUCTOR CORPORATION
- Wen Cheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167104
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157966
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Keisuke IZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF STACKED CHIPS
- Publication number 20250149526
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonjung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149481
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES
- Publication number 20250140718
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jose Arvin M. PLOMANTES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20250132260
- Publication date Apr 24, 2025
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
3D Multichip Package
- Publication number 20250105238
- Publication date Mar 27, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250054885
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250054892
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250044510
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022823
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250022821
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Hirofumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NITRIDE SEMICONDUCTOR MODULE
- Publication number 20240413235
- Publication date Dec 12, 2024
- Rohm Co., Ltd.
- Hirotaka Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...
- Publication number 20240387425
- Publication date Nov 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240379566
- Publication date Nov 14, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS
- Publication number 20240363563
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Shu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS
- Publication number 20240363570
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363572
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Akinori NII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
- Publication number 20240355886
- Publication date Oct 24, 2024
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS

being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Interconnection structure of a semiconductor chip having pads of di...

Semiconductor package

Die bonding pads and methods of forming the same

Semiconductor packages and methods of forming same

Conductive bump of a semiconductor device and fabricating method th...

Bond pads for semiconductor die assemblies and associated methods a...

Wafer structure and semiconductor device

Micro light-emitting diode display panel and manufacturing method t...

Semiconductor device

Contact pad fabrication process for a semiconductor product

Semiconductor wafer and method of ball drop on thin wafer with edge...

Method of fabricating a semiconductor device

Display device and method for fabricating the same

Semiconductor package and manufacturing method thereof

Semiconductor structure and method for forming semiconductor struct...

Chip package

Passivation structure with increased thickness for metal pads

Semiconductor device having a junction portion contacting a Schottk...

Oxidation and corrosion prevention in semiconductor devices and sem...

Packaged semiconductor device with electroplated pillars

Buffer layer(s) on a stacked structure having a via

Semiconductor product with interlocking metal-to-metal bonds and me...

Pad structure for front side illuminated image sensor

Method for producing a connection between component parts, and comp...

Display device having pixels with the same active layer and method...

Semiconductor device having reduced bump height variation

Semiconductor device

Chip package

Integrated circuit chip including a passivation nitride layer in co...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Semiconductor Packages and Methods of Forming Same

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF STACKED CHIPS

SEMICONDUCTOR PACKAGE

DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES

CHIP PACKAGE

3D Multichip Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

NITRIDE SEMICONDUCTOR MODULE

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...

CHIP PACKAGE

PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS

INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...